The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | RAM Size | Clock Frequency | Propagation Delay | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Number of Logic Blocks (LABs) | Speed Grade | Output Function | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Dedicated Inputs | Number of Equivalent Gates | Height | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status |
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 | Mfr Part No XC4VLX40-10FF1148I | Xilinx Inc. | Datasheet | 613 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | Surface Mount | 1148-BBGA, FCBGA | 640 | -40°C~100°C TJ | Tray | 1999 | Virtex®-4 LX | e0 | no | Active | 4 (72 Hours) | 3A991.D | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | 1.14V~1.26V | BOTTOM | BALL | 225 | 1.2V | 1mm | 30 | XC4VLX40 | S-PBGA-B1148 | 640 | Not Qualified | 1.2V | 216kB | 640 | FIELD PROGRAMMABLE GATE ARRAY | 41472 | 1769472 | 4608 | 10 | 3.4mm | 35mm | 35mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC3S700A-4FT256C | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256 | 161 | e0 | 3 (168 Hours) | 256 | EAR99 | Tin/Lead (Sn63Pb37) | 85°C | 0°C | BOTTOM | BALL | 240 | 1.2V | 1mm | 30 | 256 | 148 | Not Qualified | 1.2V | 1.26V | 1.21.2/3.33.3V | OTHER | 45kB | 667MHz | FIELD PROGRAMMABLE GATE ARRAY | 13248 | 700000 | 1472 | 4 | 0.71 ns | 1.55mm | 17mm | 17mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No EP20K400EBC652-3N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 652-BGA | YES | 488 | 0°C~85°C TJ | Tray | APEX-20KE® | e1 | Obsolete | 3 (168 Hours) | 652 | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.71V~1.89V | BOTTOM | BALL | 245 | 1.8V | 1.27mm | compliant | 40 | EP20K400 | S-PBGA-B652 | 480 | Not Qualified | 1.81.8/3.3V | 2.07 ns | 480 | LOADABLE PLD | 16640 | 212992 | 1052000 | 1664 | MACROCELL | 4 | 3.5mm | 45mm | 45mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No EP1S40F780C6N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 780-BBGA, FCBGA | YES | 615 | 0°C~85°C TJ | Tray | Stratix® | e1 | Obsolete | 3 (168 Hours) | 780 | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 245 | 1.5V | 1mm | compliant | 40 | EP1S40 | S-PBGA-B780 | 822 | Not Qualified | 1.51.5/3.3V | 822 | 4697 CLBS | FIELD PROGRAMMABLE GATE ARRAY | 41250 | 3423744 | 4125 | 4697 | 3.5mm | 29mm | 29mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No EP1C3T100C6N | Intel | Datasheet | 293 | - | Min: 1 Mult: 1 | Surface Mount | 100-TQFP | YES | 65 | 0°C~85°C TJ | Tray | Cyclone® | e3 | Obsolete | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | 1.425V~1.575V | QUAD | GULL WING | 260 | 1.5V | 0.5mm | compliant | 40 | EP1C3 | S-PQFP-G100 | 104 | Not Qualified | 1.51.5/3.3V | 405MHz | 104 | FIELD PROGRAMMABLE GATE ARRAY | 2910 | 59904 | 291 | 1.2mm | 14mm | 14mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No EP1K100FC484-2N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 484-BBGA | YES | 333 | 0°C~70°C TA | Tray | ACEX-1K® | e1 | Obsolete | 3 (168 Hours) | 484 | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 2.375V~2.625V | BOTTOM | BALL | 260 | 2.5V | 1mm | compliant | 40 | EP1K100 | S-PBGA-B484 | 333 | Not Qualified | 2.52.5/3.3V | 37.5MHz | 0.5 ns | 333 | LOADABLE PLD | 4992 | 49152 | 257000 | 624 | MIXED | 2.1mm | 23mm | 23mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL1000V5-FG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | AGL1000 | 108 MHz | 60 | MICROSEMI CORP | AGL1000V5-FG484 | 892.86 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 300 I/O | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.26 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | IGLOOe | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | AGL1000V5 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B484 | Not Qualified | 1.5 V | OTHER | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1000000 | STD | 24576 | 1000000 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000L-1FGG144 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | A3P1000 | 350 MHz | 160 | MICROSEMI CORP | A3P1000L-1FGG144 | 892.86 MHz | 1.26 V | + 70 C | Microchip Technology | 1.14 V | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 11000 LE | 70 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA144,12X12,40 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 1.2000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P1000L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | 97 | Not Qualified | 1.2 V | 1.5/3.3 V | COMMERCIAL | 97 | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 1 | 24576 | 24576 | 1000000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000L-FG144 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | A3P1000 | 350 MHz | 160 | MICROSEMI CORP | A3P1000L-FG144 | 781.25 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 11000 LE | 70 °C | Tray | PLASTIC/EPOXY | LBGA | 13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3P1000L | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | 97 | Not Qualified | 1.2 V | 1.5/3.3 V | COMMERCIAL | 97 | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 24576 | 24576 | 1000000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000L-1FGG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | A3P1000 | 350 MHz | 90 | MICROSEMI CORP | A3P1000L-1FGG256 | 892.86 MHz | 1.26 V | + 70 C | Microchip Technology | 1.14 V | 0 C | Yes | 3 | SMD/SMT | 177 I/O | 11000 LE | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 1.2000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P1000L | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | 177 | Not Qualified | 1.2 V | 1.5/3.3 V | COMMERCIAL | 177 | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 1 | 24576 | 24576 | 1000000 | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P400-2FG144 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | A3P400 | 350 MHz | 160 | MICROSEMI CORP | A3P400-2FG144 | 310 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P400 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | COMMERCIAL | 9216 CLBS, 400000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 2 | 9216 | 400000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL050-1VFG400I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | 400-LFBGA | 400 | 400-VFBGA (17x17) | M2GL050 | 90 | Microchip Technology | Yes | 207 | Tray | Active | N | This product may require additional documentation to export from the United States. | IGLOO2 | -40°C ~ 100°C (TJ) | Tray | M2GL050 | 100 °C | -40 °C | 1.14V ~ 2.625V | 228.3 kB | 56340 | 1869824 | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL060-1FCSG325 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | M2GL060 | 176 | MICROSEMI CORP | M2GL060-1FCSG325 | + 85 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 200 I/O | 56520 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | 11 X 11 MM, 0.50 MM PITCH, ROHS COMPLIANT, FBGA-325 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.26 | Details | Yes | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL060 | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | compliant | S-PBGA-B325 | 1.2 V | OTHER | FIELD PROGRAMMABLE GATE ARRAY | 56520 | 1869824 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No P1AFS600-2FGG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 484-BGA | 484-FPBGA (23x23) | P1AFS600 | 60 | Microchip Technology | Yes | 172 | Tray | Active | N | This product may require additional documentation to export from the United States. | Fusion | 0°C ~ 85°C (TJ) | Tray | P1AFS600 | 1.425V ~ 1.575V | 110592 | 600000 | 2 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No U1AFS250-FGG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | U1AFS250 | 90 | MICROSEMI CORP | U1AFS250-FGG256 | 1.575 V | Microchip Technology | 1.425 V | Yes | 3 | 114 | 70 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 1.5000 V | 0 to 70 °C | Tray | U1AFS250 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | COMMERCIAL | 6144 CLBS, 250000 GATES | 1.68 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | STD | 6144 | 250000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000L-1FG144 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | A3P1000 | 350 MHz | 160 | MICROSEMI CORP | A3P1000L-1FG144 | 892.86 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 11000 LE | 70 °C | Tray | PLASTIC/EPOXY | LBGA | 13 X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | BGA144,12X12,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 1.2000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P1000L | e0 | TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | 97 | Not Qualified | 1.2 V | 1.5/3.3 V | COMMERCIAL | 97 | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 1 | 24576 | 24576 | 1000000 | 1.05 mm | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P600L-1FG484I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1A3P600 | 350 MHz | 60 | MICROSEMI CORP | M1A3P600L-1FG484I | 892.86 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 235 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.23 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 1.2000 V | 0.014110 oz | -40 to 85 °C | Tray | M1A3P600L | e0 | TIN LEAD | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 235 | Not Qualified | 1.2 V | 1.5/3.3 V | INDUSTRIAL | 235 | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1 | 13824 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No AFS250-2FG256I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | AFS250 | 90 | MICROSEMI CORP | AFS250-2FG256I | 1470.59 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 114 I/O | 3000 LE | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | AFS250 | 3A001.A.7.A | TIN LEAD/TIN LEAD SILVER | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 4.5 kB | 6144 CLBS, 250000 GATES | 1.68 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 1.47059 GHz | 2 | 6144 | 6144 | 250000 | 1.2 mm | 17 mm | 17 mm | No | |||||||||||||||||||||||||||||||||
| Mfr Part No A40MX04-3VQG80I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | VQFP | YES | 80-VQFP (14x14) | 80 | A40MX04 | 109 MHz | 90 | MICROSEMI CORP | A40MX04-3VQG80I | 188 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 69 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | TQFP | 1 MM HEIGHT, ROHS COMPLIANT, PLASTIC, VQFP-80 | SQUARE | FLATPACK, THIN PROFILE | Active | Active | 40 | 5.3 | Details | Yes | 5.5 V | 3 V | 3.3 V | Actel | -40°C ~ 85°C (TA) | Tray | A40MX04 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 260 | 0.65 mm | compliant | S-PQFP-G80 | Not Qualified | 3.3 V, 5 V | INDUSTRIAL | 547 CLBS, 6000 GATES | 1.2 mm | FIELD PROGRAMMABLE GATE ARRAY | 6000 | 1.7 ns | 547 | 6000 | 1 mm | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P600-2PQG208 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PQFP-208 | YES | 208-PQFP (28x28) | 208 | M1A3P600 | 350 MHz | 24 | MICROSEMI CORP | M1A3P600-2PQG208 | 310 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 154 I/O | 85 °C | Tray | PLASTIC/EPOXY | FQFP | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0 to 70 °C | Tray | M1A3P600 | e3 | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | Not Qualified | 1.5 V | COMMERCIAL | 13824 CLBS, 600000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 2 | 13824 | 600000 | 3.4 mm | 28 mm | 28 mm |
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XC4VLX40-10FF1148I
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XC3S700A-4FT256C
Xilinx
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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EP20K400EBC652-3N
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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EP1S40F780C6N
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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EP1C3T100C6N
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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EP1K100FC484-2N
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AGL1000V5-FG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P1000L-1FGG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P1000L-FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P1000L-1FGG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P400-2FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL050-1VFG400I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL060-1FCSG325
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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P1AFS600-2FGG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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U1AFS250-FGG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P1000L-1FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P600L-1FG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AFS250-2FG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A40MX04-3VQG80I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P600-2PQG208
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire