The category is 'Embedded - Microcontrollers - Application Specific'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Date Of Intro | Ihs Manufacturer | Moisture Sensitivity Levels | Number of I/O Lines | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | uPs/uCs/Peripheral ICs Type | Supply Current-Max | Seated Height-Max | Address Bus Width | Primary Clock/Crystal Frequency-Nom | Boundary Scan | Low Power Mode | Screening Level | External Data Bus Width | Output Clock Frequency-Max | RAM (words) | Number of Serial I/Os | Bus Compatibility | On Chip Data RAM Width | Data Transfer Rate-Max | Time-Min | Interrupt Capability | Volatile | Communication Protocol | Information Access Method | Data Encoding/Decoding Method | Length | Width |
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![]() | Mfr Part No XCZU2CG-2LSFVC784E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 784 | ADVANCED MICRO DEVICES INC | 4 | 110 °C | PLASTIC/EPOXY | FBGA | FCBGA-784 | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Yes | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | OTHER | PROGRAMMABLE SoC | 3.32 mm | CAN, I2C, SPI, UART | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No MCP7940N-E/SNVAO | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | 0.032 MHz | MICROCHIP TECHNOLOGY INC | 125 °C | -40 °C | PLASTIC/EPOXY | SOP | SOIC-8 | SOP8,.23 | RECTANGULAR | SMALL OUTLINE | Active | 5.5 V | 1.8 V | 2.5 V | EAR99 | 8542.39.00.01 | DUAL | GULL WING | 1.27 mm | compliant | R-PDSO-G8 | AUTOMOTIVE | TIMER, REAL TIME CLOCK | 0.4 mA | 1.75 mm | AEC-Q100; TS 16949 | 64 | 8 | SECONDS | Y | YES | SERIAL(I2C) | 4.9 mm | 3.9 mm | |||||||||||||||||||||||||
![]() | Mfr Part No PI7C21P100BNH | Pericom Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 304 | 133 MHz | PERICOM SEMICONDUCTOR CORP | 70 °C | PLASTIC/EPOXY | BGA | BGA, BGA304,23X23,50 | BGA304,23X23,50 | SQUARE | GRID ARRAY | Obsolete | BGA | No | 2.7 V | 2.3 V | 2.5 V | e0 | EAR99 | TIN LEAD | ALSO REQUIRES 3.3V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 1.27 mm | compliant | 304 | S-PBGA-B304 | Not Qualified | COMMERCIAL | BUS CONTROLLER, PCI | 1.73 mm | 64 | 64 | 31 mm | 31 mm | |||||||||||||||||||||||||
![]() | Mfr Part No SAF82526HV2.1 | Infineon Technologies AG | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No DP8432V-33 | National Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No PSD311L-25J | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | YES | 44 | STMICROELECTRONICS | 70 °C | PLASTIC/EPOXY | QCCJ | LDCC44,.7SQ | SQUARE | CHIP CARRIER | Obsolete | No | 3.3 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | QUAD | J BEND | 1.27 mm | not_compliant | S-PQCC-J44 | Not Qualified | COMMERCIAL | |||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SC68C198C1A | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | YES | 84 | 8 MHz | NXP SEMICONDUCTORS | 3 | 70 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-84 | LDCC84,1.2SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | 5.5 V | 4.5 V | 5 V | 8542.31.00.01 | QUAD | J BEND | 1.27 mm | compliant | 84 | S-PQCC-J84 | Not Qualified | COMMERCIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | 200 mA | 4.57 mm | 8 | NO | YES | 8 | 0 | 8 | 0.06103515625 MBps | ASYNC, BIT | NRZ | 29.3116 mm | 29.3116 mm | |||||||||||||||||||||
![]() | Mfr Part No SLG84503VTR | Dialog Semiconductor GmbH | Datasheet | - | - | Min: 1 Mult: 1 | DIALOG SEMICONDUCTOR GMBH | , | Transferred | unknown | CLOCK GENERATOR, OTHER | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AO100/4G/SMA | AAMP Global | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU9CG-2SFVA625I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 625 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA-625 | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Yes | 0.876 V | 0.825 V | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B625 | INDUSTRIAL | PROGRAMMABLE SoC | 3.43 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 21 mm | 21 mm | |||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU19EG-3FFVC1760I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1760 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FCBGA-1760 | SQUARE | GRID ARRAY | Active | Yes | 0.9 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1760 | INDUSTRIAL | PROGRAMMABLE SoC | 3.71 mm | 42.5 mm | 42.5 mm | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU19EG-3FFVC1760I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1760 | 2017-02-15 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | SQUARE | GRID ARRAY | Transferred | Yes | 0.9 V | e1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1760 | INDUSTRIAL | PROGRAMMABLE SoC | 3.71 mm | 42.5 mm | 42.5 mm | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU9CG-L1FBVB900I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Active | Yes | 0.742 V | 0.698 V | 0.72 V | e1 | TIN SILVER COPPER | ALSO OPERATES AT 0.85V NOMINAL SUPPLY | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 2.88 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 31 mm | 31 mm | ||||||||||||||||||||||||||||
