The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Contact Plating | Mount | Package / Case | Surface Mount | Supplier Device Package | Material | Housing Material | Number of Terminals | Actuator | Approvals | Base Product Number | Body Length | Body Shape | Brand | Cap Color | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ground Terminal | If - Forward Current | Ihs Manufacturer | Illuminated | Input Signal Type | L1 Cache Data Memory | L1 Cache Instruction Memory | LED Size | Logic Family | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitivity Levels | Mounting Direction | Mounting Styles | MSL | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Stem Height | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Unit Weight | Voltage Rating DC | Voltage, Rating | Water / Moisture Rating | Wavelength/Color Temperature | With Switch | Operating Temperature | Packaging | Series | Tolerance | JESD-609 Code | Pbfree Code | Resistance | Terminal Finish | Color | Applications | HTS Code | Subcategory | Power Rating | Pitch | Technology | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Current Rating | Frequency | Frequency Stability | Termination Style | JESD-30 Code | Function | Operating Frequency | Housing Color | Output Type | Operating Supply Voltage | Polarity | Switch Function | Temperature Grade | Number of Channels | Leakage Current | Load Capacitance | Wire/Cable Type | Speed | RAM Size | Core Processor | Viewing Angle | Peripherals | Program Memory Size | Quiescent Current | Connectivity | Supply Current-Max | Architecture | Contact Form | Operating Force | Seated Height-Max | Logic Type | Programmable Logic Type | Filter Type | Product Type | Illumination Color | Total RAM Bits | Luminous Flux | High Level Output Current | Low Level Output Current | Number of LEDs | Output Format | Number of Input Lines | Number of Output Lines | Primary Attributes | Number of Cores | Flash Size | Product | Wire Gauge - AWG | Lamp Type | Features | Compliance | Vf - Forward Voltage | Product Category | IP Rating | Height | Length | Width |
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 | Mfr Part No AGFA022R24C2I3E | Intel | Datasheet | 652 |
| Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB022R31C2I3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX040HH3F35I3VG | Intel | Datasheet | 728 |
| Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | TE Connectivity / AMP | 1000 | TE Connectivity | Intel | 374 | Tray | Active | -40°C ~ 100°C (TJ) | Stratix® 10 SX | Wire & Cable Management | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Wire Labels & Markers | FPGA - 400K Logic Elements | - | Wire Labels & Markers | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU9EG-1FFVC900E | AMD | Datasheet | 703 | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU9 | TE Connectivity / Raychem | 1 | TE Connectivity | AMD | 204 | Tray | Active | Details | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | Circular Connectors | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Standard Circular Connector | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | Standard Circular Connector | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1502-1LSIVSVA2197 | AMD | Datasheet | 559 |
| Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | TE Connectivity / Raychem | 1 | TE Connectivity | AMD | 608 | Tray | Active | Details | Versal™ Prime | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1M Logic Cells | - | TE Connectivity | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-1PQ208 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 208-BFQFP | 208-PQFP (28x28) | A2F500M3G | TE Connectivity | 1 | TE Connectivity | Microchip Technology | MCU - 22, FPGA - 66 | Tray | Obsolete | Details | 0°C ~ 85°C (TJ) | SmartFusion® | Cable | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | Ethernet, I²C, SPI, UART/USART | MCU, FPGA | Multi-Conductor Cables | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | 18 AWG | Multi-Conductor Cables | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010S-TQ144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | Deltron | 10 | MICROSEMI CORP | Deltron | M2S010S-TQ144 | Microchip Technology | 3 | 84 | 85 °C | Tray | PLASTIC/EPOXY | LFQFP | TQFP-144 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | Obsolete | 30 | 5.86 | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e0 | No | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Enclosures, Racks and Boxes | QUAD | GULL WING | 240 | 0.5 mm | not_compliant | S-PQFP-G144 | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | Enclosures, Boxes, & Cases | FPGA - 10K Logic Modules | 256KB | Enclosures, Boxes, & Cases | IP66 | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS250T-1FCSG536E | Microchip | Datasheet | 1709 |
| Min: 1 Mult: 1 | FCSG-536 | 536-LFBGA | Round | TE Connectivity / P&B | - | - | 400 | No | Non-Illuminated | 4 x 32 kB | 16 kB, 4 x 32 kB | TE Connectivity | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | Straight | Through Hole | 372 I/O | 254000 LE | Tray | 1437565-3 | Active | Details | This product may require additional documentation to export from the United States. | 4 mm | 0.056438 oz | 24 VDC | 0°C ~ 100°C | Tray | PolarFire™ | Black | Switches | - | 50 mA | Solder Pin | 1 V | OFF - (ON) | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | SPST | 1.6 N | Tactile Switches | - | FPGA - 254K Logic Modules | 5 Core | 128kB | - | Tactile Switches | - | 7.5 mm | 12 mm | 12 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS025T-FCVG484E | Microchip | Datasheet | 49 |
| Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | UL, CSA, VDE | TE Connectivity / P&B | - | 3 | 4 x 32 kB | 16 kB, 4 x 32 kB | TE Connectivity | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | Chassis Mount | MSL 3 - 168 hours | MCU - 136, FPGA - 108 | 23000 LE | Tray | Active | Details | 1.882 lbs | 250 VAC | 0°C ~ 100°C | W (3-20 Amp) | Power Condition | 20 A | Screw | 50 Hz, 60 Hz | 1 V | 820 uA | - | 230.4KB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | Power Line Filter | Power Line Filters | 1843.2Kbit | FPGA - 23K Logic Modules | 5 Core | 128KB | UL | Power Line Filters | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010S-TQ144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | TSSOP-20 | 144-TQFP (20x20) | Texas Instruments | 2000 | Single-Ended | HCT | Texas Instruments | + 85 C | Microchip Technology | - 40 C | SMD/SMT | 84 | Tray | Obsolete | Details | 5.5 V | 4.5 V | 0.002751 oz | -40°C ~ 100°C (TJ) | Reel | SmartFusion®2 | Logic ICs | CMOS | Buffer/Line Driver | 3-State | 5 V | Non-Inverting | 16 Channel | 166MHz | 64KB | ARM® Cortex®-M3 | - | 8 uA | CANbus, Ethernet, I²C, SPI, UART/USART, USB | 8 uA | MCU, FPGA | CMOS | Buffers & Line Drivers | - 6 mA | 6 mA | 8 Input | 8 Output | FPGA - 10K Logic Modules | 256KB | Buffers & Line Drivers | 1.05 mm | 6.6 mm | 4.5 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010S-1TQG144T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 144-LQFP | 144-TQFP (20x20) | Grayhill | Grayhill | Microchip Technology | 84 | Tray | Active | Pushbutton Switch | -40°C ~ 125°C (TJ) | SmartFusion®2 | Encoders | 0.05 in | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | Encoders | FPGA - 10K Logic Modules | 256KB | Encoders | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010S-1TQ144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 144-LQFP | 144-TQFP (20x20) | Advantech | 1 | Advantech | Microchip Technology | 84 | Tray | Obsolete | 0°C ~ 85°C (TJ) | SmartFusion®2 | Memory & Data Storage | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | Solid State Drives - SSD | FPGA - 10K Logic Modules | 256KB | Solid State Drives - SSD | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS250T-1FCVG784I | Microchip | Datasheet | 1743 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | Fiber Optic | 12.8 mm | Rectangular | Bivar | - | 100 | 4 x 32 kB | 16 kB, 4 x 32 kB | 2 mm | BIVAR | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | PCB Mount | MCU - 136, FPGA - 372 | 254000 LE | Tray | Active | Details | -40°C ~ 100°C | PolarFire™ | Yellow | LED Indication | Vertical | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | LED Light Pipes | FPGA - 254K Logic Modules | 5 Core | 128kB | Flexible Light Pipes with LEDs | 2.4 V | LED Light Pipes | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS095TLS-FCVG784I | Microchip | Datasheet | 1886 |
| Min: 1 Mult: 1 | 784-BGA | 784-BGA | Fiber Optic | 6 in | Bivar | - | 100 | 4 x 32 kB | 16 kB, 4 x 32 kB | BIVAR | 667 MHz, 667 MHz | + 100 C | Microchip Technology | - 40 C | Panel Mount (Front), PCB Mount | MCU - 136, FPGA - 276 | 93000 LE | Tray | Active | Details | IP67 Rated | -40°C ~ 100°C | PolarFire® | LED Indication | Vertical | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | LED Light Pipes | FPGA - 93K Logic Modules | 5 Core | 128kB | Flexible Light Pipes with LEDs | LED Light Pipes | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS250TL-FCVG484E | Microchip | Datasheet | 1916 |
| Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | Plastic | Bivar | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | BIVAR | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | SMD/SMT | MCU - 136, FPGA - 372 | 254000 LE | Tray | Active | Details | 2.501 lbs | 6500 K | 0°C ~ 100°C | Tube | Peninsula P3200 Linear | LED Lighting | 16 W | Black | 1 V | - | 2.2MB | RISC-V | 120 deg | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | LED Lighting Fixtures | White (Cool White) | 1225 lm | - | FPGA - 254K Logic Modules | 5 Core | 128kB | LED Lighting Fixtures | 24 V | LED Lighting Fixtures | 15.2 mm | 1219.2 mm | 21.1 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS250T-1FCVG784E | Microchip | Datasheet | 2092 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | Vishay / Dale | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | Vishay | 667 MHz, 667 MHz | + 300 C | Microchip Technology | - 40 C | Chassis Mount | MCU - 136, FPGA - 372 | 254000 LE | Tray | Active | Details | 4 oz | 0°C ~ 100°C | Bulk | MCR | 5 % | 20 kOhms | Industrial | Resistors | 70 W | Wirewound | Quick Connect | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | Wirewound Resistors | FPGA - 254K Logic Modules | 5 Core | 128kB | Metal Encased Tubular Resistors | Tubular Resistors | Wirewound Resistors - Chassis Mount | 19 mm | 63.5 mm | 19 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS025T-1FCSG325I | Microchip | Datasheet | 21 | - | Min: 1 Mult: 1 | 325-TFBGA | 325-BGA (11x11) | Mallory Sonalert | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | Mallory Sonalert | 667 MHz, 667 MHz | + 100 C | Microchip Technology | - 40 C | SMD/SMT | MSL 3 - 168 hours | MCU - 136, FPGA - 108 | 23000 LE | Tray | Active | Details | -40°C ~ 100°C | - | Audio Devices | 1 V | - | 230.4KB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | Audio Indicators & Alerts | 1843.2Kbit | FPGA - 23K Logic Modules | 5 Core | 128KB | Piezo Buzzers & Audio Indicators | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-2MSENBVB1024 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 5 mm x 3.2 mm | 1024-BGA (31x31) | CTS Electronic Components | 1000 | CTS | + 85 C | AMD Xilinx | - 40 C | SMD/SMT | 316 | Tray | Active | Details | 3.3 V | 3.3 V | 0°C ~ 100°C (TJ) | Reel | 636 | Oscillators | 75 MHz | 50 PPM | SMD/SMT | 800 mV | 15 pF | 600MHz, 1.4GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Standard Oscillators | HCMOS, TTL | Versal™ Prime FPGA, 70k Logic Cells | - | Standard Clock Oscillators | 1.3 mm | 5 mm | 3.2 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1402-1LSENBVB1024 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Tin | 1024-BFBGA | 1024-BGA (31x31) | Xilinx | 1 | Xilinx | + 100 C | AMD Xilinx | 0 C | 424 | Tray | Active | Non-Compliant | 0°C ~ 100°C (TJ) | Versal™ Prime | SOC - Systems on a Chip | 700 mV | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | System-On-Modules - SOM | Versal™ Prime FPGA, 1.2M Logic Cells | - | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-2LLENBVB1024 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Cable | 1024-BFBGA | 1024-BGA (31x31) | Xilinx | 1 | Xilinx | + 110 C | AMD Xilinx | 0 C | 316 | Tray | Active | Compliant | 0°C ~ 100°C (TJ) | Versal™ Prime | SOC - Systems on a Chip | Shielded | 700 mV | Data | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | System-On-Modules - SOM | Versal™ Prime FPGA, 70k Logic Cells | - | SoC FPGA |
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AGFA022R24C2I3E
Intel
Package:Embedded - System On Chip (SoC)
24,410.673344
-
AGFB022R31C2I3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
1SX040HH3F35I3VG
Intel
Package:Embedded - System On Chip (SoC)
1,524.673523
-
XCZU9EG-1FFVC900E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1502-1LSIVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
9,456.269381
-
A2F500M3G-1PQ208
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010S-TQ144
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
MPFS250T-1FCSG536E
Microchip
Package:Embedded - System On Chip (SoC)
351.275822
-
MPFS025T-FCVG484E
Microchip
Package:Embedded - System On Chip (SoC)
74.195469
-
M2S010S-TQ144I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010S-1TQG144T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010S-1TQ144
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
MPFS250T-1FCVG784I
Microchip
Package:Embedded - System On Chip (SoC)
421.471388
-
MPFS095TLS-FCVG784I
Microchip
Package:Embedded - System On Chip (SoC)
254.632767
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MPFS250TL-FCVG484E
Microchip
Package:Embedded - System On Chip (SoC)
366.441153
-
MPFS250T-1FCVG784E
Microchip
Package:Embedded - System On Chip (SoC)
470.383838
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MPFS025T-1FCSG325I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1302-2MSENBVB1024
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1402-1LSENBVB1024
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1302-2LLENBVB1024
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire