The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Contact Plating | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Material | Housing Material | Number of Terminals | Base Product Number | Body Orientation | Brand | Data RAM Size | Degree of protection (IP) | Degree of protection (NEMA) | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Material quality | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Model | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shell Sizes | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Termination Method | Tradename | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | HTS Code | Capacitance | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Depth | Reach Compliance Code | Current Rating | JESD-30 Code | Number of Outputs | Qualification Status | Number of Contacts | Contact Gender | Operating Supply Voltage | Power Supplies | Temperature Grade | Voltage | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Product Type | Number of Transceivers | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Product Category | Strain Relief | IP Rating | Height | Height Seated (Max) | Length | Width |
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 | Mfr Part No 10AS027H4F35E3LG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-1152 | Intel / Altera | - | 1 | 2 x 32 kB | 2 x 32 kB | Intel | 1.2 GHz | Yes | SMD/SMT | 384 | 33750 LAB | 270000 LE | 965288 | Details | This product may require additional documentation to export from the United States. | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | SOC - Systems on a Chip | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | FPGA - 270K Logic Elements | 2 Core | -- | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027E2F27E2LG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-672 | YES | 672 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS027E2F27E2LG | 1.2 GHz | Yes | SMD/SMT | 240 | 33750 LAB | 270000 LE | 100 °C | PLASTIC/EPOXY | BGA | BGA, BGA672,26X26,40 | BGA672,26X26,40 | SQUARE | GRID ARRAY | 965084 | Active | NOT SPECIFIED | 5.43 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B672 | 240 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB008R24C2E4X | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 576 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU6CG-1FFVB1156E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Steel | XCZU6 | IP54 | Other | Other | AMD | 328 | Bulk | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 800 | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | 1800 | 1200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB022R31C2E2VAA | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z014S-1CLG484I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 484-LFBGA, CSPBGA | 484-CSPBGA (19x19) | Metal | XC7Z014 | AMD | Support rail | 200 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq®-7000 | 15 | 667MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 65K Logic Cells | - | 35 | 745 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EG-1FFVF1517E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU7 | AMD | 464 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX210HU3F50I3VGAS | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-2397 | Intel / Altera | - | 1 | 4 x 32 kB | 4 x 32 kB | Intel | 1 GHz | + 100 C | - 40 C | SMD/SMT | 704 I/O | 26250 LAB | 2100000 LE | 999A3J | Details | Stratix | Tray | Stratix 10 SX | SOC - Systems on a Chip | 0.85 V | - | SoC FPGA | 96 Transceiver | 4 Core | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX280HN2F43E2VGAS | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-1760 | Intel / Altera | - | 1 | 4 x 32 kB | 4 x 32 kB | Intel | 1 GHz | + 100 C | 0 C | SMD/SMT | 688 I/O | 350000 LAB | 2800000 LE | 999A2P | Details | Stratix | Tray | Stratix 10 SX | SOC - Systems on a Chip | 0.85 V | - | SoC FPGA | 48 Transceiver | 4 Core | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX085HN2F43I2LGAS | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-1760 | Intel / Altera | - | 1 | 4 x 32 kB | 4 x 32 kB | Intel | 1 GHz | + 100 C | - 40 C | SMD/SMT | 688 I/O | 106250 LAB | 850000 LE | 999GHJ | Details | Stratix | Tray | 1SX085HN | SOC - Systems on a Chip | 0.85 V | - | SoC FPGA | 48 Transceiver | 4 Core | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027H3F34E2LG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-1152 | YES | Stainless Steel | 1152 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS027H3F34E2LG | 1.2 GHz | Yes | SMD/SMT | 384 | 33750 LAB | 270000 LE | 100 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965284 | Active | NOT SPECIFIED | 5.43 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 384 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||
| Mfr Part No AGFA027R25A3I3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Silver | Cable Mount | - | - | Metal, Polymer | Straight | +85°C | Intel | -40°C | 624 | Tray | Active | M16 | Solder | 300 V | -40°C ~ 100°C (TJ) | Signalmate C091 | 5.0A | 6 | Male | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | Yes | IP40 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA006R16A2I3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 384 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA022R31C2E4X | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU49DR-1FSVF1760E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | SMD | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | ECE/EXCEL CELL ELECTRONIC CORP | AMD Xilinx | 622 | Tray | Active | Y | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 106.5mm (4.193 x 14.5mm (0.571in) W | 10 Amp, 300 VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | 16mm (0.630in) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU46DR-1FFVH1760E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Terminal: ¼in Triple Quick-Connect, w/Stud Can | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | BARKER MICROFARADS INC | AMD Xilinx | 574 | Active | Y | 0°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS016E3F27I1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Term: ¼in Solder Lug Quick-Connect, no accessories | 672-BBGA, FCBGA | 672-FBGA (27x27) | BARKER MICROFARADS INC | 240 | Y | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Arria 10 SX | ±10% | Discontinued at Digi-Key | 106uF | 370VAC | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 160K Logic Elements | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS160T-1FCVG484T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | Microchip Technology | MCU - 136, FPGA - 108 | Tray | Active | -40°C ~ 125°C (TJ) | - | - | 1.4125MB | RISC-V | DMA, PCI, PWM | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGIB027R29A1E2VR0 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | TE Connectivity / Raychem | 1 | TE Connectivity | Intel | 720 | Tray | 3-1192074-9 | Active | N | 0°C ~ 100°C (TJ) | Tray | Agilex I | Circular Connectors | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Circular MIL Spec Strain Reliefs & Adapters | FPGA - 2.7M Logic Elements | - | Circular MIL Spec Strain Reliefs & Adapters | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB027R24C3E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | TE Connectivity / Raychem | 1 | TE Connectivity | Intel | 744 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | Data Bus Components | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Data Bus Microcouplers | FPGA - 2.7M Logic Elements | - | Data Bus Components - Microcouplers |
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10AS027H4F35E3LG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS027E2F27E2LG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB008R24C2E4X
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU6CG-1FFVB1156E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB022R31C2E2VAA
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z014S-1CLG484I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU7EG-1FFVF1517E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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1SX210HU3F50I3VGAS
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
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1SX280HN2F43E2VGAS
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
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1SX085HN2F43I2LGAS
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS027H3F34E2LG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA027R25A3I3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA006R16A2I3V
Intel
Package:Embedded - System On Chip (SoC)
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AGFA022R31C2E4X
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU49DR-1FSVF1760E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU46DR-1FFVH1760E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS016E3F27I1SG
ALTERA
Package:Embedded - System On Chip (SoC)
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MPFS160T-1FCVG484T2
Microchip
Package:Embedded - System On Chip (SoC)
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AGIB027R29A1E2VR0
Intel
Package:Embedded - System On Chip (SoC)
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AGFB027R24C3E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire