The category is 'Embedded - Microcontrollers - Application Specific'
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- Moisture Sensitivity Level (MSL)
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Number of I/O Lines | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Number of Ports | uPs/uCs/Peripheral ICs Type | Supply Current-Max | Seated Height-Max | Address Bus Width | Primary Clock/Crystal Frequency-Nom | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Output Clock Frequency-Max | RAM (words) | Number of Serial I/Os | Bus Compatibility | Data Transfer Rate-Max | Communication Protocol | Data Encoding/Decoding Method | Host Data Transfer Rate-Max | Drive Interface Standard | Length | Width |
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 | Mfr Part No UPD72874GC-YEB | Renesas Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | RENESAS ELECTRONICS CORP | TQFP-120 | Obsolete | No | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PC8477BV | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | YES | 68 | NATIONAL SEMICONDUCTOR CORP | 70 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC68,1.0SQ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | Obsolete | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | J BEND | 1.27 mm | unknown | S-PQCC-J68 | Not Qualified | COMMERCIAL | 15 mA | ||||||||||||||||||||||||||||||||||
| Mfr Part No SG-615PC | Seiko Epson Corporation | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No ESP32-S2-SOLO-2-N16 | Espressif Inc | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IM6403IJL | Intersil Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | HARRIS SEMICONDUCTOR | 85 °C | -40 °C | CERAMIC | DIP | DIP, DIP40,.6 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | No | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T40 | Not Qualified | INDUSTRIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | ||||||||||||||||||||||||||||||||||
| Mfr Part No SG531YHC | Seiko Epson Corporation | Datasheet | - | - | Min: 1 Mult: 1 | SEIKO EPSON CORP | , | Obsolete | 8542.31.00.01 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No SDSDQM-032G-B35A | Western Digital Corp | Datasheet | - | - | Min: 1 Mult: 1 | YES | WESTERN DIGITAL CORP | UNSPECIFIED | DIE | DIE, | UNSPECIFIED | UNCASED CHIP | Contact Manufacturer | Yes | AVAILABLE IN EUROPE, MIDDLE EAST, AFRICA, ASIA-PACIFIC AND LATIN AMERICA | 8542.31.00.01 | UPPER | NO LEAD | NOT SPECIFIED | unknown | NOT SPECIFIED | X-XUUC-N | MICROPROCESSOR CIRCUIT | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No ICS84329AY | Integrated Device Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | INTEGRATED DEVICE TECHNOLOGY INC | 3 | 70 °C | PLASTIC/EPOXY | LQFP | 7 X 7 MM, 1.40 MM HEIGHT, MS-026, LQFP-32 | QFP32,.35SQ,32 | SQUARE | FLATPACK, LOW PROFILE | Obsolete | QFP | No | 3.465 V | 3.135 V | 3.3 V | e0 | No | EAR99 | Tin/Lead (Sn85Pb15) | 8542.39.00.01 | QUAD | GULL WING | 225 | 0.8 mm | not_compliant | 20 | 32 | S-PQFP-G32 | Not Qualified | COMMERCIAL | CLOCK GENERATOR, OTHER | 1.6 mm | 25 MHz | 700 MHz | 7 mm | 7 mm | ||||||||||||||||||||
 | Mfr Part No R65C51P1 | Conexant Systems Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 28 | 1 MHz | CONEXANT SYSTEMS | 70 °C | PLASTIC/EPOXY | DIP | PLASTIC, DIP-28 | DIP28,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.25 V | 4.75 V | 5 V | e0 | TIN LEAD | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | compliant | 28 | R-PDIP-T28 | Not Qualified | COMMERCIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | 6.1 mm | 2 | NO | NO | 8 | 0 | 1 | 65C00; 6500 | 0.00234375 MBps | ASYNC, BIT | NRZ | 36.83 mm | 15.24 mm | ||||||||||||||||
| Mfr Part No PSD303-20LMB | Waferscale Integration Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | WAFERSCALE INTEGRATION INC | 19 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | WQCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER, WINDOW | Obsolete | No | 5.5 V | 4.5 V | 5 V | e0 | TIN LEAD | QUAD | J BEND | 1.27 mm | unknown | S-CQCC-J44 | Not Qualified | MILITARY | 3 | PARALLEL IO PORT, GENERAL PURPOSE | 115 mA | 4.57 mm | 38535Q/M;38534H;883B | 16 | 16.485 mm | 16.485 mm | |||||||||||||||||||||||||
| Mfr Part No XCZU4EV-1LFBVB900I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FCBGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Active | Yes | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 2.88 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | ||||||||||||||||||||||||||||
| Mfr Part No SDIN8DE2-16G-XI | SanDisk Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | SANDISK CORP | 85 °C | -40 °C | UNSPECIFIED | DIE | DIE, | RECTANGULAR | UNCASED CHIP | Obsolete | 3.6 V | 2.7 V | 3.3 V | 8542.31.00.01 | UPPER | NO LEAD | unknown | R-XUUC-N | INDUSTRIAL | SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE | 120 MBps | |||||||||||||||||||||||||||||||||||||
 | Mfr Part No PCU9669B | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 48 | 12 MHz | NXP SEMICONDUCTORS | 1 | 85 °C | -40 °C | PLASTIC/EPOXY | LFQFP | 7 X 7 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT313-2, LQFP-48 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | Yes | 3.6 V | 3 V | 3.3 V | e3 | Tin (Sn) | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 0.5 mm | compliant | NOT SPECIFIED | 48 | S-PQFP-G48 | INDUSTRIAL | BUS CONTROLLER, I2C | 1.6 mm | 8 | 8 | I2C | 5 MBps | IEEE 1149.1 | 7 mm | 7 mm | |||||||||||||||||||
| Mfr Part No UPD6462GS-001 | Renesas Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 20 | RENESAS ELECTRONICS CORP | 70 °C | -20 °C | PLASTIC/EPOXY | SSOP | SSOP, SSOP20,.3 | SSOP20,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | Obsolete | No | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | GULL WING | 0.635 mm | unknown | R-PDSO-G20 | Not Qualified | COMMERCIAL | GRAPHICS PROCESSOR | ||||||||||||||||||||||||||||||||||
| Mfr Part No ISL3880IK-TK | Renesas Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | RENESAS ELECTRONICS CORP | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | No | 5.5 V | 4.5 V | 5 V | 8542.31.00.01 | BOTTOM | BALL | 1 mm | not_compliant | S-PBGA-B256 | Not Qualified | INDUSTRIAL | SERIAL IO/COMMUNICATION CONTROLLER, LAN | NO | 1 | ASYNC, BIT | |||||||||||||||||||||||||||||||
| Mfr Part No P5CD016HN | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 32 | NXP SEMICONDUCTORS | 85 °C | -25 °C | PLASTIC/EPOXY | QCCN | 5 X 5 MM, 0.85 MM HEIGHT, PLASTIC, SOT617-3, HVQFN-32 | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER | Obsolete | QFN | 1.98 V | 1.62 V | 1.8 V | ALSO OPERATES AT 3V, 5V SUPPLY | 8542.31.00.01 | QUAD | NO LEAD | 0.5 mm | compliant | 32 | S-PQCC-N32 | Not Qualified | OTHER | MICROPROCESSOR CIRCUIT | 5 mm | 5 mm | |||||||||||||||||||||||||||||
| Mfr Part No TWL91306DGGVR | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No TSB12C01APZ | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | 24.576 MHz | TEXAS INSTRUMENTS INC | 1 | 70 °C | PLASTIC/EPOXY | LFQFP | LFQFP, QFP100,.63SQ,20 | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | Yes | 5.25 V | 4.75 V | 5 V | e4 | NICKEL PALLADIUM GOLD | 8542.31.00.01 | QUAD | GULL WING | 260 | 0.5 mm | unknown | 30 | 100 | S-PQFP-G100 | Not Qualified | COMMERCIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | 1.6 mm | 8 | NO | NO | 32 | 1 | 50 MBps | IEEE1394 | 14 mm | 14 mm | ||||||||||||||||
| Mfr Part No TSB12C01APZ | Rochester Electronics LLC | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | 24.576 MHz | ROCHESTER ELECTRONICS LLC | 1 | 70 °C | PLASTIC/EPOXY | LFQFP | PLASTIC, QFP-100 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | QFP | Yes | 5.25 V | 4.75 V | 5 V | e4 | No | NICKEL PALLADIUM GOLD | QUAD | GULL WING | 260 | 0.5 mm | unknown | NOT SPECIFIED | 100 | S-PQFP-G100 | COMMERCIAL | COMMERCIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | 1.6 mm | 8 | NO | NO | 32 | 1 | 50 MBps | 14 mm | 14 mm | ||||||||||||||||||
| Mfr Part No SB82371SB-SU093 | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 |
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UPD72874GC-YEB
Renesas Electronics Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
-
PC8477BV
Texas Instruments
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
-
SG-615PC
Seiko Epson Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
-
ESP32-S2-SOLO-2-N16
Espressif Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
-
IM6403IJL
Intersil Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
-
SG531YHC
Seiko Epson Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
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SDSDQM-032G-B35A
Western Digital Corp
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
-
ICS84329AY
Integrated Device Technology Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
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R65C51P1
Conexant Systems Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
-
PSD303-20LMB
Waferscale Integration Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
-
XCZU4EV-1LFBVB900I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
-
SDIN8DE2-16G-XI
SanDisk Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
-
PCU9669B
NXP Semiconductors
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
-
UPD6462GS-001
Renesas Electronics Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
-
ISL3880IK-TK
Renesas Electronics Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
-
P5CD016HN
NXP Semiconductors
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
-
TWL91306DGGVR
Texas Instruments
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
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TSB12C01APZ
Texas Instruments
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
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TSB12C01APZ
Rochester Electronics LLC
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
-
SB82371SB-SU093
Intel Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire