The category is 'Embedded - Microcontrollers - Application Specific'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Number of I/O Lines | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | Number of Ports | uPs/uCs/Peripheral ICs Type | Supply Current-Max | Seated Height-Max | Address Bus Width | Boundary Scan | Low Power Mode | External Data Bus Width | RAM (words) | Number of Serial I/Os | Bus Compatibility | Data Transfer Rate-Max | Communication Protocol | Information Access Method | Data Encoding/Decoding Method | Host Interface Standard | Length | Width |
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![]() | Mfr Part No SCN26562C4N48 | NXP Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | NO | 48 | 16 MHz | NXP SEMICONDUCTORS | 8 | 70 °C | PLASTIC/EPOXY | DIP | PLASTIC, DIP-48 | DIP48,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | 5.25 V | 4.75 V | 5 V | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | compliant | 48 | R-PDIP-T48 | Not Qualified | COMMERCIAL | SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL | 275 mA | 4.9 mm | 6 | NO | NO | 8 | 0 | 2 | 0.3125 MBps | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; X.75; BISYNC; EXT SYNC; ADCCP; DDCMP | NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL (MANCHESTER) | 62.1 mm | 15.24 mm | ||||||||||||||
![]() | Mfr Part No SCN26562C4N48 | YAGEO Corporation | Datasheet | - | - | Min: 1 Mult: 1 | NO | 48 | 16 MHz | PHILIPS COMPONENTS | 70 °C | PLASTIC/EPOXY | , | RECTANGULAR | IN-LINE | Obsolete | 5.25 V | 4.75 V | 5 V | 8542.31.00.01 | DUAL | THROUGH-HOLE | unknown | R-PDIP-T48 | Not Qualified | COMMERCIAL | SERIAL IO/COMMUNICATION CONTROLLER, MULTI PROTOCOL | 6 | NO | NO | 8 | 2 | 0.3125 MBps | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; BISYNC; X.25; X.75; DDCMP; ADCCP | NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL (MANCHESTER) | |||||||||||||||||||||||||
![]() | Mfr Part No SCN26562C4N48 | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | NO | 48 | PHILIPS SEMICONDUCTORS | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP48,.6 | DIP48,.6 | RECTANGULAR | IN-LINE | Transferred | No | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T48 | Not Qualified | COMMERCIAL | 275 mA | ||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU3CG-1LSFVC784I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 784 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FCBGA-784 | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Yes | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | CAN, I2C, SPI, UART | 23 mm | 23 mm | ||||||||||||||||||||||||
![]() | Mfr Part No BCM1160 | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | NO | 276 | BROADCOM CORP | 1 | CERAMIC, METAL-SEALED COFIRED | PGA | PGA, | SQUARE | GRID ARRAY | Obsolete | PGA | No | 2.5 V | 8542.31.00.01 | PERPENDICULAR | PIN/PEG | compliant | 276 | S-CPGA-P276 | Not Qualified | MICROPROCESSOR CIRCUIT | |||||||||||||||||||||||||||||||||
![]() | Mfr Part No PSD75/16 | POWER SEMICONDUCTORS INC | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SST55LC100-45-I-TQWE | Silicon Storage Technology | Datasheet | - | - | Min: 1 Mult: 1 | YES | 100 | SILICON STORAGE TECHNOLOGY INC | 85 °C | -40 °C | PLASTIC/EPOXY | TFQFP | TFQFP, | SQUARE | FLATPACK, THIN PROFILE, FINE PITCH | Transferred | QFP | Yes | 3.465 V | 3.165 V | 3.3 V | e3 | Matte Tin (Sn) | ALSO REQUIRES 5V SUPPLY | 8542.31.00.01 | QUAD | GULL WING | 260 | 0.5 mm | unknown | 40 | 100 | S-PQFP-G100 | Not Qualified | INDUSTRIAL | SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE | 1.2 mm | 16 | ATA; IDE | 14 mm | 14 mm | ||||||||||||||||||
![]() | Mfr Part No LSI53C1000R | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | YES | 458 | 66 MHz | BROADCOM INC | 70 °C | PLASTIC/EPOXY | BGA | 35 X 35 MM, 1.27 MM PITCH, PLASTIC, MO-151, BGA-458 | BGA456,26X26,50 | SQUARE | GRID ARRAY | Active | 3.47 V | 3.13 V | 3.3 V | e0 | 3A991.A.2 | TIN LEAD | 8542.31.00.01 | BOTTOM | BALL | 225 | 1.27 mm | compliant | 30 | S-PBGA-B458 | Not Qualified | COMMERCIAL | BUS CONTROLLER, SCSI | 800 mA | 2.5 mm | 64 | 64 | PCI | 160 MBps | 35 mm | 35 mm | |||||||||||||||||
![]() | Mfr Part No R65C22P2 | Conexant Systems Inc | Datasheet | - | - | Min: 1 Mult: 1 | NO | 40 | 2 MHz | CONEXANT SYSTEMS | 16 | 70 °C | PLASTIC/EPOXY | DIP | PLASTIC, DIP-40 | DIP40,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.25 V | 4.75 V | 5 V | e0 | EAR99 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | compliant | 40 | R-PDIP-T40 | Not Qualified | COMMERCIAL | 2 | PARALLEL IO PORT, GENERAL PURPOSE | 3.8 mA | 5.08 mm | 8 | 52.07 mm | 15.24 mm | |||||||||||||||||
![]() | Mfr Part No XCZU7EG-1LFFVC1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 1156 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FCBGA-1156 | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Active | Yes | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1156 | INDUSTRIAL | PROGRAMMABLE SoC | 3.51 mm | CAN, I2C, SPI, UART | 35 mm | 35 mm | ||||||||||||||||||||||||||
![]() | Mfr Part No RX8900SA | Seiko Epson Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 14 | 0.032 MHz | SEIKO EPSON CORP | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP-14 | RECTANGULAR | SMALL OUTLINE | Active | Yes | 5.5 V | 2.5 V | 3 V | e3 | EAR99 | Tin (Sn) | 8542.39.00.01 | DUAL | GULL WING | 260 | 1.27 mm | not_compliant | 30 | R-PDSO-G14 | INDUSTRIAL | TIMER, REAL TIME CLOCK | 3.3 mm | SERIAL(I2C) | 10.1 mm | 5 mm | |||||||||||||||||||||
![]() | Mfr Part No RX8900SA | Epson Electronics America Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 14 | 0.032 MHz | SEIKO EPSON CORP | 85 °C | -40 °C | PLASTIC/EPOXY | SOP | SOP, | RECTANGULAR | SMALL OUTLINE | Active | SOIC | Yes | 5.5 V | 2.5 V | 3 V | e3 | EAR99 | Tin (Sn) | 8542.39.00.01 | DUAL | GULL WING | 260 | 1.27 mm | unknown | 30 | 14 | R-PDSO-G14 | INDUSTRIAL | TIMER, REAL TIME CLOCK | 3.3 mm | SERIAL(I2C) | 10.1 mm | 5 mm | |||||||||||||||||||
![]() | Mfr Part No BCM5020KPF | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No SCN2661AC1N24 | Philips Semiconductors | Datasheet | - | - | Min: 1 Mult: 1 | NO | 24 | 4.915 MHz | PHILIPS SEMICONDUCTORS | 70 °C | PLASTIC/EPOXY | DIP | DIP, DIP24,.4 | DIP24,.4 | RECTANGULAR | IN-LINE | Obsolete | No | 5.25 V | 4.75 V | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | 2.54 mm | unknown | R-PDIP-T24 | Not Qualified | COMMERCIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | NO | 8 | 2 | ASYNC, BIT; BISYNC | |||||||||||||||||||||||
![]() | Mfr Part No PSD413A1-C-15J | Waferscale Integration Inc | Datasheet | - | - | Min: 1 Mult: 1 | YES | 68 | WAFERSCALE INTEGRATION INC | 40 | 70 °C | PLASTIC/EPOXY | QCCJ | PLASTIC, LDCC-68 | SQUARE | CHIP CARRIER | Transferred | 5.5 V | 4.5 V | 5 V | QUAD | J BEND | unknown | S-PQCC-J68 | Not Qualified | COMMERCIAL | 5 | PARALLEL IO PORT, GENERAL PURPOSE | 4.57 mm | 24.18 mm | 24.2316 mm | |||||||||||||||||||||||||||||
![]() | Mfr Part No PI7C8150AMA-33 | Pericom Semiconductor Corporation | Datasheet | - | - | Min: 1 Mult: 1 | YES | 208 | 33 MHz | PERICOM SEMICONDUCTOR CORP | 85 °C | PLASTIC/EPOXY | FQFP | FQFP, | SQUARE | FLATPACK, FINE PITCH | Obsolete | QFP | No | 3.6 V | 3 V | 3.3 V | e0 | EAR99 | TIN LEAD | 8542.31.00.01 | QUAD | GULL WING | 0.5 mm | compliant | 208 | S-PQFP-G208 | Not Qualified | OTHER | BUS CONTROLLER, PCI | 3.8 mm | 32 | 32 | 28 mm | 28 mm | ||||||||||||||||||||
![]() | Mfr Part No RV-3032-C7-TA-QC-MG01 | Micro Crystal AG | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU5EG-2LSFVC784E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 784 | ADVANCED MICRO DEVICES INC | 4 | 110 °C | PLASTIC/EPOXY | FBGA | FCBGA-784 | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Yes | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | OTHER | PROGRAMMABLE SoC | 3.32 mm | CAN, I2C, SPI, UART | 23 mm | 23 mm | |||||||||||||||||||||||||
![]() | Mfr Part No ICS1394N | Integrated Circuit Systems Inc | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU9CG-1LFFVC900I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | YES | 900 | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FCBGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Active | Yes | 0.85 V | e1 | TIN SILVER COPPER | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm |
SCN26562C4N48
NXP Semiconductors
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SCN26562C4N48
YAGEO Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SCN26562C4N48
Philips Semiconductors
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU3CG-1LSFVC784I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
BCM1160
Broadcom Limited
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PSD75/16
POWER SEMICONDUCTORS INC
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SST55LC100-45-I-TQWE
Silicon Storage Technology
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
LSI53C1000R
Broadcom Limited
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
R65C22P2
Conexant Systems Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU7EG-1LFFVC1156I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
RX8900SA
Seiko Epson Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
RX8900SA
Epson Electronics America Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
BCM5020KPF
Broadcom Limited
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
SCN2661AC1N24
Philips Semiconductors
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PSD413A1-C-15J
Waferscale Integration Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
PI7C8150AMA-33
Pericom Semiconductor Corporation
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
RV-3032-C7-TA-QC-MG01
Micro Crystal AG
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU5EG-2LSFVC784E
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
ICS1394N
Integrated Circuit Systems Inc
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
XCZU9CG-1LFFVC900I
AMD
Package:Embedded - Microcontrollers - Application Specific
Price: please inquire
