The category is 'Embedded - FPGAs (Field Programmable Gate Array)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Clock Frequency-Max | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Maximum Operating Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | RAM Size | Clock Frequency | Propagation Delay | Turn On Delay Time | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Number of Gates | Max Frequency | Number of LABs/CLBs | Number of Logic Blocks (LABs) | Speed Grade | Output Function | Number of Macro Cells | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Dedicated Inputs | Number of Equivalent Gates | Height | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status | Lead Free |
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 | Mfr Part No EPF10K100ABI356-3N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 356-LBGA | YES | 274 | -40°C~85°C TA | Tray | FLEX-10KA® | e1 | Obsolete | 3 (168 Hours) | 356 | 3A991 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | 3V~3.6V | BOTTOM | BALL | 245 | 3.3V | 1.27mm | compliant | 40 | EPF10K100 | S-PBGA-B356 | 274 | Not Qualified | 2.5/3.33.3V | 0.8 ns | 274 | LOADABLE PLD | 4992 | 24576 | 158000 | 624 | REGISTERED | 4 | 1.63mm | 35mm | 35mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No LCMXO2-7000HC-6TG144I | Lattice Semiconductor Corporation | Datasheet | 1854 |
| Min: 1 Mult: 1 | 8 Weeks | Surface Mount | Surface Mount | 144-LQFP | 144 | 114 | -40°C~100°C TJ | Tray | 2000 | MachXO2 | e3 | yes | Active | 3 (168 Hours) | 144 | EAR99 | Matte Tin (Sn) | 8542.39.00.01 | 2.375V~3.465V | QUAD | GULL WING | 260 | 2.5V | 0.5mm | 30 | LCMXO2-7000 | 115 | Not Qualified | 2.5V | 2.5/3.3V | 68.8kB | 189μA | FIELD PROGRAMMABLE GATE ARRAY | 6864 | 245760 | 388MHz | 858 | 3432 | 1.6mm | 20mm | 20mm | ROHS3 Compliant | Lead Free | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XCV100E-6PQ240C | Xilinx Inc. | Datasheet | 800 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | 240-BFQFP | 240 | 158 | 0°C~85°C TJ | Tray | 2006 | Virtex®-E | e0 | no | Obsolete | 3 (168 Hours) | 240 | EAR99 | Tin/Lead (Sn85Pb15) | 8542.39.00.01 | 1.71V~1.89V | QUAD | GULL WING | 225 | 1.8V | 0.5mm | 30 | XCV100E | 240 | 158 | 1.8V | 10kB | 357MHz | FIELD PROGRAMMABLE GATE ARRAY | 2700 | 81920 | 128236 | 600 | 6 | 0.47 ns | 600 | 4.1mm | 32mm | 32mm | No | Non-RoHS Compliant | Contains Lead | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 5SGXMA7N2F45I3LN | Intel | Datasheet | 769 | - | Min: 1 Mult: 1 | 8 Weeks | Surface Mount | 1932-BBGA, FCBGA | YES | 840 | -40°C~100°C TJ | Tray | Stratix® V GX | Active | 3 (168 Hours) | 8542.39.00.01 | 0.82V~0.88V | BOTTOM | BALL | 0.85V | 1mm | 5SGXMA7 | S-PBGA-B1932 | 840 | Not Qualified | 0.851.52.52.5/31.2/3V | 840 | 23472 CLBS | FIELD PROGRAMMABLE GATE ARRAY | 622000 | 51200000 | 234720 | 3.9mm | 45mm | 45mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EPF10K50VBC356-1 | Intel | Datasheet | 19 | - | Min: 1 Mult: 1 | Surface Mount | 356-LBGA | YES | 274 | 0°C~70°C TA | Tray | FLEX-10K® | e0 | Obsolete | 3 (168 Hours) | 356 | 3A991 | TIN/LEAD (SN63PB37) | 8542.39.00.01 | 3V~3.6V | BOTTOM | BALL | 220 | 3.3V | 1.27mm | compliant | 30 | EPF10K50 | S-PBGA-B356 | 310 | Not Qualified | 3.3V | 0.4 ns | 310 | LOADABLE PLD | 2880 | 20480 | 116000 | 360 | REGISTERED | 4 | 1.63mm | 35mm | 35mm | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M7A3P1000-1FGG484 | Microchip Technology | Datasheet | 2198 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | FBGA | 484 | 484-FPBGA (23x23) | 400.011771 mg | M7A3P1000 | 60 | 272 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | SMD/SMT | 300 I/O | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | M7A3P1000 | 70 °C | 0 °C | 1.425V ~ 1.575V | 272 MHz | 1.5 V | 1.575 V | 1.425 V | 18 kB | 147456 | 1000000 | 272 MHz | 1 | 24576 | 1.73 mm | 23 mm | 23 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P400-2FGG144 | Microchip Technology | Datasheet | 20 | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-144 | YES | 144-FPBGA (13x13) | 144 | M1A3P400 | 350 MHz | 160 | MICROSEMI CORP | M1A3P400-2FGG144 | Microchip Technology | Yes | 3 | SMD/SMT | 97 | 85 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | M1A3P400 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | COMMERCIAL | 9216 CLBS, 400000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 9216 | 400000 | 13 mm | 13 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3P400-2FGG256 | Microchip Technology | Datasheet | 27 | - | Min: 1 Mult: 1 | Surface Mount | FPBGA-256 | YES | 256-FPBGA (17x17) | 256 | M1A3P400 | 350 MHz | 90 | MICROSEMI CORP | M1A3P400-2FGG256 | Microchip Technology | Yes | 3 | SMD/SMT | 178 | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 0°C ~ 85°C (TJ) | Tray | M1A3P400 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | COMMERCIAL | 9216 CLBS, 400000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 55296 | 400000 | 9216 | 400000 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A42MX24-3PQG160I | Microchip Technology | Datasheet | 1796 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | PQFP-160 | YES | 160 | 160-PQFP (28x28) | 5.566797 g | 160 | A42MX24 | 24 | MICROSEMI CORP | A42MX24-3PQG160I | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 125 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | QFP | QFP, | SQUARE | FLATPACK | Active | Active | 40 | 5.3 | Details | Yes | 5.5 V | 3 V | 3.3 V | Actel | 0.196363 oz | -40°C ~ 85°C (TA) | Tray | A42MX24 | e3 | Matte Tin (Sn) | 85 °C | -40 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 245 | 0.65 mm | compliant | S-PQFP-G160 | Not Qualified | 3.3 V, 5 V | INDUSTRIAL | 5.5 V | 3 V | 1890 CLBS, 36000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 912 | 36000 | 912 | 3 | 1410 | 2 ns | 1890 | 36000 | 3.4 mm | 28 mm | 28 mm | No | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No A42MX24-1PQG160M | Microchip Technology | Datasheet | 696 |
| Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | PQFP-160 | YES | 160 | 160-PQFP (28x28) | 5.566797 g | 160 | A42MX24 | 24 | MICROSEMI CORP | A42MX24-1PQG160M | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 125 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | QFP | ROHS COMPLIANT, PLASTIC, QFP-160 | SQUARE | FLATPACK | Active | Active | 40 | 5.29 | Details | Yes | This product may require additional documentation to export from the United States. | 5.5 V | 3 V | 3.3 V | Actel | 0.196363 oz | -55°C ~ 125°C (TC) | Tray | A42MX24 | e3 | 3A001.A.2.C | Matte Tin (Sn) | 125 °C | -55 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | 245 | 0.65 mm | compliant | S-PQFP-G160 | Not Qualified | 3.3 V, 5 V | MILITARY | 5.5 V | 3 V | 1890 CLBS, 36000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 912 | 36000 | 912 | 1 | 1410 | 2.1 ns | 1890 | 36000 | 3.4 mm | 28 mm | 28 mm | No | |||||||||||||||||||||||||||||||||||||
| Mfr Part No M7A3P1000-2FGG256 | Microchip Technology | Datasheet | 1719 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | M7A3P1000 | 350 MHz | 90 | MICROSEMI CORP | M7A3P1000-2FGG256 | 310 MHz | 1.575 V | + 70 C | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 177 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Not Recommended | Active | 40 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | 0 to 70 °C | Tray | M7A3P1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | 310 MHz | S-PBGA-B256 | Not Qualified | 1.5 V | COMMERCIAL | 1.575 V | 1.425 V | 18 kB | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 310 MHz | 2 | 24576 | 24576 | 1000000 | 1.2 mm | 17 mm | 17 mm | No | |||||||||||||||||||||||||||||||||||
| Mfr Part No AFS1500-2FGG256I | Microchip Technology | Datasheet | 1726 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | AFS1500 | 90 | MICROSEMI CORP | AFS1500-2FGG256I | 1470.59 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 119 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | 0.014110 oz | -40°C ~ 100°C (TJ) | Tray | AFS1500 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 33.8 kB | 1500000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 276480 | 1500000 | 1.47059 GHz | 2 | 38400 | 1500000 | 1.2 mm | 17 mm | 17 mm | No | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No M7AFS600-FGG484 | Microchip Technology | Datasheet | 2342 | - | Min: 1 Mult: 1 | Surface Mount | FBGA | 484-FPBGA (23x23) | M7AFS600 | 60 | 1098.9 MHz | + 70 C | Microchip Technology | 0 C | Yes | SMD/SMT | 172 I/O | Tray | Active | Details | 1.575 V | 1.425 V | Fusion | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | M7AFS600 | 1.425V ~ 1.575V | 1.5 V | 110592 | 600000 | STD | 1.73 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M1A3PE3000-FG896I | Microchip Technology | Datasheet | 490 |
| Min: 1 Mult: 1 | Surface Mount | FBGA | YES | 896-FBGA (31x31) | 896 | M1A3PE3000 | 350 MHz | 27 | MICROSEMI CORP | M1A3PE3000-FG896I | 231 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 620 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | M1A3PE3000 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | 896 | S-PBGA-B896 | 620 | Not Qualified | 1.5 V | 1.5/3.3 V | INDUSTRIAL | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 516096 | 3000000 | STD | 75264 | 75264 | 3000000 | 1.73 mm | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M7A3P1000-1FG256I | Microchip Technology | Datasheet | 2107 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | M7A3P1000 | 350 MHz | 90 | MICROSEMI CORP | M7A3P1000-1FG256I | 272 MHz | 1.575 V | + 85 C | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 177 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Not Recommended | Active | 30 | 5.25 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | -40 to 85 °C | Tray | M7A3P1000 | TIN LEAD/TIN LEAD SILVER | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 18 kB | 24576 CLBS, 1000000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 272 MHz | 1 | 24576 | 24576 | 1000000 | 1.2 mm | 17 mm | 17 mm | No | ||||||||||||||||||||||||||||||||||||
| Mfr Part No M1AGL600V5-FGG144I | Microchip Technology | Datasheet | 2223 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 144 | 144-FPBGA (13x13) | 400.011771 mg | 144 | M1AGL600 | 108 MHz | 160 | MICROSEMI CORP | M1AGL600V5-FGG144I | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 97 I/O | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.26 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | IGLOOe | 0.014110 oz | -40°C ~ 85°C (TA) | Tray | M1AGL600V5 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | S-PBGA-B144 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 13.5 kB | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | STD | 13824 | 600000 | 1.05 mm | 13 mm | 13 mm | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A54SX32-1PQG208M | Microchip Technology | Datasheet | 404 |
| Min: 1 Mult: 1 | Surface Mount | PQFP-208 | YES | 208-PQFP (28x28) | 208 | A54SX32 | 280 MHz | 24 | MICROSEMI CORP | A54SX32-1PQG208M | 280 MHz | + 125 C | Microchip Technology | - 55 C | Yes | 3 | SMD/SMT | 174 I/O | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 40 | 5.24 | Details | Yes | This product may require additional documentation to export from the United States. | 3.6 V | 3 V | 3.3 V | Actel | -55°C ~ 125°C (TC) | Tray | A54SX32 | e3 | 3A001.A.2.C | Matte Tin (Sn) | CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.75V ~ 5.25V | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | 174 | Not Qualified | 3.3 V, 5 V | 3.3,5 V | MILITARY | 174 | 2880 CLBS, 32000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 48000 | 2880 | 0.8 ns | 2880 | 2880 | 32000 | 3.4 mm | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX1000-2FGG676 | Microchip Technology | Datasheet | 427 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | AX1000 | 870 MHz | 40 | MICROSEMI CORP | AX1000-2FGG676 | 870 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 418 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | AX1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 870 MHz | S-PBGA-B676 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 20.3 kB | 740 ps | 740 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 870 MHz | 18144 | 12096 | 2 | 12096 | 0.74 ns | 12096 | 18144 | 1000000 | 1.73 mm | 27 mm | 27 mm | No | |||||||||||||||||||||||||
| Mfr Part No M7A3P1000-2PQG208I | Microchip Technology | Datasheet | 2380 | - | Min: 1 Mult: 1 | Surface Mount | Surface Mount | PQFP-208 | YES | 208 | 208-PQFP (28x28) | 208 | M7A3P1000 | 350 MHz | 24 | MICROSEMI CORP | M7A3P1000-2PQG208I | 310 MHz | + 85 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 154 I/O | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | FQFP | FQFP, | SQUARE | FLATPACK, FINE PITCH | Not Recommended | Active | 5.26 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | -40°C ~ 100°C (TJ) | Tray | M7A3P1000 | 85 °C | -40 °C | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | GULL WING | 0.5 mm | compliant | 310 MHz | S-PQFP-G208 | Not Qualified | 1.5 V | INDUSTRIAL | 1.575 V | 1.425 V | 18 kB | 24576 CLBS, 1000000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | 147456 | 1000000 | 310 MHz | 2 | 24576 | 24576 | 1000000 | 3.4 mm | 28 mm | 28 mm | No | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AX1000-FGG676 | Microchip Technology | Datasheet | 726 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 676 | 676-FBGA (27x27) | 400.011771 mg | 676 | AX1000 | 649 MHz | 40 | MICROSEMI CORP | AX1000-FGG676 | 649 MHz | + 70 C | Microchip Technology | 0 C | Yes | 3 | SMD/SMT | 418 I/O | 70 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.25 | Details | Yes | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | 0.014110 oz | 0°C ~ 70°C (TA) | Tray | AX1000 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | 1000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 649 MHz | S-PBGA-B676 | 516 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | COMMERCIAL | 1.575 V | 1.425 V | 20.3 kB | 990 ps | 990 ps | 516 | 12096 CLBS, 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12096 | 165888 | 1000000 | 649 MHz | 18144 | 12096 | 12096 | 0.99 ns | 12096 | 18144 | 1000000 | 1.73 mm | 27 mm | 27 mm | No |
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EPF10K100ABI356-3N
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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LCMXO2-7000HC-6TG144I
Lattice Semiconductor Corporation
Package:Embedded - FPGAs (Field Programmable Gate Array)
52.817698
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XCV100E-6PQ240C
Xilinx Inc.
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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5SGXMA7N2F45I3LN
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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EPF10K50VBC356-1
Intel
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M7A3P1000-1FGG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P400-2FGG144
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3P400-2FGG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A42MX24-3PQG160I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
329.684799
-
A42MX24-1PQG160M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
1,692.279934
-
M7A3P1000-2FGG256
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AFS1500-2FGG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
529.820823
-
M7AFS600-FGG484
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1A3PE3000-FG896I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
652.904978
-
M7A3P1000-1FG256I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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M1AGL600V5-FGG144I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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A54SX32-1PQG208M
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
2,138.366050
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AX1000-2FGG676
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
1,091.346479
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M7A3P1000-2PQG208I
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
Price: please inquire
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AX1000-FGG676
Microchip Technology
Package:Embedded - FPGAs (Field Programmable Gate Array)
682.175538