The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Contact Plating | Mounting Type | Package / Case | Supplier Device Package | Material | Base Product Number | Body Orientation | Brand | Contact Materials | Data Converters | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Lifetime @ Temp. | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Package | Part # Aliases | Part Life Cycle Code | Product Depth (mm) | Product Status | Risk Rank | RoHS | Shipping Restrictions | Tradename | Typical Operating Supply Voltage | Voltage Rated | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Type | Color | Gender | Capacitance | Subcategory | Shielding | Reach Compliance Code | Number of Contacts | ESR (Equivalent Series Resistance) | Failure Rate | Lead Spacing | Wire Gauge | Configuration | Interface | Oscillator Type | Number of Ports | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | Core Processor | Peripherals | Program Memory Type | Core Size | Program Memory Size | Connectivity | Manufacturer Size Code | Architecture | Programmable Logic Type | Product Type | Density | Specifications | EEPROM Size | Speed Grade | Primary Attributes | Number of Cores | Flash Size | Features | Product Category | Product Length (mm) | Height Seated (Max) | Length | Thickness | Product Height (mm) | Material Flammability Rating | Ratings |
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 | Mfr Part No XAZU1EG-1SBVA484Q | AMD | Datasheet | 1634 |
| Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | AMD | Tray | Active | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVE1752-1LSENSVG1369 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 500 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-2LSEVFVC1596 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 532 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ Prime | 450MHz, 1.08GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1802-1MSIVIVA1596 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD | 500 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-2MLIVSVD1760 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Gold | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | Straight | Brass | AMD | Panel | 692 | Tray | 58(mm) | Active | -40°C ~ 100°C (TJ) | Versal™ AI Core | M/F | 9/4(POS) | 1(Port) | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | 32.8(mm) | 16(mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3CG-L1UBVA530I | AMD | Datasheet | 1818 |
| Min: 1 Mult: 1 | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | AMD | 82 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU1CG-2SBVA484E | AMD | Datasheet | 1752 | - | Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | AMD | - | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ | CAN/Serial I2C/SPI/U | 533MHz, 1.333GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | MPU, FPGA | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1702-1LSENSVG1369 | AMD | Datasheet | 529 | - | Min: 1 Mult: 1 | 1369-BFBGA | 1369-BGA (35x35) | AMD | 500 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1802-2MSIVSVA2197 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 770 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No QLS1046MN1T144AFN3 | Teledyne LeCroy | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-2MLEVSVD1760 | AMD | Datasheet | 670 |
| Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 692 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU2EG-1UBVA530E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 530-WFBGA, FCBGA | 530-FCBGA (16x9.5) | AMD | 82 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-2MLEVIVA1596 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD | 500 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU42DR-2FSVE1156E | AMD | Datasheet | 762 |
| Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 366 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 489K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC4C6U23I7LN | ALTERA | Datasheet | 2294 |
| Min: 1 Mult: 1 | Surface Mount | 1206 (3216 Metric) | INTEL CORP | 2000 Hrs @ 125°C | Intel Corporation | 5CSXFC4C6U23I7LN | Cal-Chip Electronics, Inc. | Tape & Reel (TR) | Active | Active | 5.79 | 10 V | -55°C ~ 125°C | Tray | TC | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±20% | Active | Molded | 47 µF | compliant | 3Ohm | - | - | A | FIELD PROGRAMMABLE GATE ARRAY | General Purpose | 0.071 (1.80mm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027E4F29E3SG | ALTERA | Datasheet | 437 |
| Min: 1 Mult: 1 | FBGA-780 | Polyurethane | Intel / Altera | - | 1 | 2 x 32 kB | 2 x 32 kB | Intel | 1.2 GHz | Aearo Technologies LLC, a 3M company | Yes | SMD/SMT | 360 | 33750 LAB | 270000 LE | Bag | 964927 | Active | Details | This product may require additional documentation to export from the United States. | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | ISOLOSS | 10.00 L x 10.00 W (254.00mm x 254.00mm) | Active | Black | SOC - Systems on a Chip | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 160 kg/m³ | FPGA - 270K Logic Elements | 2 Core | -- | SoC FPGA | 0.060 (1.52mm) | UL94 HBF | |||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-2FFVG1517E | Xilinx | Datasheet | 84 | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD Xilinx | 561 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z014S-2CLG484E | AMD | Datasheet | 1634 |
| Min: 1 Mult: 1 | 484-LFBGA, CSPBGA | 484-CSPBGA (19x19) | USBFTVX7 | 1.05 V | Amphenol Socapex | 0.95 V | 200 | Box | Active | 1.0000 V | 0 to 100 °C | USBF TVX | - | Shielded | 24 AWG, 28 AWG | A Female to A Male (Circular Coupling) | 766MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | USB 2.0 | 2 | Artix™-7 FPGA, 65K Logic Cells | - | Data Transfer and Charge, Extension Cable, Industrial Environments - IP68, Panel Mount | 3.28 (1.00m) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU15EG-2FFVC900I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 64-LQFP | 64-LQFP (10x10) | CY9AF312 | A/D 9x12b SAR | 0.892 V | Infineon Technologies | 0.808 V | 51 | Tray | Active | 0.8500 V | -40°C ~ 105°C (TA) | FM3 CY9A310 | External, Internal | 40MHz | 16K x 8 | 2.7V ~ 5.5V | ARM® Cortex®-M3 | DMA, LVD, POR, PWM, WDT | FLASH | 32-Bit Single-Core | 128KB (128K x 8) | CSIO, I²C, LINbus, SPI, UART/USART | MCU, FPGA | - | 2 | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU9CG-2FFVC900I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU9 | 0.892 V | AMD | 0.808 V | 204 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - |
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XAZU1EG-1SBVA484Q
AMD
Package:Embedded - System On Chip (SoC)
517.154486
-
XCVE1752-1LSENSVG1369
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1302-2LSEVFVC1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1802-1MSIVIVA1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1902-2MLIVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU3CG-L1UBVA530I
AMD
Package:Embedded - System On Chip (SoC)
523.105858
-
XCZU1CG-2SBVA484E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1702-1LSENSVG1369
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1802-2MSIVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
QLS1046MN1T144AFN3
Teledyne LeCroy
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1902-2MLEVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
30,268.336139
-
XCZU2EG-1UBVA530E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1902-2MLEVIVA1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU42DR-2FSVE1156E
AMD
Package:Embedded - System On Chip (SoC)
13,030.320044
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5CSXFC4C6U23I7LN
ALTERA
Package:Embedded - System On Chip (SoC)
289.072499
-
10AS027E4F29E3SG
ALTERA
Package:Embedded - System On Chip (SoC)
1,121.490657
-
XCZU47DR-2FFVG1517E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z014S-2CLG484E
AMD
Package:Embedded - System On Chip (SoC)
167.786109
-
XCZU15EG-2FFVC900I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU9CG-2FFVC900I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire