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Embedded - System On Chip (SoC) (6000)

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Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Factory Lead Time	Lifecycle Status	Contact Plating	Mount	Package / Case	Surface Mount	Supplier Device Package	Number of Terminals	Base Product Number	Core	Data RAM Size	Distributed RAM	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	L1 Cache Data Memory	L1 Cache Instruction Memory	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Supply Voltage	Maximum Operating Temperature	Mfr	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting Styles	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Elements	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Shipping Restrictions	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Tradename	Typical Operating Supply Voltage	Operating Temperature	Packaging	Published	Series	JESD-609 Code	Pbfree Code	Part Status	Moisture Sensitivity Level (MSL)	Number of Terminations	ECCN Code	Terminal Finish	Additional Feature	HTS Code	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Supply Voltage	Terminal Pitch	Reach Compliance Code	Frequency	Time@Peak Reflow Temperature-Max (s)	Base Part Number	Pin Count	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Supply Voltage-Max (Vsup)	Power Supplies	Supply Voltage-Min (Vsup)	Interface	Max Supply Voltage	Min Supply Voltage	Speed	RAM Size	uPs/uCs/Peripheral ICs Type	Core Processor	Peripherals	Clock Frequency	Program Memory Size	Propagation Delay	Connectivity	Architecture	Data Bus Width	Number of Inputs	Seated Height-Max	Programmable Logic Type	Core Architecture	Boundary Scan	Speed Grade	Number of Transceivers	RAM (words)	Primary Attributes	Number of Registers	Number of Logic Cells	Number of Cores	Bus Compatibility	Flash Size	Height Seated (Max)	Length	Width	RoHS Status
Mfr Part No XCZU27DR-2FFVG1517I5180	Xilinx	Datasheet	-	-	Min: 1 Mult: 1					FBGA-1517					ARM Cortex A53, ARM Cortex R5F	256 kB	13 Mb	1		2 x 32 kB, 2 x 32 kB	2 x 32 kB, 2 x 32 kB				+ 100 C			- 40 C			SMD/SMT	597 I/O	53160 LAB	930300 LE																																															850 mV																								16 Transceiver					6 Core
Mfr Part No XC7Z030-L2SBG485I	Xilinx Inc.	Datasheet	792 In Stock	1: $632.218932 10: $611.430302 25: $607.180042 50: $602.959326 View all price	Min: 1 Mult: 1	10 Weeks		Copper, Silver, Tin	Surface Mount	484-FBGA, FCBGA																						130																						-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		Active	3 (168 Hours)	485	EAR99	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01		BOTTOM	BALL	NOT SPECIFIED	1V	0.8mm		800MHz	NOT SPECIFIED			S-PBGA-B485							CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV		256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA			100 ps	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					ARM	YES			256000	Kintex™-7 FPGA, 125K Logic Cells	157200			CAN; ETHERNET; I2C; SPI; UART; USB		2.44mm	19mm	19mm	ROHS3 Compliant
Mfr Part No M2S025TS-VFG400I	Microchip Technology	Datasheet	-	-	Min: 1 Mult: 1		Production (Last Updated: 2 months ago)			VFPBGA-400	YES	400-VFBGA (17x17)	400	M2S025	ARM Cortex M3	64 kB		90	MICROSEMI CORP	-	-	M2S025TS-VFG400I	166 MHz			Microchip Technology			Yes	3	SMD/SMT	207	2308 LAB	27696 LE	Tray	PLASTIC/EPOXY	LFBGA	VFBGA-400	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active		5.81	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V			-40°C ~ 100°C (TJ)	Tray		SmartFusion2	e1						Tin/Silver/Copper (Sn/Ag/Cu)		8542.39.00.01	CMOS	BOTTOM	BALL	250		0.8 mm	compliant		40			S-PBGA-B400	207	Not Qualified			1.2 V					166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB		CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		207	1.51 mm	FIELD PROGRAMMABLE GATE ARRAY						FPGA - 25K Logic Modules		27696	1 Core		256KB		17 mm	17 mm
Mfr Part No M2S050TS-1FCS325	Microchip Technology	Datasheet	-	-	Min: 1 Mult: 1		Production (Last Updated: 2 months ago)			FCBGA-325		325-FCBGA (11x11)		M2S050	ARM Cortex M3	64 kB		176		-	-		166 MHz			Microchip Technology			Yes		SMD/SMT	200	4695 LAB	56340 LE	Tray								Active			N		This product may require additional documentation to export from the United States.						0°C ~ 85°C (TJ)	Tray		SmartFusion2																															166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB		CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA										FPGA - 50K Logic Modules			1 Core		256KB
Mfr Part No M2S025TS-FCS325	Microchip Technology	Datasheet	-	-	Min: 1 Mult: 1		Production (Last Updated: 2 months ago)			325-TFBGA, FCBGA		325-FCBGA (11x11)		M2S025	ARM Cortex M3	64 kB		176		-	-		166 MHz			Microchip Technology			Yes			180	2308 LAB	27696 LE	Tray								Active			N		This product may require additional documentation to export from the United States.						0°C ~ 85°C (TJ)	Tray		SmartFusion2																															166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES		256 kB		CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA										FPGA - 25K Logic Modules			1 Core		256KB
Mfr Part No 5CSEBA2U23C8SN	Intel	Datasheet	33 In Stock	-	Min: 1 Mult: 1	8 Weeks				672-FBGA	YES																					MCU - 181, FPGA - 145																						0°C~85°C TJ	Tray	2018	Cyclone® V SE			Active	3 (168 Hours)	672				8542.39.00.01		BOTTOM	BALL	NOT SPECIFIED	1.1V	0.8mm			NOT SPECIFIED			S-PBGA-B672	145	Not Qualified		1.13V	1.11.2/3.32.5V	1.07V				600MHz	64KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		145		FIELD PROGRAMMABLE GATE ARRAY						FPGA - 25K Logic Elements		25000				1.85mm	23mm	23mm	RoHS Compliant
Mfr Part No XC7Z030-L2FBG484I	Xilinx Inc.	Datasheet	2361 In Stock	1: $317.125172 10: $299.174691 100: $282.240274 500: $266.264409 View all price	Min: 1 Mult: 1	10 Weeks				484-BBGA, FCBGA	YES																					130																						-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1		Active	3 (168 Hours)	484	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	8542.39.00.01		BOTTOM	BALL	250	1V	1mm	not_compliant	800MHz	30			S-PBGA-B484				1.05V		0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA					ARM	YES			256000	Kintex™-7 FPGA, 125K Logic Cells				CAN; ETHERNET; I2C; SPI; UART; USB		2.54mm	23mm	23mm	ROHS3 Compliant
Mfr Part No XCZU7EV-1FFVC1156I	Xilinx Inc.	Datasheet	487 In Stock	-	Min: 1 Mult: 1	11 Weeks				1156-BBGA, FCBGA																						360																						-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EV			Active	4 (72 Hours)					8542.31.00.01				NOT SPECIFIED					NOT SPECIFIED													500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA										Zynq®UltraScale+™ FPGA, 504K+ Logic Cells									ROHS3 Compliant
Mfr Part No XCZU4CG-L1SFVC784I	Xilinx Inc.	Datasheet	492 In Stock	1: $1,410.761853 10: $1,364.373165 25: $1,354.888942 50: $1,345.470647 View all price	Min: 1 Mult: 1	11 Weeks				784-BFBGA, FCBGA	YES																					252																						-40°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			Active	4 (72 Hours)	784			IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)	8542.31.00.01		BOTTOM	BALL	NOT SPECIFIED	0.72V				NOT SPECIFIED			S-PBGA-B784										500MHz, 1.2GHz	256KB	MICROPROCESSOR CIRCUIT	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA										Zynq®UltraScale+™ FPGA, 192K+ Logic Cells									ROHS3 Compliant
Mfr Part No XCZU9EG-2FFVC900E	Xilinx Inc.	Datasheet	560 In Stock	1: $3,837.656441 10: $3,711.466578 25: $3,685.666909 50: $3,660.046584 View all price	Min: 1 Mult: 1	11 Weeks				900-BBGA, FCBGA																						204																						0°C~100°C TJ	Tray	2013	Zynq® UltraScale+™ MPSoC EG		yes	Active	4 (72 Hours)					8542.31.00.01				NOT SPECIFIED					NOT SPECIFIED													533MHz, 600MHz, 1.3GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA										Zynq®UltraScale+™ FPGA, 599K+ Logic Cells									ROHS3 Compliant
Mfr Part No XCZU2CG-1SBVA484E	Xilinx Inc.	Datasheet	2011 In Stock	1: $252.256070 10: $237.977424 100: $224.507005 500: $211.799061 View all price	Min: 1 Mult: 1	11 Weeks				484-BFBGA, FCBGA																						82																						0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC CG			Active	4 (72 Hours)					8542.31.00.01				NOT SPECIFIED					NOT SPECIFIED													500MHz, 1.2GHz	256KB		Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	DMA, WDT				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA										Zynq®UltraScale+™ FPGA, 103K+ Logic Cells									ROHS3 Compliant
Mfr Part No M2S150TS-1FCV484I	Microchip Technology	Datasheet	-	-	Min: 1 Mult: 1					484-BFBGA	YES	484-FBGA (19x19)	484	M2S150	ARM Cortex M3	64 kB		84	MICROSEMI CORP	-	-	M2S150TS-1FCV484I	166 MHz			Microchip Technology			Yes			273	12177 LAB	146124 LE	Tray	PLASTIC/EPOXY	FBGA	VFBGA-484		SQUARE	GRID ARRAY, FINE PITCH	Active	Active	30	5.84	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V			-40°C ~ 100°C (TJ)	Tray		SmartFusion2	e0	No					Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01		BOTTOM	BALL	240		0.8 mm	not_compliant					S-PBGA-B484										166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES		512 kB		CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA			3.15 mm	FIELD PROGRAMMABLE GATE ARRAY						FPGA - 150K Logic Modules			1 Core		512KB		19 mm	19 mm
Mfr Part No 10AS016E3F29E2LG	Intel	Datasheet	-	-	Min: 1 Mult: 1	8 Weeks				780-BBGA, FCBGA	YES																					288																						0°C~100°C TJ	Tray		Arria 10 SX			Active	3 (168 Hours)	780				8542.39.00.01		BOTTOM	BALL	NOT SPECIFIED	0.9V	1mm			NOT SPECIFIED			S-PBGA-B780	288	Not Qualified		0.93V	0.9V	0.87V				1.5GHz	256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT				EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		288		FIELD PROGRAMMABLE GATE ARRAY						FPGA - 160K Logic Elements		160000				3.35mm	29mm	29mm	RoHS Compliant
Mfr Part No 5CSEMA6U23I7N	Intel	Datasheet	2400 In Stock	-	Min: 1 Mult: 1	8 Weeks				672-FBGA	YES																					MCU - 181, FPGA - 145																						-40°C~100°C TJ	Tray	2018	Cyclone® V SE			Active	3 (168 Hours)	672				8542.39.00.01		BOTTOM	BALL	NOT SPECIFIED	1.1V	0.8mm			NOT SPECIFIED	5CSEMA6		S-PBGA-B672	145	Not Qualified		1.13V	1.11.2/3.32.5V	1.07V				800MHz	64KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		145		FIELD PROGRAMMABLE GATE ARRAY						FPGA - 110K Logic Elements		110000				1.85mm	23mm	23mm	RoHS Compliant
Mfr Part No 5CSEBA2U19C8SN	Intel	Datasheet	8000 In Stock	-	Min: 1 Mult: 1	8 Weeks				484-FBGA	YES																					MCU - 151, FPGA - 66																						0°C~85°C TJ	Tray	2018	Cyclone® V SE			Active	3 (168 Hours)	484						BOTTOM	BALL	NOT SPECIFIED	1.1V	0.8mm			NOT SPECIFIED			S-PBGA-B484	66	Not Qualified		1.13V	1.11.2/3.32.5V	1.07V				600MHz	64KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA, POR, WDT				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA		66		FIELD PROGRAMMABLE GATE ARRAY						FPGA - 25K Logic Elements		25000				1.9mm	19mm	19mm	RoHS Compliant
Mfr Part No XC7Z014S-1CLG400C	Xilinx Inc.	Datasheet	2689 In Stock	-	Min: 1 Mult: 1	10 Weeks				400-LFBGA, CSPBGA	YES																					125																						0°C~85°C TJ	Tray	2016	Zynq®-7000	e3	yes	Active	3 (168 Hours)	400		Matte Tin (Sn)		8542.31.00.01		BOTTOM	BALL	NOT SPECIFIED	1V	0.8mm			NOT SPECIFIED			S-PBGA-B400				1.05V		0.95V				667MHz	256KB		Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	667MHz			CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA						YES			256000	Artix™-7 FPGA, 65K Logic Cells				CAN; ETHERNET; I2C; SPI; UART; USB		1.6mm	17mm	17mm	ROHS3 Compliant
Mfr Part No M2S150TS-1FCS536	Microchip Technology	Datasheet	-	-	Min: 1 Mult: 1					536-LFBGA, CSPBGA		536-CSPBGA (16x16)		M2S150	ARM Cortex M3	64 kB		90		-	-		166 MHz	1.26 V		Microchip Technology	1.14 V		Yes			293	12177 LAB	146124 LE	Tray								Active			N		This product may require additional documentation to export from the United States.					1.2000 V	0 to 85 °C	Tray		SmartFusion2																				536											166MHz	64KB		ARM® Cortex®-M3	DDR, PCIe, SERDES		512 kB		CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA							1			FPGA - 150K Logic Modules			1 Core		512KB
Mfr Part No XCZU3EG-1SFVA625E	Xilinx Inc.	Datasheet	52 In Stock	-	Min: 1 Mult: 1	11 Weeks				625-BFBGA, FCBGA																						180																						0°C~100°C TJ	Tray	2016	Zynq® UltraScale+™ MPSoC EG			Active	4 (72 Hours)					8542.31.00.01				NOT SPECIFIED					NOT SPECIFIED													500MHz, 600MHz, 1.2GHz	256KB		Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	DMA, WDT				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA										Zynq®UltraScale+™ FPGA, 154K+ Logic Cells									ROHS3 Compliant
Mfr Part No M2S060-FGG484	Atmel (Microchip Technology)	Datasheet	-	-	Min: 1 Mult: 1										ARM Cortex M3	64 kB		60		-	-		166 MHz						Yes				4710 LAB	56520 LE												Details		This product may require additional documentation to export from the United States.				SmartFusion2			Tray		SmartFusion2																																					256 kB																1 Core
Mfr Part No XC7Z030-2FF676I	Xilinx Inc.	Datasheet	2246 In Stock	1: $333.311780 10: $314.445075 100: $296.646297 500: $279.854997 View all price	Min: 1 Mult: 1	11 Weeks				676-BBGA, FCBGA	YES																					130																						-40°C~100°C TJ	Tray	2009	Zynq®-7000			Active	4 (72 Hours)	676				8542.39.00.01		BOTTOM	BALL					800MHz		XC7Z030		S-PBGA-B676							CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB				256KB		Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA				CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b				ARM	YES			256000	Kintex™-7 FPGA, 125K Logic Cells				CAN, ETHERNET, I2C, PCI, SPI, UART, USB					Non-RoHS Compliant