The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Clock Frequency-Max | Device Logic Gates | Device System Gates | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Number of User I/Os | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | RAM Size | Clock Frequency | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Number of LABs/CLBs | Screening Level | Speed Grade | Output Function | Number of Transceivers | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Dedicated Inputs | Number of Equivalent Gates | Height | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status |
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 | Mfr Part No M1A3P600-1FGG484I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1A3P600 | 60 | MICROSEMI CORP | M1A3P600-1FGG484I | 272 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 235 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | M1A3P600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | INDUSTRIAL | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1 | 13824 | 600000 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P250-1PQG208 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PQFP-208 | YES | 208-PQFP (28x28) | 208 | M1A3P250 | 350 MHz | 24 | MICROSEMI CORP | M1A3P250-1PQG208 | 272 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 151 I/O | 85 °C | Tray | PLASTIC/EPOXY | FQFP | 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.24 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0 to 70 °C | Tray | M1A3P250 | e3 | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | Not Qualified | 1.5 V | COMMERCIAL | 6144 CLBS, 250000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 1 | 6144 | 250000 | 3.4 mm | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A40MX02-PLG68A | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PLCC-68 | YES | 68-PLCC (24.23x24.23) | 68 | A40MX02 | 116 MHz | 19 | MICROSEMI CORP | A40MX02-PLG68A | 120 MHz | + 125 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 57 I/O | 125 °C | -40 °C | Tray | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Active | Active | 40 | 5.59 | Details | Yes | 5.25 V | 4.75 V | 5 V | Actel | 0.171777 oz | -40°C ~ 125°C (TA) | Tube | A40MX02 | e3 | Matte Tin (Sn) | CAN ALSO BE OPERATED AT 5.0V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J68 | Not Qualified | 5 V | AUTOMOTIVE | 295 CLBS, 3000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 3000 | STD | 2.2 ns | 295 | 3000 | 3.68 mm | 24.23 mm | 24.23 mm | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AGL1000V2-FG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FPBGA-256 | YES | 256 | 256-FPBGA (17x17) | 256 | M1AGL1000 | 108 MHz | 90 | MICROSEMI CORP | M1AGL1000V2-FG256 | Microchip Technology | Yes | 3 | SMD/SMT | 177 | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 0°C ~ 70°C (TA) | Tray | M1AGL1000V2 | TIN LEAD/TIN LEAD SILVER | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | OTHER | 18 kB | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1e+06 | 24576 | 1000000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P1000-2FG144 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | A3P1000 | 350 MHz | 160 | MICROSEMI CORP | A3P1000-2FG144 | 310 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | A3P1000 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | COMMERCIAL | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 2 | 24576 | 1000000 | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AFS600-1FGG256I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | M1AFS600 | 90 | MICROSEMI CORP | M1AFS600-1FGG256I | 1282.05 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 119 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | FBGA-256 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | M1AFS600 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 600000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1 | 600000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P600-2FG256I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | M1A3P600 | 600000 | 600000 | 90 | MICROSEMI CORP | M1A3P600-2FG256I | 177 | 310 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | Surface Mount | SMD/SMT | 177 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | FBGA | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | Industrial grade | -40 to 85 °C | Tray | M1A3P600 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | 256 | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | Industrial | 2 | 13824 | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL050T-FCS325 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2GL050 | 176 | MICROSEMI CORP | M2GL050T-FCS325 | Microchip Technology | Yes | 200 | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA325,21X21,20 | BGA325,21X21,20 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL050T | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | compliant | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | OTHER | 200 | FIELD PROGRAMMABLE GATE ARRAY | 56340 | 1869824 | 56340 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGL1000V2-FG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | AGL1000 | 108 MHz | 60 | MICROSEMI CORP | AGL1000V2-FG484 | 526.32 MHz, 892.86 MHz | 1.575 V | + 70 C | Microchip Technology | 1.14 V | 0 C | Yes | 3 | SMD/SMT | 300 I/O | 11000 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.26 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 1.2, 1.5 V | 0.014110 oz | 0 to 70 °C | Tray | AGL1000V2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | S-PBGA-B484 | Not Qualified | 1.2 V to 1.5 V | OTHER | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1000000 | STD | 24576 | 1000000 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A40MX04-2PQG100 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PQFP-100 | YES | 100-PQFP (20x14) | 100 | A40MX04 | 101 MHz | 66 | MICROSEMI CORP | A40MX04-2PQG100 | 175 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 69 I/O | 70 °C | Tray | PLASTIC/EPOXY | QFP | ROHS COMPLIANT, PLASTIC, QFP-100 | RECTANGULAR | FLATPACK | Active | Active | 40 | 5.3 | Details | Yes | 5.25 V | 3 V | 3.3 V | Actel | 0.062040 oz | 0°C ~ 70°C (TA) | Tray | A40MX04 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | GULL WING | 245 | 0.65 mm | compliant | R-PQFP-G100 | Not Qualified | 3.3 V, 5 V | COMMERCIAL | 547 CLBS, 6000 GATES | 3.4 mm | FIELD PROGRAMMABLE GATE ARRAY | 6000 | 2 ns | 547 | 6000 | 2.7 mm | 20 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3PE600-2FGG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | 484-FPBGA (23x23) | A3PE600 | 60 | 310 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 270 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3PE600 | 1.425V ~ 1.575V | 1.5 V | 110592 | 600000 | 2 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL090T-FG676 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | FPBGA-676 | YES | 676-FBGA (27x27) | 676 | M2GL090 | 40 | MICROSEMI CORP | M2GL090T-FG676 | + 85 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 425 I/O | 86184 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | N | No | This product may require additional documentation to export from the United States. | 1.2 V | 1.2 V | 1.2 V | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL090T | 85 °C | 0 °C | 8542.39.00.01 | CMOS | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 1 mm | compliant | S-PBGA-B676 | 425 | Not Qualified | 1.2 V | 1.2 V | OTHER | 323.3 kB | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 86316 | 2648064 | 4 Transceiver | 86316 | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AGL600V2-CS281 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 281-TFBGA, CSBGA | YES | 281 | 281-CSP (10x10) | 281 | M1AGL600 | 108 MHz | 184 | MICROSEMI CORP | M1AGL600V2-CS281 | Microchip Technology | Yes | 215 | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | 10 X 10 MM, 1.05 MM HEIGHT, 0.50 MM PITCH, CSP-281 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 20 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.5 V | 1.2 V | 1.2 V | IGLOOe | 0°C ~ 70°C (TA) | Tray | M1AGL600V2 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 235 | 0.5 mm | compliant | S-PBGA-B281 | Not Qualified | 1.2 V to 1.5 V | OTHER | 13.5 kB | 13824 CLBS, 600000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | 13824 | 600000 | 10 mm | 10 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P250-2PQG208 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PQFP-208 | YES | 208-PQFP (28x28) | 208 | M1A3P250 | 350 MHz | 24 | MICROSEMI CORP | M1A3P250-2PQG208 | 310 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 151 I/O | 85 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.24 | Details | Yes | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0 to 70 °C | Tray | M1A3P250 | e3 | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | Not Qualified | 1.5 V | COMMERCIAL | 6144 CLBS, 250000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | 2 | 6144 | 250000 | 