The category is 'Embedded - Microcontrollers - Application Specific'
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- Moisture Sensitivity Level (MSL)
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Pbfree Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | uPs/uCs/Peripheral ICs Type | Supply Current-Max | Seated Height-Max | Boundary Scan | External Data Bus Width | Number of Serial I/Os | Bus Compatibility | Communication Protocol | Host Data Transfer Rate-Max | Drive Interface Standard | Host Interface Standard | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No XCZU5EV-1LSFVC784I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 784 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FCBGA-784 | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Yes | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | CAN, I2C, SPI, UART | 23 mm | 23 mm | |||||||||||||||||
![]() | Mfr Part No BCM5632 | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | YES | 785 | BROADCOM CORP | 1 | PLASTIC/EPOXY | BGA | BGA, | UNSPECIFIED | GRID ARRAY | Obsolete | BGA | No | 8542.31.00.01 | BOTTOM | BALL | compliant | 785 | X-PBGA-B785 | Not Qualified | MICROPROCESSOR CIRCUIT | |||||||||||||||||||||||||||
![]() | Mfr Part No XQ7Z030-2RF900I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | XILINX INC | PLASTIC/EPOXY | BGA | 31 X 31 MM, 1 MM PITCH, BGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | No | e0 | TIN LEAD | 8542.31.00.01 | BOTTOM | BALL | 1 mm | not_compliant | S-PBGA-B900 | Not Qualified | PROGRAMMABLE SoC | 3.44 mm | 31 mm | 31 mm | |||||||||||||||||||||||
![]() | Mfr Part No XQ7Z030-2RF900I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | ADVANCED MICRO DEVICES INC | PLASTIC/EPOXY | BGA | 31 X 31 MM, 1 MM PITCH, BGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Active | No | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B900 | Not Qualified | PROGRAMMABLE SoC | 3.44 mm | 31 mm | 31 mm | ||||||||||||||||||||||||
![]() | Mfr Part No XCZU7CG-2LFFVF1517E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1517 | ADVANCED MICRO DEVICES INC | 4 | 110 °C | PLASTIC/EPOXY | BGA | FCBGA-1517 | BGA1517,39X39,40 | SQUARE | GRID ARRAY | Active | Yes | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | OTHER | PROGRAMMABLE SoC | 3.51 mm | CAN, I2C, SPI, UART | 40 mm | 40 mm | ||||||||||||||||||||
![]() | Mfr Part No UPD7262D | NEC Electronics Group | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No UPD7262D | Renesas Electronics Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | RENESAS ELECTRONICS CORP | 70 °C | CERAMIC | DIP | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-XDIP-T40 | Not Qualified | COMMERCIAL | |||||||||||||||||||||||||
![]() | Mfr Part No NAS8702U1 | Heartland Precision Fasteners Inc | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SST85LD1001K-60-4C-LBTE | Microchip Technology Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 91 | MICROCHIP TECHNOLOGY INC | 70 °C | PLASTIC/EPOXY | LBGA | 12 X 24 MM, ROHS COMPLIANT, MO-210, LBGA-91 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | Yes | 3.3 V | Yes | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1 mm | compliant | 40 | 91 | R-PBGA-B91 | Not Qualified | COMMERCIAL | SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE | 1.4 mm | 16 | 13 MBps | IDE | ATA | 24 mm | 12 mm | |||||||||||||
![]() | Mfr Part No SST85LD1001K-60-4C-LBTE | Silicon Storage Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 91 | SILICON STORAGE TECHNOLOGY INC | 70 °C | PLASTIC/EPOXY | LBGA | LBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE | Transferred | BGA | Yes | 3.3 V | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | BOTTOM | BALL | 260 | 1 mm | unknown | 40 | 91 | R-PBGA-B91 | Not Qualified | COMMERCIAL | SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE | 1.4 mm | 16 | 13 MBps | IDE | ATA | 24 mm | 12 mm | ||||||||||||||
![]() | Mfr Part No XQ7Z030-1RF900I | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | XILINX INC | PLASTIC/EPOXY | BGA | 31 X 31 MM, 1 MM PITCH, BGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | No | e0 | TIN LEAD | 8542.31.00.01 | BOTTOM | BALL | 1 mm | not_compliant | S-PBGA-B900 | Not Qualified | PROGRAMMABLE SoC | 3.44 mm | 31 mm | 31 mm | |||||||||||||||||||||||
![]() | Mfr Part No TC8522XBG(O2) | Toshiba America Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No RTL8110SBL-LF | Realtek Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | YES | 128 | REALTEK SEMICONDUCTOR CORP | 70 °C | PLASTIC/EPOXY | QFP | QFP128,.63X.87,20 | RECTANGULAR | FLATPACK | Contact Manufacturer | 5.5 V | 4.5 V | 5 V | 8542.31.00.01 | QUAD | GULL WING | NOT SPECIFIED | 0.5 mm | unknown | NOT SPECIFIED | R-PQFP-G128 | Not Qualified | COMMERCIAL | SERIAL IO/COMMUNICATION CONTROLLER, LAN | NO | 1 | ASYNC, BIT | ||||||||||||||||||||
![]() | Mfr Part No MN864602 | Panasonic Electronic Components | Datasheet | - | - | Min: 1 Mult: 1 | PANASONIC CORP | Active | 8542.31.00.01 | unknown | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No HPFC-5700B | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | BROADCOM LTD | , | Obsolete | 8542.31.00.01 | unknown | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No HPFC-5700B | Agilent Technologies Inc | Datasheet | - | - | Min: 1 Mult: 1 | AGILENT TECHNOLOGIES INC | , | Transferred | 8542.31.00.01 | unknown | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU6CG-2SBVA484E | AMD Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | YES | 484 | XILINX INC | 100 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.876 V | 0.825 V | 0.85 V | 8542.31.00.01 | BOTTOM | BALL | 0.8 mm | unknown | S-PBGA-B484 | OTHER | PROGRAMMABLE SoC | 2.61 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 19 mm | 19 mm | ||||||||||||||||||||
![]() | Mfr Part No SCN2672BC4N40 | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | PHILIPS SEMICONDUCTORS | 70 °C | PLASTIC/EPOXY | DIP | DIP-40 | DIP40,.6 | RECTANGULAR | IN-LINE | Transferred | No | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T40 | Not Qualified | COMMERCIAL | |||||||||||||||||||||||||
![]() | Mfr Part No PCM16C010VJG | Texas Instruments | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | NATIONAL SEMICONDUCTOR CORP | 70 °C | PLASTIC/EPOXY | LFQFP | LFQFP, QFP100,.63SQ,20 | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | No | 5.25 V | 4.75 V | 5 V | e0 | TIN LEAD | 8542.31.00.01 | QUAD | GULL WING | 0.5 mm | unknown | S-PQFP-G100 | Not Qualified | COMMERCIAL | MICROPROCESSOR CIRCUIT | 6.5 mA | 1.6 mm | 14 mm | 14 mm | |||||||||||||||||
![]() | Mfr Part No MD3831-D32-V3-X-P | SanDisk Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 69 | SANDISK CORP | 85 °C | -40 °C | PLASTIC/EPOXY | LFBGA | LFBGA, | RECTANGULAR | GRID ARRAY, LOW PROFILE, FINE PITCH | Obsolete | BGA | 3.6 V | 2.7 V | 3.3 V | 8542.31.00.01 | BOTTOM | BALL | 0.8 mm | unknown | 69 | R-PBGA-B69 | INDUSTRIAL | SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE | 1.3 mm | 16 | 20 MBps | ISA | 12 mm | 9 mm |
XCZU5EV-1LSFVC784I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
BCM5632
Broadcom Limited
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XQ7Z030-2RF900I
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XQ7Z030-2RF900I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU7CG-2LFFVF1517E
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
UPD7262D
NEC Electronics Group
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
UPD7262D
Renesas Electronics Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
NAS8702U1
Heartland Precision Fasteners Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SST85LD1001K-60-4C-LBTE
Microchip Technology Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SST85LD1001K-60-4C-LBTE
Silicon Storage Technology
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XQ7Z030-1RF900I
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
TC8522XBG(O2)
Toshiba America Electronic Components
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
RTL8110SBL-LF
Realtek Semiconductor
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
MN864602
Panasonic Electronic Components
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
HPFC-5700B
Broadcom Limited
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
HPFC-5700B
Agilent Technologies Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU6CG-2SBVA484E
AMD Xilinx
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SCN2672BC4N40
Philips Semiconductors
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PCM16C010VJG
Texas Instruments
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
MD3831-D32-V3-X-P
SanDisk Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
