The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Housing Material | Body Material | Number of Terminals | Contact Material - Plating | Approvals | Base Product Number | Brand | Breakdown Voltage / V | Clock Frequency-Max | Contact Materials | Data RAM Size | Device Logic Gates | Device Logic Units | Device System Gates | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | I/O Voltage | Ihs Manufacturer | Instruction Set Architecture | Interface Type | JTAG Support | L1 Cache Data Memory | L1 Cache Instruction Memory | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of Elements | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Operation | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Reverse Stand-off Voltage | Risk Rank | RoHS | Rohs Code | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Unit Weight | Usage Level | Voltage Rated | Voltage Rating AC | Voltage Rating DC | Operating Temperature | Packaging | Series | Size / Dimension | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Termination | Connector Type | Number of Positions | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | Color | Gender | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Current Rating | Insulation Color | Pin Count | Contact Finish | Termination Style | JESD-30 Code | Number of Outputs | Qualification Status | Actuator Type | Operating Supply Voltage | Polarity | Panel Cutout Dimensions | Power Supplies | Temperature Grade | Interface | Leakage Current | Element Configuration | Speed | RAM Size | Core Processor | Peripherals | Power Line Protection | Program Memory Size | Connectivity | Cable Opening | Response Time | Max Reverse Leakage Current | Number of Decks | Clamping Voltage | Architecture | Data Bus Width | Peak Pulse Current | Max Surge Current | Peak Pulse Power | Number of Inputs | Operating Force | Direction | Organization | Fuse Type | Test Current | Seated Height-Max | Programmable Logic Type | Breaking Capacity @ Rated Voltage | Thread Size | Terminal Type | Product Type | Number of Positions/Contacts | Includes | Contact Timing | Reverse Breakdown Voltage | DC Cold Resistance | Internal Switch(s) | Screening Level | Index Stops | Circuit per Deck | Depth Behind Panel | Speed Grade | Number of Poles per Deck | Angle of Throw | Primary Attributes | Number of Registers | Number of CLBs | Number of Logic Cells | Number of Cores | Body Color | Panel Hole Size | Industry Recognized Mating Diameter | Number of Bidirectional Channels | Actual Diameter | Number of Equivalent Gates | Signal Lines | Flash Size | Mating Length/Depth | Min Breakdown Voltage | Connection Type | Lamp Type | Features | Product Category | Contacts | Device Core | IP Rating | Length | Width | Actuator Length | Radiation Hardening |
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 | Mfr Part No M2S060-1FGG676 | Microchip | Datasheet | 1890 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Panel Mount | 676-BGA | 676-FBGA (27x27) | M2S060 | Silver Alloy | 64 kB | - | - | 166 MHz | Microchip Technology | 387 | 56520 LE | Tray | Active | Compliant | 115V | 28V | 0°C ~ 85°C (TJ) | 42 | Active | 8 | 1A (AC/DC) | -- | Solder Lug | Flatted (6.35mm Dia) | -- | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | 1 | MCU, FPGA | 5.761 ~ 83gfm | Non-Shorting (BBM) | Fixed | SP8T | 26.04mm | 1 | 36° | FPGA - 60K Logic Modules | 1 Core | 256KB | -- | 11.10mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-1VF256 | Microchip | Datasheet | 4 | - | Min: 1 Mult: 1 | Panel Mount | 256-LFBGA | 256-FPBGA (14x14) | M2S005 | Silver Alloy | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 161 | 6060 LE | Tray | Active | 115V | 28V | 0°C ~ 85°C (TJ) | 44 | Active | 4 | 1A (AC/DC) | -- | Solder Lug | Flatted (6.35mm Dia) | -- | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | -- | MCU, FPGA | 5.761 ~ 83gfm | Shorting (MBB) | Fixed | 3P4T | -- | 3 | 30° | FPGA - 5K Logic Modules | 1 Core | 128KB | Shaft and Panel Sealed | 11.10mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-2FSVE1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Panel Mount | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Silver Alloy | AMD | 366 | Tray | Active | 115V | 28V | -40°C ~ 100°C (TJ) | 44 | Active | 3 | 1A (AC/DC) | -- | Solder Lug | Flatted (6.35mm Dia) | -- | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1 | MCU, FPGA | 5.761 ~ 83gfm | Shorting (MBB) | Fixed | 4P3T | 26.04mm | 4 | 30° | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Shaft and Panel Sealed | 11.10mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-1FCS325 | Microchip | Datasheet | 2064 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Panel Mount | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S050 | Silver Alloy | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S050T-1FCS325 | 166 MHz | Microchip Technology | SMD/SMT | 200 | 56340 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.81 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | 115V | 28V | 0°C ~ 85°C (TJ) | 42 | e0 | Active | 4 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | 1A (AC/DC) | -- | Solder Lug | S-PBGA-B325 | 200 | Not Qualified | Flatted (6.35mm Dia) | -- | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | 3 | MCU, FPGA | 200 | 5.761 ~ 83gfm | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | Non-Shorting (BBM) | Fixed | DP4T | 43.61mm | 2 | 36° | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | -- | 11 mm | 11 mm | 11.10mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XAZU7EV-1FBVB900I | AMD | Datasheet | 704 |