3.4 mm | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No EP2C8F256C7 | Intel | Datasheet | 388 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 256-LBGA | YES | 182 | 0°C~85°C TJ | Tray | Cyclone® II | e0 | Active | 3 (168 Hours) | 256 | EAR99 | Tin/Lead (Sn/Pb) | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | 1.15V~1.25V | BOTTOM | BALL | 220 | 1.2V | 1mm | 30 | EP2C8 | S-PBGA-B256 | 174 | Not Qualified | 1.21.5/3.33.3V | 450MHz | 182 | FIELD PROGRAMMABLE GATE ARRAY | 8256 | 165888 | 516 | 516 | 1.55mm | 17mm | 17mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC5VSX95T-1FF1136C | Xilinx Inc. | Datasheet | 4 | - | Min: 1 Mult: 1 | 11 Weeks | Surface Mount | Surface Mount | 1136-BBGA, FCBGA | 1136 | 640 | 0°C~85°C TJ | Tray | 1999 | Virtex®-5 SXT | e0 | no | Active | 4 (72 Hours) | Tin/Lead (Sn63Pb37) | 0.95V~1.05V | BOTTOM | BALL | 225 | 1V | not_compliant | 30 | XC5VSX95T | 640 | Not Qualified | 1V | 1.1MB | FIELD PROGRAMMABLE GATE ARRAY | 94208 | 8994816 | 7360 | 1 | 3.4mm | 35mm | 35mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC2V1000-4FF896I | Xilinx Inc. | Datasheet | 14 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 896-BBGA, FCBGA | 896 | 432 | -40°C~100°C TJ | Tray | 2007 | Virtex®-II | e0 | no | Obsolete | 4 (72 Hours) | 896 | 3A991.D | Tin/Lead (Sn63Pb37) | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | XC2V1000 | 896 | 432 | 1.5V | 1.51.5/3.33.3V | 90kB | 650MHz | FIELD PROGRAMMABLE GATE ARRAY | 737280 | 1000000 | 1280 | 4 | 10240 | 11520 | 31mm | 31mm | No | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No EP1S60F1508C6N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 1508-BBGA, FCBGA | YES | 1022 | 0°C~85°C TJ | Tray | Stratix® | e1 | Obsolete | 3 (168 Hours) | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 245 | 1.5V | 1mm | compliant | 40 | EP1S60 | S-PBGA-B1508 | Not Qualified | 1.51.5/3.3V | 6570 CLBS | FIELD PROGRAMMABLE GATE ARRAY | 57120 | 5215104 | 5712 | 6570 | 3.5mm | 40mm | 40mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No EP2C50U484C7N | Intel | Datasheet | 244 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 484-FBGA | YES | 294 | 0°C~85°C TJ | Tray | Cyclone® II | e1 | Active | 3 (168 Hours) | 484 | 3A991 | TIN SILVER COPPER | ALSO REQUIRES 3.3 SUPPLY | 8542.39.00.01 | 1.15V~1.25V | BOTTOM | BALL | 260 | 1.2V | 0.8mm | 40 | EP2C50 | S-PBGA-B484 | 278 | Not Qualified | 1.21.5/3.33.3V | 450MHz | 294 | FIELD PROGRAMMABLE GATE ARRAY | 50528 | 594432 | 3158 | 2.2mm | 19mm | 19mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No EPF6024ATC144-2 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 144-LQFP | YES | 117 | 0°C~85°C TJ | Tray | FLEX 6000 | e0 | Obsolete | 3 (168 Hours) | 144 | 3A991 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 3V~3.6V | QUAD | GULL WING | 220 | 3.3V | 0.5mm | compliant | 30 | EPF6024 | S-PQFP-G144 | 117 | Not Qualified | 2.5/3.33.3V | 153MHz | 117 | LOADABLE PLD | 1960 | 24000 | 196 | MACROCELL | 4 | 1.6mm | 20mm | 20mm | Non-RoHS Compliant |
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M1A3P600-1FGG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P250-1PQG208
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A40MX02-PLG68A
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AGL1000V2-FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P1000-2FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AFS600-1FGG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P600-2FG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL050T-FCS325
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AGL1000V2-FG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A40MX04-2PQG100
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3PE600-2FGG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL090T-FG676
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AGL600V2-CS281
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P250-2PQG208
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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EP2C8F256C7
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XC5VSX95T-1FF1136C
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XC2V1000-4FF896I
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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EP1S60F1508C6N
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
EP2C50U484C7N
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
-
EPF6024ATC144-2
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire