The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Brand | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Mfr | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Number of Terminations | Temperature Coefficient | Type | Resistance | Composition | Power (Watts) | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | JESD-30 Code | Number of Outputs | Qualification Status | Failure Rate | Power Supplies | Temperature Grade | Interface | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Product Type | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Features | Product Category | Height Seated (Max) | Length | Width |
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 | Mfr Part No XCVM1802-2MLEVSVD1760 | AMD | Datasheet | 474 | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 726 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS016C3U19I2LG | ALTERA | Datasheet | 595 |
| Min: 1 Mult: 1 | 484-BFBGA, FCBGA | YES | 484-UBGA (19x19) | 484 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS016C3U19I2LG | 1.2 GHz | Yes | SMD/SMT | 192 | 20000 LAB | 160000 LE | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | 964675 | Active | NOT SPECIFIED | 5.47 | Non-Compliant | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0.423288 oz | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | S-PBGA-B484 | 192 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 192 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 160K Logic Elements | 160000 | 2 Core | -- | SoC FPGA | 19 mm | 19 mm | ||||||||||||||||
| Mfr Part No XCZU1EG-L2SFVC784E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Axial | Axial | AMD | - | Tray | Active | -55°C ~ 150°C | Bulk | PTF | 0.145 Dia x 0.375 L (3.68mm x 9.53mm) | ±0.1% | Active | 2 | ±15ppm/°C | 150 kOhms | Metal Film | 0.25W, 1/4W | -- | CAN/Serial I2C/SPI/U | 533MHz, 600MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | - | - | Moisture Resistant | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-2MSENSVF1369 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 316 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU55DR-1FSVE1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | - | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC DR | 500MHz, 1.2GHz | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq® UltraScale+™ RFSoC | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XAZU1EG-1SFVC784Q | AMD | Datasheet | 464 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | AMD | 180 | Tray | Active | -40°C ~ 125°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 82K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-2MSIVSVD1760 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 726 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU55DR-2FSVE1156I | AMD | Datasheet | 700 |
| Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | - | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC DR | 533MHz, 1.3GHz | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq® UltraScale+™ RFSoC | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU55DR-L1FFVE1156I | AMD | Datasheet | 610 |
| Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | - | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC DR | 500MHz, 1.2GHz | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq® UltraScale+™ RFSoC | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-2LLENSVF1369 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 424 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-1MLIVSVA2197 | AMD | Datasheet | 599 |
| Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 770 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU1CG-2UBVA494I | AMD | Datasheet | 1708 |
| Min: 1 Mult: 1 | 494-WFBGA, FCBGA | 494-FCBGA (14x14) | AMD | 82 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.333GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | MPU, FPGA | Zynq®UltraScale+™ FPGA, 81K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1802-2MSEVIVA1596 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Axial | Axial | AMD | 500 | Tray | Active | -55°C ~ 150°C | Tape & Reel (TR) | PTF | 0.145 Dia x 0.375 L (3.68mm x 9.53mm) | ±0.1% | Active | 2 | ±15ppm/°C | 715 kOhms | Metal Film | 0.25W, 1/4W | -- | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | Moisture Resistant | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU57DR-2FSVE1156I | AMD | Datasheet | 751 |
| Min: 1 Mult: 1 | Axial | Axial | AMD | - | Tray | Active | -55°C ~ 150°C | Tape & Reel (TR) | PTF | 0.145 Dia x 0.375 L (3.68mm x 9.53mm) | ±0.1% | Active | 2 | ±5ppm/°C | 243 Ohms | Metal Film | 0.25W, 1/4W | -- | 533MHz, 1.3GHz | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq® UltraScale+™ RFSoC | - | Moisture Resistant | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU1EG-1SFVA625I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | AMD | - | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ | CAN/Serial I2C/SPI/U | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-2LSEVFVC1596 | AMD | Datasheet | 459 | - | Min: 1 Mult: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 748 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-2MSEVSVD1760 | AMD | Datasheet | 748 | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 402 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | Adaptive Compute Acc | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-2HSIVSVA2197 | AMD | Datasheet | 407 | - | Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 770 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ AI Core | 800MHz, 1.65GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3EG-L2UBVA530E | AMD | Datasheet | 656 |
| Min: 1 Mult: 1 | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | AMD | 82 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3EG-1UBVA530E | AMD | Datasheet | 1790 |
| Min: 1 Mult: 1 | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | AMD | 82 | Tray | Active | 0°C ~ 100°C (TJ) | - | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - |
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XCVM1802-2MLEVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS016C3U19I2LG
ALTERA
Package:Embedded - System On Chip (SoC)
1,130.114670
-
XCZU1EG-L2SFVC784E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1302-2MSENSVF1369
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU55DR-1FSVE1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XAZU1EG-1SFVC784Q
AMD
Package:Embedded - System On Chip (SoC)
675.864556
-
XCVM1402-2MSIVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU55DR-2FSVE1156I
AMD
Package:Embedded - System On Chip (SoC)
19,994.772647
-
XCZU55DR-L1FFVE1156I
AMD
Package:Embedded - System On Chip (SoC)
17,385.563551
-
XCVM1402-2LLENSVF1369
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1902-1MLIVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
35,350.439580
-
XCZU1CG-2UBVA494I
AMD
Package:Embedded - System On Chip (SoC)
358.073671
-
XCVC1802-2MSEVIVA1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU57DR-2FSVE1156I
AMD
Package:Embedded - System On Chip (SoC)
21,260.025205
-
XCZU1EG-1SFVA625I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1402-2LSEVFVC1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1302-2MSEVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1902-2HSIVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU3EG-L2UBVA530E
AMD
Package:Embedded - System On Chip (SoC)
787.864945
-
XCZU3EG-1UBVA530E
AMD
Package:Embedded - System On Chip (SoC)
495.235773