| Min: 1 Mult: 1 | Panel Mount | 900-BBGA, FCBGA | 900-FCBGA (31x31) | Silver Alloy | 1.8, 2.5, 3.3 V | RISC | CAN/Serial I2C/SPI/UART/USB | Yes | AMD | 220 | Tray | Active | Industrial grade | 115V | 28V | -40 to 100 °C | 44 | Active | 5 | 1A (AC/DC) | 900 | -- | Solder Lug | Flatted (6.35mm Dia) | 5 V | -- | CAN/Serial I2C/SPI/U | 500MHz, 600MHz, 1.2GHz | 256 KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | -- | MCU, FPGA | 64 Bit | 5.761 ~ 83gfm | Non-Shorting (BBM) | Industrial | Fixed | DP5T | -- | 2 | 30° | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | Shaft and Panel Sealed | ARM Cortex-A53/ARM Cortex-R5 | 11.10mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU49DR-1FSVF1760E | AMD | Datasheet | 602 |
| Min: 1 Mult: 1 | Free Hanging (In-Line) | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | Thermoplastic | -- | Copper Alloy | Copper Alloy | -- | AMD | 622 | Tray | Active | 250VAC, 140VDC | -40°C ~ 85°C | Bulk | 3558 | Active | Solder | Phono (RCA) Plug | Male | Unshielded | 6A | -- | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 0.203 (5.16mm) | MCU, FPGA | -- | 2 Conductors, 2 Contacts | 2 pcs - 1 Connector, 1 Handle | Does Not Contain Switch | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | Silver, Black | -- | 3.20mm ID, 9.00mm OD (RCA) | -- | Mono | - | 0.640 (16.30mm) | Mounting Hardware | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025T-1FCS325I | Microchip | Datasheet | 33 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Through Hole | 2AG, 5mm x 15mm (Axial) | 325-FCBGA (11x11) | CE, CSA, cURus, PSE | M2S025 | 64 kB | - | - | -- | 166 MHz | Microchip Technology | SMD/SMT | 180 | 27696 LE | Tray | Active | Non-Compliant | 350V | 140V | -55°C ~ 125°C | Bulk | 3JQ | 0.217 Dia x 0.591 L (5.50mm x 15.00mm) | Active | -- | -- | 2A | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | Fast | MCU, FPGA | Cartridge, Glass | 100A AC, 150A DC | 0.041 Ohms | FPGA - 25K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS250T-FCSG536T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 536-LFBGA | 536-BGA (16x16) | Siemens Building Technologies | 599-03156 | Microchip Technology | MCU - 136, FPGA - 168 | Tray | Active | -40°C ~ 125°C (TJ) | - | - | 2.2MB | RISC-V | DMA, PCI, PWM | CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-1VF400I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | CSA, IEC, UL | M2S005 | 64 kB | MICROSEMI CORP | - | - | ABB | MP1-42L10L8 | 166 MHz | Microchip Technology | SMD/SMT | 169 | 6060 LE | Momentary | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.86 | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | Fingersafe Screw | 1.91 | 1 | FPGA - 5K Logic Modules | 1 Core | 128KB | LED | 1NO | IP66 | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-1FGG256I | Microchip | Datasheet | 31 | - | Min: 1 Mult: 1 | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | A2F200 | 100 MHz | 200000 | 200000 | MICROSEMI CORP | ABB | ACH580-BCR-027A-6+E213+K465+L512 | 1.575 V | Microchip Technology | 1.425 V | 3 | MCU - 25, FPGA - 66 | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.24 | Yes | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | -40 to 100 °C | SmartFusion® | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B256 | 66 | Not Qualified | 1.5,1.8,2.5,3.3 V | INDUSTRIAL | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 66 | 4608 CLBS, 200000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | 200000 | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM3384GUKFSBGB0T | Broadcom | Datasheet | - | - | Min: 1 Mult: 1 | BCM3384 | Hoffman | AHE10X10X6 | Broadcom Limited | Tray | Active | * | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU5CG-2FBVB900I | AMD | Datasheet | 785 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU5 | 256,200 | 0.892 V | AMD | 0.808 V | 204 | Tray | Active | FCBGA | 0.8500 V | Industrial grade | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 900 | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 2 | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | 234,240 | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-FCSG325I | Microchip | Datasheet | 2081 | - | Min: 1 Mult: 1 | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S050 | 64 kB | MICROSEMI CORP | - | - | Schneider | 136499 | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 3 | SMD/SMT | 200 | 56340 LE | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.76 | Yes | 1.26 V | 1.14 V | 1.2 V | 2.5, 3.3 V | -40 to 100 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | Threaded | 11 mm | 11 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-TQG144I | Microchip | Datasheet | 2145 | - | Min: 1 Mult: 1 | TQFP-144 | YES | 144-TQFP (20x20) | 144 | M2S010 | Microchip Technology / Atmel | 64 kB | 400 kbit | 60 | MICROSEMI CORP | - | - | Cutler Hammer, Div of Eaton Co | DR1-40D8-05 | 166 MHz | 1.26 V | + 100 C | Microchip Technology | 1.14 V | - 40 C | Yes | 3 | SMD/SMT | 84 I/O | 1007 LAB | 12084 LE | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.81 | Details | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0.035380 oz | -40 to 100 °C | Tray | SmartFusion2 | Yes | Pure Matte Tin (Sn) | 8542.39.00.01 | SOC - Systems on a Chip | QUAD | GULL WING | 250 | 0.5 mm | compliant | S-PQFP-G144 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | STD | FPGA - 10K Logic Modules | 1 Core | 256KB | SoC FPGA | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010T-VFG400I | Microchip | Datasheet | 8 | - | Min: 1 Mult: 1 | Surface Mount | 400-LFBGA | YES | 2 | 400-VFBGA (17x17) | 400 | M2S010 | 12.2 V | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S010T-VFG400I | 166 MHz | Microchip Technology | 3 | SMD/SMT | 1 | 195 | 12084 LE | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 11 V | 5.77 | Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 150 °C | -55 °C | Zener | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 195 | Not Qualified | 11 V | Bidirectional | 1.2 V | 5 µA | Single | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | No | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | 5 µA | 18.2 V | MCU, FPGA | 82.4 A | 82.4 A | 1.5 kW | 195 | Bidirectional | 1 mA | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 12.2 V | FPGA - 10K Logic Modules | 12084 | 1 Core | 1 | 256KB | 12.2 V | 17 mm | 17 mm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-1FG484 | Microchip | Datasheet | 1997 | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S025 | 64 kB | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | SMD/SMT | 267 | 27696 LE | Tray | Active | 1.2000 V | 0 to 85 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU19EG-2FFVE1924E | AMD | Datasheet | 789 |
| Min: 1 Mult: 1 | 1924-BBGA, FCBGA | 1924-FCBGA (45x45) | XCZU19 | AMD | 668 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-CSG288I | Microchip | Datasheet | 1935 | - | Min: 1 Mult: 1 | 288-TFBGA, CSPBGA | 288-CSP (11x11) | A2F500 | 500000 | 1.575 V | Microchip Technology | 1.425 V | MCU - 31, FPGA - 78 | Tray | Active | 1.5000 V | -40 to 100 °C | SmartFusion® | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | STD | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XAZU3EG-1SFVC784I | AMD | Datasheet | 553 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XAZU3 | AMD | 128 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 1.2GHz | 1.8MB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I²C, SPI, UART/USART, USB | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4EV-L1SFVC784I | AMD | Datasheet | 678 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU4 | 192,150 | 0.92 V | AMD | 0.88 V | 252 | Tray | Active | FCBGA | 0.9000 V | Industrial grade | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EV | 784 | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 1L | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | 175,680 | - |
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M2S060-1FGG676
Microchip
Package:Embedded - System On Chip (SoC)
240.999806
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M2S005-1VF256
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU43DR-2FSVE1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050T-1FCS325
Microchip
Package:Embedded - System On Chip (SoC)
182.639059
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XAZU7EV-1FBVB900I
AMD
Package:Embedded - System On Chip (SoC)
3,717.413381
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XCZU49DR-1FSVF1760E
AMD
Package:Embedded - System On Chip (SoC)
22,952.663810
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M2S025T-1FCS325I
Microchip
Package:Embedded - System On Chip (SoC)
113.899486
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MPFS250T-FCSG536T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005S-1VF400I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F200M3F-1FGG256I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
BCM3384GUKFSBGB0T
Broadcom
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU5CG-2FBVB900I
AMD
Package:Embedded - System On Chip (SoC)
2,955.491862
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M2S050T-FCSG325I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010-TQG144I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010T-VFG400I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025-1FG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU19EG-2FFVE1924E
AMD
Package:Embedded - System On Chip (SoC)
8,949.688503
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A2F500M3G-CSG288I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XAZU3EG-1SFVC784I
AMD
Package:Embedded - System On Chip (SoC)
714.486991
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XCZU4EV-L1SFVC784I
AMD
Package:Embedded - System On Chip (SoC)
1,525.456083