The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Core | Data RAM Size | Distributed RAM | Embedded Block RAM - EBR | Factory Pack QuantityFactory Pack Quantity | I/O Voltage | Ihs Manufacturer | Instruction Set Architecture | Interface Type | JTAG Support | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | MSL | Number of CPU Cores | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Total RAM Bits | Screening Level | Speed Grade | Primary Attributes | Max Junction Temperature (Tj) | Number of Logic Cells | Number of Cores | Flash Size | Device Core | Height | Length | Width |
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![]() | Mfr Part No M2S010T-VF256 | Microchip Technology | Datasheet | 20 | - | Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | 256-LFBGA | 256-FPBGA (14x14) | M2S010 | ARM Cortex M3 | 64 kB | 119 | - | - | 166 MHz | Microchip Technology | Yes | 138 | 1007 LAB | 12084 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 10K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S050TS-FGG484 | Microchip Technology | Datasheet | 1790 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 484-BGA | 484-FPBGA (23x23) | M2S050 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Microchip Technology | Yes | 267 | 4695 LAB | 56340 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S005S-FG484 | Microchip Technology | Datasheet | 28 |
| Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S005 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Microchip Technology | Yes | 209 | 505 LAB | 6060 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S005S-1FGG484I | Microchip Technology | Datasheet | 15 |
| Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | M2S005 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 209 | 505 LAB | 6060 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S050-FGG896I | Microchip Technology | Datasheet | 1640 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | FPBGA-896 | YES | 896-FBGA (31x31) | 896 | M2S050 | ARM Cortex M3 | 64 kB | 27 | MICROSEMI CORP | - | - | M2S050-FGG896I | 166 MHz | Microchip Technology | Yes | SMD/SMT | 377 | 4695 LAB | 56340 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.26 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B896 | 377 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 377 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S005S-VF256 | Microchip Technology | Datasheet | 20 |
| Min: 1 Mult: 1 | 256-LFBGA | 256-FPBGA (14x14) | M2S005 | ARM Cortex M3 | 64 kB | 119 | - | - | 166 MHz | Microchip Technology | Yes | 161 | 505 LAB | 6060 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 1 Core | 128KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S090-1FCSG325 | Microchip Technology | Datasheet | 1833 |
| Min: 1 Mult: 1 | FCBGA-325 | YES | 325-FCBGA (11x13.5) | 325 | M2S090 | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | M2S090-1FCSG325 | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 180 | 7193 LAB | 86316 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.78 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | R-PBGA-B325 | 180 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.16 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 13.5 mm | 11 mm | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S050TS-1FG896I | Microchip Technology | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-896 | YES | 896-FBGA (31x31) | 896 | M2S050 | ARM Cortex M3 | 64 kB | 27 | MICROSEMI CORP | - | - | M2S050TS-1FG896I | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 377 | 4695 LAB | 56340 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-896 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.84 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 1 mm | not_compliant | 896 | S-PBGA-B896 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 50K Logic Modules | 1 Core | 256KB | 31 mm | 31 mm | |||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S090-FCS325I | Microchip Technology | Datasheet | 1967 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | FCBGA-325 | YES | 325-FCBGA (11x13.5) | 325 | M2S090 | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | M2S090-FCS325I | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | SMD/SMT | 180 | 7193 LAB | 86316 LE | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA325,21X21,20 | BGA325,21X21,20 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.83 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | R-PBGA-B325 | 180 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.16 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 13.5 mm | 11 mm | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S050TS-FCS325I | Microchip Technology | Datasheet | 2084 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | M2S050 | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | M2S050TS-FCS325I | 166 MHz | FLASH | Microchip Technology | Yes | SMD/SMT | 200 | 4695 LAB | 56340 LE | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.88 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 100 °C | -40 °C | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | 166 MHz | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | 3.45 V | 1.14 V | 256 kB | 166MHz | 64 kB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | 56340 | FPGA - 50K Logic Modules | 100 °C | 56340 | 1 Core | 256KB | 1.01 mm | 11 mm | 11 mm | ||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S090-FG676I | Microchip Technology | Datasheet | 2361 |
| Min: 1 Mult: 1 | BGA-676 | YES | 676-FBGA (27x27) | 676 | M2S090 | ARM Cortex M3 | 64 kB | 40 | MICROSEMI CORP | - | - | M2S090-FG676I | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 425 | 7193 LAB | 86316 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.83 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B676 | 425 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S150-FCVG484I | Microchip Technology | Datasheet | 2278 |
| Min: 1 Mult: 1 | 484-BFBGA | YES | 484-FBGA (19x19) | 484 | M2S150 | ARM Cortex M3 | 64 kB | 84 | 1.2, 1.5, 1.8, 2.5, 3.3 V | MICROSEMI CORP | RISC | CAN/Ethernet/Serial I2C/SPI/UART/USB | Yes | - | - | M2S150-FCVG484I | 166 MHz | + 100 C | Microchip Technology | - 40 C | Yes | 4 | Surface Mount | SMD/SMT | 1 | 273 I/O | 12177 LAB | 146124 LE | Tray | PLASTIC/EPOXY | FBGA | VFBGA-484 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Active | 40 | 5.76 | Details | Yes | VFBGA | 1.26 V | 1.14 V | 1.2 V | Industrial grade | -40 to 100 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | 484 | S-PBGA-B484 | 273 | Not Qualified | 1.2 V | 1.2 V | CAN/Ethernet/Serial | 166MHz | 64 KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 32 Bit | 273 | 3.15 mm | FIELD PROGRAMMABLE GATE ARRAY | Industrial | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | ARM Cortex-M3 | 19 mm | 19 mm | |||||||||||||||||||||||||
![]() | Mfr Part No M2S010-FGG484I | Microchip Technology | Datasheet | 20 |
| Min: 1 Mult: 1 | BGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S010 | ARM Cortex M3 | 64 kB | 400 kbit | 64 kB | 60 | MICROSEMI CORP | - | - | M2S010-FGG484I | 166 MHz | 1.26 V | + 100 C | Microchip Technology | 1.14 V | - 40 C | Yes | 3 | SMD/SMT | 233 I/O | 1007 LAB | 12084 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.76 | Details | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0.404535 oz | -40 to 100 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S060-FG676 | Microchip Technology | Datasheet | 2127 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 676-BGA | 676-FBGA (27x27) | M2S060 | ARM Cortex M3 | 64 kB | 40 | - | - | 166 MHz | Microchip Technology | Yes | 387 | 4710 LAB | 56520 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | SmartFusion2 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S150-1FCSG536I | Microchip Technology | Datasheet | 2285 |
| Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | YES | 536-CSPBGA (16x16) | 536 | M2S150 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S150-1FCSG536I | 166 MHz | Microchip Technology | Yes | 3 | 293 | 12177 LAB | 146124 LE | Tray | PLASTIC/EPOXY | BGA | FBGA-536 | BGA536,30X30,20 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.77 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | compliant | S-PBGA-B536 | 293 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 293 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S010-FG484I | Microchip Technology | Datasheet | 63 |
| Min: 1 Mult: 1 | FPBGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S010 | ARM Cortex M3 | 64 kB | 60 | MICROSEMI CORP | - | - | M2S010-FG484I | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 233 | 1007 LAB | 12084 LE | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S025T-FCSG325I | Microchip Technology | Datasheet | 114 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | FCBGA-325 | YES | 325-FCBGA (11x11) | 325 | M2S025 | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | M2S025T-FCSG325I | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | - | 180 | 2308 LAB | 27696 LE | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.78 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | S-PBGA-B325 | 180 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | 592Kbit | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 11 mm | 11 mm | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S025T-1FCSG325 | Microchip Technology | Datasheet | 1713 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | FCBGA-325 | 325-FCBGA (11x11) | M2S025 | ARM Cortex M3 | 64 kB | 176 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 180 | 2308 LAB | 27696 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S025T-FCS325 | Microchip Technology | Datasheet | 145 | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S025 | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | M2S025T-FCS325 | 166 MHz | Microchip Technology | Yes | MSL 3 - 168 hours | 180 | 2308 LAB | 27696 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.84 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | S-PBGA-B325 | 180 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | 592Kbit | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 11 mm | 11 mm | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S050T-1FGG484 | Microchip Technology | Datasheet | 1695 |
| Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | M2S050 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 267 | 4695 LAB | 56340 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 50K Logic Modules | 1 Core | 256KB |
M2S010T-VF256
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S050TS-FGG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
235.528367
M2S005S-FG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
27.603662
M2S005S-1FGG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
42.506817
M2S050-FGG896I
Microchip Technology
Package:Embedded - System On Chip (SoC)
264.133494
M2S005S-VF256
Microchip Technology
Package:Embedded - System On Chip (SoC)
37.484504
M2S090-1FCSG325
Microchip Technology
Package:Embedded - System On Chip (SoC)
201.620142
M2S050TS-1FG896I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S090-FCS325I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S050TS-FCS325I
Microchip Technology
Package:Embedded - System On Chip (SoC)
202.194071
M2S090-FG676I
Microchip Technology
Package:Embedded - System On Chip (SoC)
411.392253
M2S150-FCVG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
355.084385
M2S010-FGG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
75.952408
M2S060-FG676
Microchip Technology
Package:Embedded - System On Chip (SoC)
199.076387
M2S150-1FCSG536I
Microchip Technology
Package:Embedded - System On Chip (SoC)
272.680364
M2S010-FG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
97.844743
M2S025T-FCSG325I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S025T-1FCSG325
Microchip Technology
Package:Embedded - System On Chip (SoC)
121.370300
M2S025T-FCS325
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S050T-1FGG484
Microchip Technology
Package:Embedded - System On Chip (SoC)
235.148130
