The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Total Memory | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | RAM Size | Clock Frequency | Propagation Delay | Data Rate | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Density | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Speed Grade | Output Function | Number of Macro Cells | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Equivalent Gates | Height | Height Seated (Max) | Length | Width | Radiation Hardening | REACH SVHC | RoHS Status | Lead Free |
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 | Mfr Part No EPF10K200SRC240-3 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 240-BFQFP Exposed Pad | YES | 182 | 0°C~70°C TA | Tray | FLEX-10KS® | e0 | Obsolete | 3 (168 Hours) | 240 | 3A991 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 2.375V~2.625V | QUAD | GULL WING | 220 | 2.5V | 0.5mm | compliant | 30 | EPF10K200 | S-PQFP-G240 | 182 | Not Qualified | 2.52.5/3.3V | 0.8 ns | 182 | LOADABLE PLD | 9984 | 98304 | 513000 | 1248 | MIXED | 4.1mm | 32mm | 32mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC4005XL-1VQ100C | Xilinx Inc. | Datasheet | 142 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 100-TQFP | 100 | 77 | 0°C~85°C TJ | Tray | 1999 | XC4000E/X | e0 | Obsolete | 3 (168 Hours) | 100 | TIN LEAD | 3V~3.6V | QUAD | GULL WING | 225 | 3.3V | 0.5mm | 30 | XC4005XL | 100 | 112 | 3.3V | 784B | 200MHz | FIELD PROGRAMMABLE GATE ARRAY | 466 | 6272 | 5000 | 196 | 1 | 616 | 196 | 196 | 3000 | No | Non-RoHS Compliant | Contains Lead | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC4VFX40-11FF672I | Xilinx Inc. | Datasheet | 682 |
| Min: 1 Mult: 1 | 10 Weeks | Surface Mount | Surface Mount | 672-BBGA, FCBGA | 672 | 352 | -40°C~100°C TJ | Tray | 1999 | Virtex®-4 FX | e0 | no | Active | 4 (72 Hours) | 672 | 3A991.D | Tin/Lead (Sn63Pb37) | 8542.39.00.01 | 1.14V~1.26V | BOTTOM | BALL | 225 | 1.2V | 1mm | 30 | XC4VFX40 | 672 | 352 | Not Qualified | 1.2V | 324kB | FIELD PROGRAMMABLE GATE ARRAY | 41904 | 2654208 | 4656 | 11 | 3mm | 27mm | 27mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LFE2-6E-7FN256C | Lattice Semiconductor Corporation | Datasheet | 27 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | Surface Mount | 256-BGA | 256 | 190 | 0°C~85°C TJ | Tray | 2008 | ECP2 | e1 | yes | Active | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 1.14V~1.26V | BOTTOM | BALL | 250 | 1.2V | 1mm | not_compliant | 30 | LFE2-6 | 256 | 190 | Not Qualified | 1.2V | 8.4kB | 11.5kB | 420MHz | FIELD PROGRAMMABLE GATE ARRAY | 6000 | 56320 | 750 | 0.304 ns | 2.1mm | 17mm | 17mm | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LCMXO2-2000ZE-1TG100C | Lattice Semiconductor Corporation | Datasheet | 8 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | Surface Mount | 100-LQFP | 100 | FLASH | 79 | 0°C~85°C TJ | Tray | 2012 | MachXO2 | yes | Active | 3 (168 Hours) | 100 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | 1.14V~1.26V | QUAD | GULL WING | 260 | 1.2V | 0.5mm | 104MHz | 30 | LCMXO2-2000 | 80 | Not Qualified | 1.2V | 21.3kB | 80μA | 9.3kB | 10.21 ns | FIELD PROGRAMMABLE GATE ARRAY | 2112 | 74 kb | 75776 | 264 | 1056 | 1.6mm | 14mm | 14mm | No SVHC | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 5SGXEA7K2F40I2LN | Intel | Datasheet | 37 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 1517-BBGA, FCBGA | YES | 696 | -40°C~100°C TJ | Tray | Stratix® V GX | Active | 3 (168 Hours) | 8542.39.00.01 | 0.82V~0.88V | BOTTOM | BALL | 0.85V | 1mm | 5SGXEA7 | S-PBGA-B1517 | 696 | Not Qualified | 0.851.52.52.5/31.2/3V | 696 | 23472 CLBS | FIELD PROGRAMMABLE GATE ARRAY | 622000 | 51200000 | 234720 | 3.5mm | 40mm | 40mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M1A3PE3000-FG484I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1A3PE3000 | 350 MHz | 60 | MICROSEMI CORP | M1A3PE3000-FG484I | 231 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 341 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | M1A3PE3000 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.5/3.3 V | INDUSTRIAL | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | STD | 75264 | 75264 | 3000000 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AFS600-FG256I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Lead, Silver, Tin | Surface Mount | Surface Mount | FPBGA-256 | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | AFS600 | 90 | MICROSEMI CORP | AFS600-FG256I | 1098.9 MHz | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 119 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 1.73 | N | No | 8542310000, 8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000 | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | AFS600 | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | 1.0989 GHz | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 600000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1.0989 GHz | STD | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | No | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P400-2FGG256I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-256 | YES | 256-FPBGA (17x17) | 256 | M1A3P400 | 90 | MICROSEMI CORP | M1A3P400-2FGG256I | 1.575 V | Microchip Technology | 1.425 V | Yes | 3 | SMD/SMT | 178 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | -40 to 85 °C | Tray | M1A3P400 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | INDUSTRIAL | 9216 CLBS, 400000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | STD | 9216 | 400000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P400-PQG208 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PQFP-208 | YES | 208-PQFP (28x28) | 208 | M1A3P400 | 350 MHz | 24 | MICROSEMI CORP | M1A3P400-PQG208 | 1.575 V | Microchip Technology | 1.425 V | Yes | 3 | SMD/SMT | 151 | 85 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0 to 85 °C | Tray | M1A3P400 | e3 | Matte Tin (Sn) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | Not Qualified | COMMERCIAL | 9216 CLBS, 400000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | STD | 9216 | 400000 | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE1500-2FG484I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1A3PE1500 | 350 MHz | 60 | MICROSEMI CORP | M1A3PE1500-2FG484I | 310 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 280 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | M1A3PE1500 | e0 | TIN LEAD | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 280 | Not Qualified | 1.5 V | 1.5/3.3 V | INDUSTRIAL | 280 | 38400 CLBS, 1500000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 2 | 38400 | 38400 | 1500000 | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P400-1FGG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-256 | YES | 256-FPBGA (17x17) | 256 | M1A3P400 | 350 MHz | 90 | MICROSEMI CORP | M1A3P400-1FGG256 | Microchip Technology | Yes | 3 | SMD/SMT | 178 | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | M1A3P400 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | COMMERCIAL | 9216 CLBS, 400000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 9216 | 400000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P400-1FGG144 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-144 | YES | 144-FPBGA (13x13) | 144 | M1A3P400 | 350 MHz | 160 | MICROSEMI CORP | M1A3P400-1FGG144 | Microchip Technology | Yes | 3 | SMD/SMT | 97 | 85 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | M1A3P400 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | COMMERCIAL | 9216 CLBS, 400000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 9216 | 400000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P400-1FG144 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-144 | YES | 144-FPBGA (13x13) | 144 | M1A3P400 | 350 MHz | 160 | MICROSEMI CORP | M1A3P400-1FG144 | Microchip Technology | Yes | 3 | SMD/SMT | 97 | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | M1A3P400 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | COMMERCIAL | 9216 CLBS, 400000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 9216 | 400000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P250-FG144 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | M1A3P250 | 350 MHz | 160 | MICROSEMI CORP | M1A3P250-FG144 | 231 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 97 I/O | 85 °C | Tray | PLASTIC/EPOXY | LBGA | 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | N | No | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | M1A3P250 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | COMMERCIAL | 6144 CLBS, 250000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 36864 | 250000 | STD | 6144 | 250000 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE3000L-1FG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1A3PE3000 | 350 MHz | 60 | MICROSEMI CORP | M1A3PE3000L-1FG484 | 892.86 MHz | 1.26 V | + 70 C | Microchip Technology | 1.14 V | 0 C | Yes | 3 | SMD/SMT | 341 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | ProASIC3 | 1.2000 V | 0.014110 oz | 0 to 70 °C | Tray | M1A3PE3000L | e0 | TIN LEAD | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | 341 | Not Qualified | 1.5 V | 1.5/3.3 V | COMMERCIAL | 341 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 1 | 75264 | 75264 | 3000000 | 1.73 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M7AFS600-FGG256I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | 256-FPBGA (17x17) | M7AFS600 | 90 | 1098.9 MHz | + 85 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 119 I/O | Tray | Active | Details | 1.575 V | 1.425 V | Fusion | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | M7AFS600 | 1.425V ~ 1.575V | 1.5 V | 110592 | 600000 | STD | 1.2 mm | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P1000-FG484I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 484-FPBGA (23x23) | 484 | M1A3P1000 | 350 MHz | 60 | MICROSEMI CORP | M1A3P1000-FG484I | 231 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 300 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 1.48 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | M1A3P1000 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B484 | Not Qualified | 1.5 V | INDUSTRIAL | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | STD | 24576 | 1000000 | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPF300TS-FCSG536I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | BGA-536 | 536-CSPBGA (16x16) | MPF300 | 1 | + 100 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 300 I/O | 300000 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.03 V/1.08 V | 970 mV/1.02 V | 20.6 Mbit | PolarFire | -40°C ~ 100°C (TJ) | Tray | MPF300TS | 0.97V ~ 1.08V | 1.05 V | 12.7 Gb/s | 300000 | 21094400 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL050TS-VFG400I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 400-LFBGA | 400-VFBGA (17x17) | M2GL050 | 90 | Microchip Technology | Yes | 207 | Tray | Active | Details | This product may require additional documentation to export from the United States. | IGLOO2 | -40°C ~ 100°C (TJ) | Tray | M2GL050TS | 1.14V ~ 2.625V | 56340 | 1869824 |
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EPF10K200SRC240-3
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XC4005XL-1VQ100C
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XC4VFX40-11FF672I
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
866.166233
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LFE2-6E-7FN256C
Lattice Semiconductor Corporation
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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LCMXO2-2000ZE-1TG100C
Lattice Semiconductor Corporation
Package:Embedded - FPGAs (Field Programmable Gate Array)
15.100468
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5SGXEA7K2F40I2LN
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3PE3000-FG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AFS600-FG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P400-2FGG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P400-PQG208
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3PE1500-2FG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P400-1FGG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P400-1FGG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P400-1FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P250-FG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3PE3000L-1FG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M7AFS600-FGG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P1000-FG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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MPF300TS-FCSG536I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL050TS-VFG400I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire