The category is 'Embedded - System On Chip (SoC)'
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- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Shell Material | Supplier Device Package | Material | Insert Material | Shape | Number of Terminals | Backshell Material, Plating | Approvals | Base Product Number | Brand | Class | Contact Finish Mating | Contact Materials | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Impedance (Max) (Zzt) | L1 Cache Data Memory | L1 Cache Instruction Memory | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Primary Material | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Voltage Rating AC | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Moisture Sensitivity Level (MSL) | Termination | Connector Type | Type | Number of Positions | Color | Applications | HTS Code | Fastening Type | Subcategory | Current Rating (Amps) | Technology | Voltage - Supply | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Current Rating | Frequency | Frequency Stability | Output | Shell Finish | Shell Size - Insert | JESD-30 Code | Function | Base Resonator | Current - Supply (Max) | Number of Outputs | Qualification Status | Operating Supply Voltage | ESR (Equivalent Series Resistance) | Power Supplies | Temperature Grade | Current - Supply (Disable) (Max) | Plating | Attachment Method | Load Capacitance | Speed | RAM Size | Current - Reverse Leakage @ Vr | Operating Mode | Shell Size, MIL | Voltage - Forward (Vf) (Max) @ If | Core Processor | Frequency Tolerance | Peripherals | Power Line Protection | Program Memory Size | Spread Spectrum Bandwidth | Connectivity | Voltage - Breakdown (Min) | Power - Max | Cable Opening | Power - Peak Pulse | Current - Peak Pulse (10/1000μs) | Response Time | Voltage - Clamping (Max) @ Ipp | Architecture | Voltage - Reverse Standoff (Typ) | Number of Inputs | Fuse Type | Seated Height-Max | Unidirectional Channels | Programmable Logic Type | Breaking Capacity @ Rated Voltage | Voltage - Zener (Nom) (Vz) | Product Type | Capacitance @ Frequency | Absolute Pull Range (APR) | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Features | Product Category | Height | Height Seated (Max) | Length | Width | Plating Thickness | Contact Finish Thickness - Mating | Material Flammability Rating | Ratings |
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 | Mfr Part No AGIB027R31B2E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM3382DKFEBG | AVAGO | Datasheet | - | - | Min: 1 Mult: 1 | Holder | Rectangular, Blade | CSA, UR | -- | -- | Compliant | 1.3kV | -- | Bulk | -- | 2.913 L x 2.402 W x 3.032 H (74.00mm x 61.00mm x 77.00mm) | Active | -- | Electrical, Industrial | 350A | -- | Square | 100kA | Indicating | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM33843MKFSBGB0T | Broadcom | Datasheet | - | - | Min: 1 Mult: 1 | - | - | BCM33843 | Broadcom Limited | - | Tray | Active | - | - | 2.4GHz, 5GHz | - | - | - | - | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS066H1F34I1HG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel / Altera | - | 24 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS066H1F34I1HG | 1.2 GHz | + 100 C | KYOCERA AVX | - 40 C | Yes | SMD/SMT | 492 | 82500 LAB | 660000 LE | Bulk | 973529 | Active | Active | 5.66 | Details | Yes | This product may require additional documentation to export from the United States. | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | * | Active | SOC - Systems on a Chip | unknown | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | FPGA - 660K Logic Elements | 2 Core | -- | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA014R24C2I3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | DO-218AC | DO-218AC | -- | Intel | 744 | Tray | Active | -55°C ~ 175°C (TJ) | Automotive, AEC-Q101, PAR® | Active | Zener | Automotive | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | No | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 16.7V | 3600W (3.6kW) | 148A | 24.4V | MPU, FPGA | 15V | 1 | -- | FPGA - 1.4M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z007S-1CLG400C | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Free Hanging (In-Line) | 400-LFBGA, CSPBGA | - | Thermoplastic | 400-CSPBGA (17x17) | Thermoplastic | Thermoplastic | XC7Z007 | Gold | Copper Alloy | Conxall/Switchcraft | 100 | Bulk | Plastic | Active | 600VAC/DC | -40°C ~ 85°C | Multi-Con-X®, Insta-Click™ | Solder Cup | Plug, Male Pins | 4 | Black | - | Bayonet Lock | Varies by Wire Gauge | Keyed | Unshielded | IP67 - Dust Tight, Waterproof | - | - | 667MHz | 256KB | - | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 0.280 ~ 0.290 (7.11mm ~ 7.37mm) | MCU, FPGA | Artix™-7 FPGA, 23K Logic Cells | - | Backshell, UV Resistant | - | UL94 HB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU15EG-2FFVB1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | 1156-FCBGA (35x35) | XCZU15 | SiTime | 328 | Tape & Reel (TR) | Active | -40°C ~ 85°C | SiT8208 | 0.197 L x 0.126 W (5.00mm x 3.20mm) | XO (Standard) | 2.5V | 66.666 MHz | ±10ppm | LVCMOS, LVTTL | Enable/Disable | MEMS | 33mA | 31mA | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | 0.031 (0.80mm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU19EG-L2FFVC1760E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | XCZU19 | PEI-Genesis | 512 | Bulk | Active | 0°C ~ 100°C (TJ) | * | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z007S-1CLG225I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 225-LFBGA, CSPBGA | 225-CSPBGA (13x13) | Beryllium Copper | -- | XC7Z007 | AMD | 54 | Tray | Active | 121°C | Slot Mount | Active | Fingerstock | Zinc + Clear Chromate | Slot | 667MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 23K Logic Cells | - | 0.130 (3.30mm) | 0.975 (24.77mm) | 0.370 (9.40mm) | 299.21µin (7.60µm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA022R24C2E1V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | Non-Compliant | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-1FSVE1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 366 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU49DR-L1FSVF1760I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | 622 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU5EV-3FBVB900E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU5 | AMD | 204 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z030-1FF676I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | XC7Z030 | AMD | Tray | Active | -40°C ~ 100°C (TJ) | Zynq®-7000 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 125K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU46DR-2FFVH1760I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | 574 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EG-3FBVB900E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU7 | AMD | 204 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS066K2F40E1HG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FBGA (40x40) | KJB0T | Intel / Altera | - | 21 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS066K2F40E1HG | 1.2 GHz | + 100 C | ITT Cannon, LLC | 0 C | Yes | SMD/SMT | 696 | 82500 LAB | 660000 LE | Bulk | 965026 | Active | Active | 5.66 | Details | Yes | This product may require additional documentation to export from the United States. | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | * | Active | SOC - Systems on a Chip | unknown | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | FPGA - 660K Logic Elements | 2 Core | -- | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS066H2F34I2SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 1206 (3216 Metric) | YES | 1206 | 1152 | LZ52C | Intel / Altera | - | 1 | INTEL CORP | 55 Ohms | 2 x 32 kB | 2 x 32 kB | Intel | 10AS066H2F34I2SG | 1.2 GHz | Diodes Incorporated | Yes | SMD/SMT | 492 | 82500 LAB | 660000 LE | 100 °C | -40 °C | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 973532 | Active | Last Time Buy | NOT SPECIFIED | 5.46 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -65°C ~ 175°C (TJ) | Tray | - | ±2% | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 492 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | 100 nA @ 15 V | 1.5 V @ 200 mA | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 500 mW | MCU, FPGA | 492 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | 20 V | SoC FPGA | FPGA - 660K Logic Elements | 660000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS048H4F34I3LG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | HC-49/US | YES | 1152 | INTEL CORP | Intel Corporation | 10AS048H4F34I3LG | Suntsu Electronics, Inc. | 492 | 100 °C | -40 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | NOT SPECIFIED | 5.47 | Yes | 0.93 V | 0.87 V | 0.9 V | -20°C ~ 70°C | Tray | SXTHM2 | 0.524 L x 0.197 W (13.30mm x 5.00mm) | Active | MHz Crystal | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 30 MHz | ±50ppm | S-PBGA-B1152 | 492 | Not Qualified | 30 Ohms | 0.9 V | INDUSTRIAL | 18pF | 1.5GHz | 256KB | Fundamental | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | ±20ppm | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 480K Logic Elements | 480000 | -- | 0.177 (4.50mm) | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX250LU2F50E2VG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | PEI-Genesis | 704 | Bulk | Active | 0°C ~ 100°C (TJ) | Tray | * | Active | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2500K Logic Elements | -- |
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AGIB027R31B2E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
BCM3382DKFEBG
AVAGO
Package:Embedded - System On Chip (SoC)
Price: please inquire
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BCM33843MKFSBGB0T
Broadcom
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS066H1F34I1HG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA014R24C2I3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z007S-1CLG400C
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU15EG-2FFVB1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU19EG-L2FFVC1760E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z007S-1CLG225I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA022R24C2E1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU47DR-1FSVE1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU49DR-L1FSVF1760I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU5EV-3FBVB900E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z030-1FF676I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU46DR-2FFVH1760I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU7EG-3FBVB900E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS066K2F40E1HG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS066H2F34I2SG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS048H4F34I3LG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
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1SX250LU2F50E2VG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire