The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | Nominal Supply Current | RAM Size | Clock Frequency | Propagation Delay | Turn On Delay Time | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Speed Grade | Output Function | Number of Macro Cells | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Dedicated Inputs | Number of Equivalent Gates | Height | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
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 | Mfr Part No M7A3P1000-2FG144I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | FBGA | 144 | 144-FPBGA (13x13) | 400.011771 mg | M7A3P1000 | 160 | 310 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | SMD/SMT | 97 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | M7A3P1000 | 85 °C | -40 °C | 1.425V ~ 1.575V | 310 MHz | 1.5 V | 1.575 V | 1.425 V | 18 kB | 147456 | 1000000 | 310 MHz | 2 | 24576 | 1.05 mm | 13 mm | 13 mm | No | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A40MX04-1PLG68I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | PLCC-68 | YES | 68-PLCC (24.23x24.23) | 68 | A40MX04 | 48 MHz | 19 | MICROSEMI CORP | A40MX04-1PLG68I | 160 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 57 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | QCCJ | QCCJ, | SQUARE | CHIP CARRIER | Active | Active | 40 | 5.29 | Details | Yes | 5.5 V | 3 V | 3.3 V | Actel | 0.171777 oz | -40°C ~ 85°C (TA) | Tube | A40MX04 | e3 | Matte Tin (Sn) | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 245 | 1.27 mm | compliant | S-PQCC-J68 | Not Qualified | 3.3 V, 5 V | INDUSTRIAL | 547 CLBS, 6000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | 6000 | 2.3 ns | 547 | 6000 | 3.68 mm | 24.23 mm | 24.23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A3P600-1FG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | A3P600 | 350 MHz | 90 | MICROSEMI CORP | A3P600-1FG256 | 272 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 177 I/O | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | 0°C ~ 85°C (TJ) | Tray | A3P600 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | COMMERCIAL | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 110592 | 600000 | 1 | 13824 | 600000 | 1.2 mm | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P1000-FG144I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 144-FPBGA (13x13) | 144 | M1A3P1000 | 350 MHz | 160 | MICROSEMI CORP | M1A3P1000-FG144I | 231 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 97 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.23 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | M1A3P1000 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | INDUSTRIAL | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | STD | 24576 | 1000000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M7A3P1000-FG144I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | FBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | M7A3P1000 | 350 MHz | 160 | MICROSEMI CORP | M7A3P1000-FG144I | 231 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 97 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Not Recommended | Active | 30 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | M7A3P1000 | e0 | Tin/Lead/Silver (Sn/Pb/Ag) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B144 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 18 kB | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 231 MHz | STD | 24576 | 24576 | 1000000 | 1.05 mm | 13 mm | 13 mm | No | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P1000-2FG256 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 256-FPBGA (17x17) | 256 | M1A3P1000 | 350 MHz | 90 | MICROSEMI CORP | M1A3P1000-2FG256 | 310 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 177 I/O | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | M1A3P1000 | TIN LEAD/TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | COMMERCIAL | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 2 | 24576 | 1000000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M7A3P1000-FG484I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | FBGA | 484 | 484-FPBGA (23x23) | 400.011771 mg | M7A3P1000 | 60 | 231 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | SMD/SMT | 300 I/O | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | M7A3P1000 | 85 °C | -40 °C | 1.425V ~ 1.575V | 1.5 V | 1.575 V | 1.425 V | 18 kB | 147456 | 1000000 | 231 MHz | STD | 24576 | 1.73 mm | 23 mm | 23 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M7A3P1000-2FG484 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | M7A3P1000 | 350 MHz | 60 | MICROSEMI CORP | M7A3P1000-2FG484 | 310 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 300 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Not Recommended | Active | 30 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | M7A3P1000 | e0 | Tin/Lead (Sn/Pb) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B484 | Not Qualified | 1.5 V | COMMERCIAL | 1.575 V | 1.425 V | 18 kB | 24576 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 310 MHz | 2 | 24576 | 24576 | 1000000 | 1.73 mm | 23 mm | 23 mm | No | |||||||||||||||||||||||||||||||||||||
| Mfr Part No M2GL150T-1FC1152 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | M2GL150 | 24 | Microchip Technology | Yes | 574 | Tray | Active | N | This product may require additional documentation to export from the United States. | IGLOO2 | 0°C ~ 85°C (TJ) | Tray | M2GL150T | 1.14V ~ 2.625V | 146124 | 5120000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P400-1FGG256I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-256 | YES | 256-FPBGA (17x17) | 256 | M1A3P400 | 90 | MICROSEMI CORP | M1A3P400-1FGG256I | Microchip Technology | Yes | 3 | SMD/SMT | 178 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | -40°C ~ 100°C (TJ) | Tray | M1A3P400 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | INDUSTRIAL | 9216 CLBS, 400000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 9216 | 400000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE3000-1FG324I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 324-BGA | YES | 324-FBGA (19x19) | 324 | M1A3PE3000 | 350 MHz | 84 | MICROSEMI CORP | M1A3PE3000-1FG324I | Microchip Technology | Yes | 3 | 221 | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA324,18X18,40 | BGA324,18X18,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | -40°C ~ 100°C (TJ) | Tray | M1A3PE3000 | e0 | TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B324 | 221 | Not Qualified | 1.5/3.3 V | INDUSTRIAL | 221 | 75264 CLBS, 3000000 GATES | 1.78 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 75264 | 75264 | 3000000 | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE3000-2FG324 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 324-BGA | YES | 324-FBGA (19x19) | 324 | M1A3PE3000 | 350 MHz | 84 | MICROSEMI CORP | M1A3PE3000-2FG324 | Microchip Technology | Yes | 3 | 221 | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA324,18X18,40 | BGA324,18X18,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | M1A3PE3000 | e0 | TIN LEAD SILVER | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B324 | 221 | Not Qualified | 1.5/3.3 V | COMMERCIAL | 221 | 75264 CLBS, 3000000 GATES | 1.78 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | 75264 | 75264 | 3000000 | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XCKU3P-2FFVD900I | Xilinx Inc. | Datasheet | 460 | - | Min: 1 Mult: 1 | 11 Weeks | Surface Mount | 900-BBGA, FCBGA | 304 | -40°C~100°C TJ | Tray | Kintex® UltraScale+™ | Active | 4 (72 Hours) | 8542.39.00.01 | 0.825V~0.876V | NOT SPECIFIED | NOT SPECIFIED | FIELD PROGRAMMABLE GATE ARRAY | 355950 | 31641600 | 20340 | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC7S25-2CSGA225C | Xilinx Inc. | Datasheet | 792 | - | Min: 1 Mult: 1 | 10 Weeks | Surface Mount | 225-LFBGA, CSPBGA | YES | 150 | 0°C~85°C TJ | Tray | 2012 | Spartan®-7 | Active | 3 (168 Hours) | 225 | 8542.39.00.01 | 0.95V~1.05V | BOTTOM | BALL | NOT SPECIFIED | 1V | NOT SPECIFIED | S-PBGA-B225 | 202.5kB | FIELD PROGRAMMABLE GATE ARRAY | 23360 | 1658880 | 1825 | 1.05 ns | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LCMXO1200C-4FTN256I | Lattice Semiconductor Corporation | Datasheet | 1080 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | Surface Mount | 256-LBGA | 256 | SRAM | 211 | -40°C~100°C TJ | Tray | 2008 | MachXO | e1 | yes | Active | 3 (168 Hours) | 256 | EAR99 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | IT CAN ALSO OPERATE AT 2.5V AND 3.3V | 8542.39.00.01 | 1.71V~3.465V | BOTTOM | BALL | 260 | 1.8V | 1mm | 40 | LCMXO1200 | 256 | 211 | 3.3V | 21mA | 21mA | 4.4 ns | 4.4 ns | FLASH PLD | 1200 | 9421 | 550MHz | 150 | MACROCELL | 600 | 7 | 1.55mm | 17mm | 17mm | No | ROHS3 Compliant | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No EP20K100EQC240-1N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 240-BQFP | YES | 183 | 0°C~85°C TJ | Tray | APEX-20KE® | e3 | Obsolete | 3 (168 Hours) | 240 | 3A991 | Matte Tin (Sn) | 8542.39.00.01 | 1.71V~1.89V | QUAD | GULL WING | 245 | 1.8V | 0.5mm | compliant | 40 | EP20K100 | S-PQFP-G240 | 175 | Not Qualified | 1.81.8/3.3V | 1.73 ns | 175 | LOADABLE PLD | 4160 | 53248 | 263000 | 416 | MACROCELL | 4 | 4.1mm | 32mm | 32mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC6SLX75T-3FG484I | Xilinx Inc. | Datasheet | 1644 |
| Min: 1 Mult: 1 | 10 Weeks | Surface Mount | Surface Mount | 484-BBGA | 484 | 268 | -40°C~100°C TJ | Tray | 2008 | Spartan®-6 LXT | e0 | no | Active | 3 (168 Hours) | 484 | 1.14V~1.26V | BOTTOM | BALL | 225 | 1.2V | 1mm | not_compliant | 30 | XC6SLX75 | 484 | 268 | Not Qualified | 1.2V | 387kB | 862MHz | FIELD PROGRAMMABLE GATE ARRAY | 74637 | 3170304 | 5831 | 3 | 93296 | 0.21 ns | 2.6mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No EP1C12F324C7 | Intel | Datasheet | 788 | - | Min: 1 Mult: 1 | Surface Mount | 324-BGA | YES | 249 | 0°C~85°C TJ | Tray | Cyclone® | e0 | Obsolete | 3 (168 Hours) | 324 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 220 | 1.5V | 1mm | 30 | EP1C12 | S-PBGA-B324 | 249 | Not Qualified | 1.51.5/3.3V | 320MHz | 249 | FIELD PROGRAMMABLE GATE ARRAY | 12060 | 239616 | 1206 | 2.2mm | 19mm | 19mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7K325T-2FF900C | Xilinx Inc. | Datasheet | 12 | - | Min: 1 Mult: 1 | 11 Weeks | Lead, Tin | Surface Mount | Surface Mount | 900-BBGA, FCBGA | 900 | DDR3 | 500 | 0°C~85°C TJ | Tray | 2010 | Kintex®-7 | e0 | Active | 4 (72 Hours) | 900 | 3A991.D | Tin/Lead (Sn63Pb37) | 0.97V~1.03V | BOTTOM | BALL | 1V | 1mm | XC7K325T | 500 | 11.83.3V | 1GB | 2MB | 1818MHz | 100 ps | 100 ps | FIELD PROGRAMMABLE GATE ARRAY | 326080 | 16404480 | 25475 | 2 | 407600 | 0.61 ns | 3.35mm | 31mm | 31mm | No | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC2VP40-6FF1148I | Xilinx Inc. | Datasheet | 216 | - | Min: 1 Mult: 1 | 6 Weeks | Surface Mount | Surface Mount | 1148-BBGA, FCBGA | 804 | -40°C~100°C TJ | Tray | 2006 | Virtex®-II Pro | e0 | no | Obsolete | 4 (72 Hours) | 3A001.A.7.A | 8542.39.00.01 | 1.425V~1.575V | BOTTOM | BALL | 225 | 1.5V | 1mm | 30 | XC2VP40 | S-PBGA-B1148 | 804 | Not Qualified | 1.5V | 1.51.5/3.32/2.52.5V | 432kB | 1200MHz | 804 | FIELD PROGRAMMABLE GATE ARRAY | 43632 | 3538944 | 4848 | 6 | 38784 | 0.32 ns | 3.4mm | 35mm | 35mm | Non-RoHS Compliant |
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M7A3P1000-2FG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A40MX04-1PLG68I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A3P600-1FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P1000-FG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M7A3P1000-FG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P1000-2FG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M7A3P1000-FG484I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M7A3P1000-2FG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M2GL150T-1FC1152
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P400-1FGG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3PE3000-1FG324I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3PE3000-2FG324
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XCKU3P-2FFVD900I
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XC7S25-2CSGA225C
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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LCMXO1200C-4FTN256I
Lattice Semiconductor Corporation
Package:Embedded - FPGAs (Field Programmable Gate Array)
33.323519
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EP20K100EQC240-1N
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XC6SLX75T-3FG484I
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
288.509395
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EP1C12F324C7
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XC7K325T-2FF900C
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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XC2VP40-6FF1148I
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire