The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Contact Shape | Shell Material | Supplier Device Package | Insert Material | Number of Terminals | Approvals | Base Product Number | Brand | Contact Finish Mating | Contact Sizes | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Outside Length | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Primary Material | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Part Status | Number of Terminations | Termination | ECCN Code | Temperature Coefficient | Connector Type | Type | Resistance | Number of Positions | Terminal Finish | Composition | Color | Power (Watts) | HTS Code | Fastening Type | Subcategory | Contact Type | Current Rating (Amps) | Technology | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Current Rating | Frequency | Time@Peak Reflow Temperature-Max (s) | Frequency Stability | Shell Finish | Shell Size - Insert | JESD-30 Code | Number of Outputs | Qualification Status | Housing Color | Operating Supply Voltage | ESR (Equivalent Series Resistance) | Failure Rate | Power Supplies | Temperature Grade | Note | Voltage | Load Capacitance | Speed | RAM Size | Operating Mode | Shell Size, MIL | Core Processor | Number of Poles | Frequency Tolerance | Peripherals | Program Memory Size | Connectivity | Switch Type | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Product Type | Includes | Max Frequency | Speed Grade | Primary Attributes | Number of Bands | Number of Logic Cells | Number of Cores | Flash Size | Disconnect Type | Features | Nominal Input Voltage (AC) | Product Category | IP Rating | Height Seated (Max) | Length | Width | Contact Finish Thickness - Mating | Material Flammability Rating | Ratings |
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 | Mfr Part No XCVM1302-2LLEVFVC1596 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 532 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB006R16A2I1V | Intel | Datasheet | 607 | - | Min: 1 Mult: 1 | - | - | Intel | 384 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027E4F27I3SG | ALTERA | Datasheet | 426 |
| Min: 1 Mult: 1 | FBGA-672 | YES | 672 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS027E4F27I3SG | 1.2 GHz | Yes | SMD/SMT | 240 | 33750 LAB | 270000 LE | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA672,26X26,40 | BGA672,26X26,40 | SQUARE | GRID ARRAY | 964926 | Active | NOT SPECIFIED | 5.43 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B672 | 240 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 71M6512-IM/F | Maxim Integrated | Datasheet | - | - | Min: 1 Mult: 1 | TERIDIAN SEMICONDUCTOR CORP | 71M6512-IM/F | Transferred | 5.6 | unknown | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-FG256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | A2F500 | Continental Belt | 11/5V2650 | Microchip Technology | MCU - 25, FPGA - 66 | 265 Inches | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion® | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 11 | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090TS-1FGG484M | Microchip | Datasheet | 481 | - | Min: 1 Mult: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | CUL, UL | M2S090 | 64 kB | MICROSEMI CORP | - | - | Cutler Hammer, Div of Eaton Co | DH361UGK | 166 MHz | Microchip Technology | 3 | SMD/SMT | 267 | 86316 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.8 | Yes | 1.26 V | 1.14 V | 1.2 V | -55°C ~ 125°C (TJ) | SmartFusion®2 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | Metallic | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 30 A | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | MILITARY | 600 V | 166MHz | 64KB | ARM® Cortex®-M3 | 3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | Heavy Duty | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S100S-1FCG1152I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | ABB | ACH580-BCR-046A-2+B056 | Panel | ACH580BX122 | 500 Hz | Circuit Breaker | 240 VAC | IP55 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No R9A06G037GNP#AA0 | Renesas | Datasheet | 8026 |
| Min: 1 Mult: 1 | 64-VFQFN Exposed Pad | Renesas Electronics | 25 | 128 kB | 128 kB | Renesas Electronics | 138 MHz, 276 MHz | + 85 C | Renesas Electronics America Inc | - 40 C | Yes | SMD/SMT | Tray | Active | Details | This product may require additional documentation to export from the United States. | -40°C ~ 85°C (TA) | Tray | - | Microprocessors - MPU | 1.1 V | 128KB | ARM® Cortex®-M3 | PWM | 32 bit | Microprocessors - MPU | - | 2 Core | - | Microprocessors - MPU | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU2CG-2SFVC784I | AMD | Datasheet | 2111 |
| Min: 1 Mult: 1 | Panel Mount | 784-BFBGA, FCBGA | Flange | Circular | Aluminum | 784-FCBGA (23x23) | - | TVP00RW | 20 | Amphenol Aerospace Operations | 252 | Bulk | Active | -65°C ~ 175°C | MIL-DTL-38999 Series III, Tri-Start™ TV | Receptacle Housing | For Male Pins | 41 | Threaded | Crimp | A | Shielded | Environment Resistant | Cadmium | 21-41 | Olive Drab | Contacts Not Included | 533MHz, 1.3GHz | 256KB | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 2 | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU6EG-1FFVC900E | AMD | Datasheet | 502 | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU6 | Acme Electric | AMD | 204 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090TS-FG484 | Microchip | Datasheet | 2355 |
| Min: 1 Mult: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S090 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S090TS-FG484 | 166 MHz | PEI-Genesis | 3 | 267 | 86316 LE | 85 °C | Bulk | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.86 | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | * | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-2FSVG1517I | AMD | Datasheet | 411 |
| Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 1517-FCBGA (40x40) | TXC CORPORATION | 561 | Tape & Reel (TR) | Active | -20°C ~ 70°C | 8Y | 0.079 L x 0.063 W (2.00mm x 1.60mm) | MHz Crystal | 36 MHz | ±10ppm | 80 Ohms | 8pF | 533MHz, 1.333GHz | 256KB | Fundamental | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | ±10ppm | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | 0.020 (0.50mm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-VFG400 | Microchip | Datasheet | 1768 | - | Min: 1 Mult: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S060 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S060TS-VFG400 | 166 MHz | PEI-Genesis | 3 | 207 | 56520 LE | 85 °C | Bulk | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 5.8 | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | * | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | 40 | S-PBGA-B400 | 207 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-L1FFVG1517I | AMD | Datasheet | 761 |
| Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | PEI-Genesis | 561 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090T-1FCS325I | Microchip | Datasheet | 2344 | - | Min: 1 Mult: 1 | 325-TFBGA, FCBGA | 325-FCBGA (11x13.5) | M2S090 | 64 kB | - | - | 166 MHz | PEI-Genesis | SMD/SMT | 180 | 86316 LE | Bulk | Active | -40°C ~ 100°C (TJ) | * | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 90K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1502-2LSEVSVA1596 | AMD | Datasheet | 726 | - | Min: 1 Mult: 1 | Panel Mount | 1596-BFBGA | Flange | Aluminum Alloy | 1596-BGA (37.5x37.5) | CA310 | Gold | ITT Cannon, LLC | 500 | Bulk | Metal | Active | 50V | -55°C ~ 125°C | MIL-DTL-5015, CA | Crimp | Receptacle, Female Sockets | 26 | Olive Drab | Threaded | 22A | N (Normal) | - | IP65 - Dust Tight, Water Resistant | Olive Drab Cadmium | 28-12 | 450MHz, 1.08GHz | - | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 800k Logic Cells | - | - | 20.0µin (0.51µm) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-2MSINBVB1024 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 1024-BGA (31x31) | Suntsu Electronics, Inc. | 424 | Bulk | Active | -10°C ~ 70°C | SXT224 | 0.098 L x 0.079 W (2.50mm x 2.00mm) | MHz Crystal | 14.31818 MHz | ±20ppm | 120 Ohms | 11pF | 600MHz, 1.4GHz | - | Fundamental | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | ±20ppm | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.2M Logic Cells | - | 0.026 (0.65mm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1802-2MSEVFVC1760 | AMD | Datasheet | 635 | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | PEI-Genesis | 500 | Bulk | Active | 0°C ~ 100°C (TJ) | * | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS250T-FCSG536T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 536-LFBGA | 536-BGA (16x16) | Siemens Building Technologies | 599-03156 | Microchip Technology | MCU - 136, FPGA - 168 | Tray | Active | -40°C ~ 125°C (TJ) | - | - | 2.2MB | RISC-V | DMA, PCI, PWM | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z014S-2CLG400I | AMD | Datasheet | 1883 |
| Min: 1 Mult: 1 | 1206 (3216 Metric) | 1206 | RN73R2B | KOA Speer Electronics, Inc. | 125 | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Active | -55°C ~ 155°C | RN73R | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±1% | 2 | ±10ppm/°C | 142 Ohms | Thin Film | 0.25W, 1/4W | - | 766MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 65K Logic Cells | - | Automotive AEC-Q200, Moisture Resistant | 0.028 (0.70mm) | AEC-Q200 |
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XCVM1302-2LLEVFVC1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFB006R16A2I1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS027E4F27I3SG
ALTERA
Package:Embedded - System On Chip (SoC)
1,190.566250
-
71M6512-IM/F
Maxim Integrated
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F500M3G-FG256I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090TS-1FGG484M
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S100S-1FCG1152I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
R9A06G037GNP#AA0
Renesas
Package:Embedded - System On Chip (SoC)
5.390683
-
XCZU2CG-2SFVC784I
AMD
Package:Embedded - System On Chip (SoC)
480.939949
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XCZU6EG-1FFVC900E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090TS-FG484
Microchip
Package:Embedded - System On Chip (SoC)
404.720723
-
XCZU43DR-2FSVG1517I
AMD
Package:Embedded - System On Chip (SoC)
25,864.956137
-
M2S060TS-VFG400
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU47DR-L1FFVG1517I
AMD
Package:Embedded - System On Chip (SoC)
22,632.251780
-
M2S090T-1FCS325I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1502-2LSEVSVA1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1402-2MSINBVB1024
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1802-2MSEVFVC1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
MPFS250T-FCSG536T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z014S-2CLG400I
AMD
Package:Embedded - System On Chip (SoC)
140.645107