The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | # I/Os (Max) | Base Product Number | Core | Data RAM Size | Device Logic Units | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | Family Name | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Logic Cells | Manufacturer Part Number | Maximum Clock Frequency | Maximum Number of User I/Os | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Blocks/Elements | Number of Logic Elements | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part Life Cycle Code | Process Technology | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Memory Size | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Screening Level | Speed Grade | Number of Transceivers | Primary Attributes | Max Junction Temperature (Tj) | Number of Logic Cells | Number of Cores | Flash Size | Height | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No XCZU49DR-L1FSVF1760IES9818 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-1760 | ARM Cortex A53, ARM Cortex R5F | 256 kB | 13 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | - 40 C | SMD/SMT | 674 I/O | 53160 LAB | 930300 LE | 850 mV | 16 Transceiver | 6 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XQZU49DR-L1FSRF1760I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | BGA-1760 | ARM Cortex A53, ARM Cortex R5F | 256 kB | 13 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | - 40 C | SMD/SMT | 53160 LAB | 930300 LE | 850 mV | 16 Transceiver | 6 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU6CG-2FFVC900I4931 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-900 | ARM Cortex A53, ARM Cortex R5F | 256 kB | 6.9 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | - 40 C | SMD/SMT | 220 I/O | 26825.5 LAB | 469446 LE | 850 mV | 24 Transceiver | 4 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XQZU48DR-1FFRE1156M | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FCBGA-1156 | ARM Cortex A53, ARM Cortex R5F | 256 kB | 13 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 125 C | - 55 C | SMD/SMT | 53160 LAB | 930300 LE | 850 mV | 16 Transceiver | 6 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z010-1CLG225I5021 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | BGA-225 | ARM Cortex A9 | 256 kB | 1 | 32 kB | 32 kB | 667 MHz | + 100 C | - 40 C | SMD/SMT | 84 I/O | 2200 LAB | 28000 LE | 2 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XQZU48DR-1FSQE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | BGA-1156 | ARM Cortex A53, ARM Cortex R5F | 256 kB | 13 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | - 40 C | SMD/SMT | 53160 LAB | 930300 LE | 850 mV | 16 Transceiver | 6 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MAX32655GXG T | Maxim Integrated | Datasheet | - | - | Min: 1 Mult: 1 | CTBGA-CU-81 | 2500 | Details | Reel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-1FG484I | Microchip Technology | Datasheet | 4000 |
| Min: 1 Mult: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S010 | ARM Cortex M3 | 64 kB | 60 | MICROSEMI CORP | - | - | M2S010-1FG484I | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 233 | 1007 LAB | 12084 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 10K Logic Modules | 9744 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090T-FCS325I | Microchip Technology | Datasheet | 2188 |
| Min: 1 Mult: 1 | FCBGA-325 | 325-FCBGA (11x13.5) | 180 | M2S090 | ARM Cortex M3 | 64 kB | 176 | SMARTFUSION2 | - | - | 86316 | 166 MHz | Microchip Technology | Yes | Surface Mount | SMD/SMT | 180 | 7193 LAB | 86316 | 86316 LE | 1.26(V) | 1.14(V) | 1.2(V) | -40C to 100C | 100C | -40C | Industrial | Tray | FCBGA | 65nm | Active | Yes | No | N | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 325 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 90K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090T-FGG484I | Microchip Technology | Datasheet | 2295 | - | Min: 1 Mult: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S090 | ARM Cortex M3 | 64 kB | 60 | MICROSEMI CORP | - | - | M2S090T-FGG484I | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 267 | 7193 LAB | 86316 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.78 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-FGG896I | Microchip Technology | Datasheet | 2044 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | FPBGA-896 | YES | 896-FBGA (31x31) | 896 | M2S050 | ARM Cortex M3 | 64 kB | 27 | MICROSEMI CORP | - | - | M2S050T-FGG896I | 166 MHz | Microchip Technology | Yes | SMD/SMT | 377 | 4695 LAB | 56340 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.76 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B896 | 377 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 377 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090T-FCSG325 | Microchip Technology | Datasheet | 1700 |
| Min: 1 Mult: 1 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x13.5) | 325 | M2S090 | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | M2S090T-FCSG325 | 166 MHz | Microchip Technology | Yes | 3 | 180 | 7193 LAB | 86316 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 5.78 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | 40 | R-PBGA-B325 | 180 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.16 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 13.5 mm | 11 mm | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150TS-FCV484I | Microchip Technology | Datasheet | 416 | - | Min: 1 Mult: 1 | 484-BFBGA | YES | 484-FBGA (19x19) | 484 | M2S150 | ARM Cortex M3 | 64 kB | 84 | MICROSEMI CORP | - | - | M2S150TS-FCV484I | 166 MHz | Microchip Technology | Yes | 273 | 12177 LAB | 146124 LE | Tray | PLASTIC/EPOXY | FBGA | FBGA, | SQUARE | GRID ARRAY, FINE PITCH | Active | Active | 30 | 5.87 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | No | Tin/Lead (Sn/Pb) | LG-MIN,WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 240 | 0.8 mm | compliant | S-PBGA-B484 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 3.15 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 1 Core | 512KB | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050TS-FG896I | Microchip Technology | Datasheet | 1752 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | FPBGA-896 | 896-FBGA (31x31) | M2S050 | ARM Cortex M3 | 64 kB | 27 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 377 | 4695 LAB | 56340 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-FGG484I | Microchip Technology | Datasheet | 4000 |
| Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | M2S005 | ARM Cortex M3 | 64 kB | 6,060 | 60 | - | - | 166 MHz | 209 | 1.26 V | Microchip Technology | 1.14 V | Yes | Surface Mount | SMD/SMT | 209 | 505 LAB | 6060 LE | Tray | Active | Details | FPBGA | 1.2000 V | 0.377729 oz | Industrial grade | -40 to 100 °C | Tray | SmartFusion2 | 484 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | Industrial | STD | FPGA - 5K Logic Modules | 1 Core | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010TS-FGG484 | Microchip Technology | Datasheet | 15 |
| Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S010 | ARM Cortex M3 | 64 kB | 60 | MICROSEMI CORP | - | - | M2S010TS-FGG484 | 166 MHz | FLASH | Microchip Technology | Yes | 3 | 233 | 1007 LAB | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.82 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | 0 °C | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 166 MHz | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | OTHER | 3.6 V | 1.4 V | 256 kB | 166MHz | 64 kB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 85 °C | 12084 | 1 Core | 256KB | 2.44 mm | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-1TQG144I | Microchip Technology | Datasheet | 15 |
| Min: 1 Mult: 1 | TQFP-144 | 144-TQFP (20x20) | M2S005 | ARM Cortex M3 | 64 kB | 191 kbit | 60 | - | - | 166 MHz | + 100 C | Microchip Technology | - 40 C | Yes | SMD/SMT | 84 I/O | 505 LAB | 6060 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 0.046530 oz | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090TS-1FGG676 | Microchip Technology | Datasheet | 1751 |
| Min: 1 Mult: 1 | BGA-676 | YES | 676-FBGA (27x27) | 676 | M2S090 | ARM Cortex M3 | 64 kB | 40 | MICROSEMI CORP | - | - | M2S090TS-1FGG676 | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 425 | 7193 LAB | 86316 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.81 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 425 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-VF256 | Microchip Technology | Datasheet | 15 |
| Min: 1 Mult: 1 | 256-LFBGA | 256-FPBGA (14x14) | M2S005 | ARM Cortex M3 | 64 kB | 119 | - | - | 166 MHz | Microchip Technology | Yes | 161 | 505 LAB | 6060 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150TS-1FCG1152 | Microchip Technology | Datasheet | 582 |
| Min: 1 Mult: 1 | FCBGA-1152 | 1152-FCBGA (35x35) | M2S150 | ARM Cortex M3 | 64 kB | 24 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 574 | 12177 LAB | 146124 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 150K Logic Modules | 1 Core | 512KB |
-
XCZU49DR-L1FSVF1760IES9818
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XQZU49DR-L1FSRF1760I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU6CG-2FFVC900I4931
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XQZU48DR-1FFRE1156M
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z010-1CLG225I5021
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XQZU48DR-1FSQE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
MAX32655GXG T
Maxim Integrated
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010-1FG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
102.765333
-
M2S090T-FCS325I
Microchip Technology
Package:Embedded - System On Chip (SoC)
275.774930
-
M2S090T-FGG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050T-FGG896I
Microchip Technology
Package:Embedded - System On Chip (SoC)
285.274869
-
M2S090T-FCSG325
Microchip Technology
Package:Embedded - System On Chip (SoC)
247.356281
-
M2S150TS-FCV484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050TS-FG896I
Microchip Technology
Package:Embedded - System On Chip (SoC)
305.486793
-
M2S005-FGG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
23.760588
-
M2S010TS-FGG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
102.264126
-
M2S005-1TQG144I
Microchip Technology
Package:Embedded - System On Chip (SoC)
23.367084
-
M2S090TS-1FGG676
Microchip Technology
Package:Embedded - System On Chip (SoC)
493.670718
-
M2S005-VF256
Microchip Technology
Package:Embedded - System On Chip (SoC)
31.895523
-
M2S150TS-1FCG1152
Microchip Technology
Package:Embedded - System On Chip (SoC)
672.147038