![]() | Mfr Part No UPD800477F1-412-EAM-A | Renesas Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MK3754SLFTR | Integrated Device Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 8 | INTEGRATED DEVICE TECHNOLOGY INC | 1 | 70 °C | PLASTIC/EPOXY | SOP | SOP, SOP8,.25 | SOP8,.25 | RECTANGULAR | SMALL OUTLINE | Transferred | SOIC | Yes | 3.45 V | 3.15 V | 3.3 V | e3 | Yes | EAR99 | Matte Tin (Sn) - annealed | 8542.39.00.01 | DUAL | GULL WING | 260 | 1.27 mm | compliant | 30 | 8 | R-PDSO-G8 | Not Qualified | COMMERCIAL | CLOCK GENERATOR, OTHER | 1.75 mm | 13.5 MHz | 54 MHz | 4.9 mm | 3.9 mm | |||||||||||||||||||||||
![]() | Mfr Part No XCZU6CG-1SFVA625I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 625 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA-625 | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Yes | 0.876 V | 0.825 V | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B625 | INDUSTRIAL | PROGRAMMABLE SoC | 3.43 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 21 mm | 21 mm | |||||||||||||||||||||||||||||
![]() | Mfr Part No S82379AB | Intel Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 208 | 33 MHz | INTEL CORP | PLASTIC/EPOXY | FQFP | FQFP, | SQUARE | FLATPACK, FINE PITCH | Obsolete | QFP | 5 V | 3A991.A.2 | INTERRUPT CONTROLLER | 8542.31.00.01 | QUAD | GULL WING | 0.5 mm | compliant | 208 | S-PQFP-G208 | Not Qualified | BUS CONTROLLER, ISA | 3.86 mm | 32 | 32 | PCI | 28 mm | 28 mm | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU5CG-2LSFVC784I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 784 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FCBGA-784 | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Yes | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | CAN, I2C, SPI, UART | 23 mm | 23 mm | |||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU3CG-2LSFVC784E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 784 | ADVANCED MICRO DEVICES INC | 4 | 110 °C | PLASTIC/EPOXY | FBGA | FCBGA-784 | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Yes | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | OTHER | PROGRAMMABLE SoC | 3.32 mm | CAN, I2C, SPI, UART | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No SP705B | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 14 | ZARLINK SEMICONDUCTOR INC | 70 °C | PLASTIC/EPOXY | DIP | DIP, | RECTANGULAR | IN-LINE | Obsolete | 5.5 V | 4.5 V | 5 V | e0 | EAR99 | TIN LEAD | 8542.39.00.01 | DUAL | THROUGH-HOLE | unknown | R-PDIP-T14 | Not Qualified | COMMERCIAL | CLOCK GENERATOR, OTHER | 10 MHz | 5 MHz |
XCZU2CG-2LSFVC784E
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
MCP7940N-E/SNVAO
Microchip Technology Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PI7C21P100BNH
Pericom Semiconductor Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SAF82526HV2.1
Infineon Technologies AG
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
DP8432V-33
National Semiconductor Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PSD311L-25J
STMicroelectronics
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SC68C198C1A
NXP Semiconductors
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SLG84503VTR
Dialog Semiconductor GmbH
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
AO100/4G/SMA
AAMP Global
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU9CG-2SFVA625I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU19EG-3FFVC1760I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU19EG-3FFVC1760I
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU9CG-L1FBVB900I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
UPD800477F1-412-EAM-A
Renesas Electronics Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
MK3754SLFTR
Integrated Device Technology Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU6CG-1SFVA625I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
S82379AB
Intel Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU5CG-2LSFVC784I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU3CG-2LSFVC784E
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SP705B
Microsemi Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
