The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Clock Frequency-Max | Core | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Finish | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Supply Current | Speed | RAM Size | Core Processor | Peripherals | Clock Frequency | Program Memory Size | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Gates | Boundary Scan | Speed Grade | RAM (words) | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Cores | Bus Compatibility | Number of Equivalent Gates | Flash Size | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No A2F500M3G-1CS288 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 288-TFBGA, CSPBGA | YES | 288-CSP (11x11) | 288 | A2F500 | 100 MHz | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | A2F500M3G-1CS288 | 100 MHz | Microchip Technology | Yes | MCU - 31, FPGA - 78 | - | 6000 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA288,21X21,20 | BGA288,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 5.24 | N | No | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | SmartFusion | 0°C ~ 85°C (TJ) | Tray | A2F500 | e0 | TIN LEAD SILVER | 8542.39.00.01 | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | S-PBGA-B288 | 78 | Not Qualified | 1.5,1.8,2.5,3.3 V | OTHER | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 78 | 11520 CLBS, 500000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11520 | 11520 | 1 Core | 500000 | 512KB | 11 mm | 11 mm | ||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-1FG484I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | A2F200 | ARM Cortex M3 | 64 kB | 60 | - | - | 100 MHz | + 100 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 161 I/O | - | 2000 LE | Tray | Active | N | SmartFusion | -40°C ~ 100°C (TJ) | Tray | A2F200 | 1 mA | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | 256 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 200000 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-1FCSG325 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S060 | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | M2S060T-1FCSG325 | 166 MHz | Microchip Technology | Yes | 3 | 200 | 4710 LAB | 56520 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.82 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 11 mm | 11 mm | |||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-1FGG676I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 676-BGA | 676-FBGA (27x27) | M2S060 | ARM Cortex M3 | 64 kB | 40 | - | - | 166 MHz | Microchip Technology | Yes | 387 | 4710 LAB | 56520 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | SmartFusion2 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-1FCS325I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | M2S025 | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | M2S025TS-1FCS325I | 166 MHz | Microchip Technology | Yes | SMD/SMT | 180 | 2308 LAB | 27696 LE | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.88 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | S-PBGA-B325 | 180 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 11 mm | 11 mm | ||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-FCS325I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | FCBGA-325 | 325-FCBGA (11x11) | M2S025 | ARM Cortex M3 | 64 kB | 176 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 180 | 2308 LAB | 27696 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090TS-1FCS325 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FCBGA-325 | YES | 325-FCBGA (11x13.5) | 325 | M2S090 | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | M2S090TS-1FCS325 | 166 MHz | Microchip Technology | Yes | SMD/SMT | 180 | 7193 LAB | 86316 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA325,21X21,20 | BGA325,21X21,20 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.84 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | R-PBGA-B325 | 180 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.16 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 13.5 mm | 11 mm | |||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-1VF400 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | M2S025 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S025-1VF400 | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | SMD/SMT | 207 | 2308 LAB | 27696 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.87 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 160 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 160 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 25K Logic Modules | 23988 | 1 Core | 256KB | 17 mm | 17 mm | ||||||||||||||||||||||||||||||
| Mfr Part No M2S050-1FGG896 | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-896 | YES | 896-FBGA (31x31) | 896 | M2S050 | ARM Cortex M3 | 64 kB | 27 | MICROSEMI CORP | - | - | M2S050-1FGG896 | 166 MHz | Microchip Technology | Yes | SMD/SMT | 377 | 4695 LAB | 56340 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.26 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B896 | 377 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 377 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||
 | Mfr Part No XCZU2EG-1SBVA484E | Xilinx Inc. | Datasheet | 416 | - | Min: 1 Mult: 1 | 11 Weeks | 484-BFBGA, FCBGA | 82 | 0°C~100°C TJ | Tray | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-FG676I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | 676-BGA | 676-FBGA (27x27) | M2S060 | ARM Cortex M3 | 64 kB | 40 | - | - | 166 MHz | Microchip Technology | Yes | 387 | 4710 LAB | 56520 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | SmartFusion2 | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 5CSXFC5D6F31C7N | Intel | Datasheet | 1762 |
| Min: 1 Mult: 1 | 8 Weeks | 896-BGA | YES | MCU - 181, FPGA - 288 | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SX | e1 | Active | 3 (168 Hours) | 896 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | NOT SPECIFIED | 5CSXFC5 | S-PBGA-B896 | 288 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | 2mm | 31mm | 31mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4CG-1FBVB900I | Xilinx Inc. | Datasheet | 668 |
| Min: 1 Mult: 1 | 11 Weeks | 900-BBGA, FCBGA | 204 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC7Z012S-1CLG485I | Xilinx Inc. | Datasheet | 792 |
| Min: 1 Mult: 1 | 10 Weeks | 484-LFBGA, CSPBGA | YES | 150 | -40°C~100°C TJ | Tray | 2016 | Zynq®-7000 | e3 | yes | Active | 3 (168 Hours) | 485 | Matte Tin (Sn) | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | NOT SPECIFIED | S-PBGA-B485 | 1.05V | 0.95V | 667MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 667MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | YES | 256000 | Artix™-7 FPGA, 55K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.6mm | 19mm | 19mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 10AS066K3F35E2SG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 1152-BBGA, FCBGA | YES | 396 | 0°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B1152 | 396 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 660K Logic Elements | 660000 | 3.5mm | 35mm | 35mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 5CSEBA5U19I7N | Intel | Datasheet | 2400 | - | Min: 1 Mult: 1 | 8 Weeks | 484-FBGA | YES | MCU - 151, FPGA - 66 | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SE | e1 | Active | 3 (168 Hours) | 484 | TIN SILVER COPPER | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.1V | 0.8mm | 40 | 5CSEBA5 | S-PBGA-B484 | 66 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 622MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | 1.9mm | 19mm | 19mm | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEMA5F31C6N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 896-BGA | YES | MCU - 181, FPGA - 288 | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | e1 | Active | 3 (168 Hours) | 896 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | NOT SPECIFIED | 5CSEMA5 | S-PBGA-B896 | 288 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | 2mm | 31mm | 31mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 5CSEBA4U23I7N | Intel | Datasheet | 960 | - | Min: 1 Mult: 1 | 8 Weeks | 672-FBGA | YES | MCU - 181, FPGA - 145 | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SE | e1 | Active | 3 (168 Hours) | 672 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1.1V | 0.8mm | NOT SPECIFIED | 5CSEBA4 | S-PBGA-B672 | 145 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 40K Logic Elements | 40000 | 1.85mm | 23mm | 23mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XCZU6CG-1FFVC900E | Xilinx Inc. | Datasheet | 186 | - | Min: 1 Mult: 1 | 11 Weeks | 900-BBGA, FCBGA | 204 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA2U19C7N | Intel | Datasheet | 8000 | - | Min: 1 Mult: 1 | 8 Weeks | 484-FBGA | YES | MCU - 151, FPGA - 66 | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | Active | 3 (168 Hours) | 484 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | S-PBGA-B484 | 66 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Elements | 25000 | 1.9mm | 19mm | 19mm | RoHS Compliant |
-
A2F500M3G-1CS288
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F200M3F-1FG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060T-1FCSG325
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-1FGG676I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025TS-1FCS325I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025TS-FCS325I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090TS-1FCS325
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025-1VF400
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050-1FGG896
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU2EG-1SBVA484E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-FG676I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSXFC5D6F31C7N
Intel
Package:Embedded - System On Chip (SoC)
207.623946
-
XCZU4CG-1FBVB900I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
1,446.310458
-
XC7Z012S-1CLG485I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
136.945189
-
10AS066K3F35E2SG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSEBA5U19I7N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSEMA5F31C6N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSEBA4U23I7N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU6CG-1FFVC900E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSEBA2U19C7N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire