The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Supplier Device Package | Antenna Connector Type | Base Product Number | Core | Data RAM Size | Data RAM Type | Dimensions | Distributed RAM | Embedded Block RAM - EBR | Factory Pack QuantityFactory Pack Quantity | Interface Type | L1 Cache Data Memory | L1 Cache Instruction Memory | Maximum Clock Frequency | Maximum Data Rate | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Package | Product Status | RoHS | Shipping Restrictions | Supply Current Receiving | Supply Current Transmitting | Supply Voltage-Max | Supply Voltage-Min | Tradename | Unit Weight | Operating Temperature | Packaging | Series | Type | Voltage - Supply | Frequency | Operating Frequency | Operating Supply Voltage | Memory Size | Speed | RAM Size | Core Processor | Peripherals | Program Memory Type | Program Memory Size | Connectivity | Output Power | Data Rate | Architecture | Data Bus Width | Utilized IC / Part | Protocol | Power - Output | RF Family/Standard | Number of Transceivers | Antenna Type | Sensitivity | Number of ADC Channels | Primary Attributes | Serial Interfaces | Current - Receiving | Current - Transmitting | Modulation | Number of Cores | Flash Size | ADC Resolution | Height | Length | Width |
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 | Mfr Part No MPFS095T-1FCVG484E | Microchip Technology | Datasheet | 2057 |
| Min: 1 Mult: 1 | BGA-484 | 484-FCBGA (19x19) | RV64GC, RV64IMAC | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | SMD/SMT | 276 I/O | 93000 LE | Tray | Active | This product may require additional documentation to export from the United States. | 0°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No UC200TEMAA-N06-MN0AA | Quectel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Module | - | UC200 | 32 mm x 29 mm x 2.4 mm | 100 | ADC, I2C, PCM, SDIO, UART, USB 2.0 | + 75 C | Quectel | - 35 C | Tray | Obsolete | Details | 4.5 V | 3.4 V | Wireless communication module | 0.370377 oz | -35°C ~ 75°C | Reel | UC200T | 3.4V ~ 4.5V | 900MHz, 1.8GHz | - | - | 21Mbps | - | EDGE, GPRS, GSM, HSPA+, LTE, UMTS, WCDMA | - | Cellular | Antenna Not Included | - | ADC, I²C, PCM, SDIO, UART, USB | - | - | - | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS160TS-FCVG484I | Microchip Technology | Datasheet | 1844 |
| Min: 1 Mult: 1 | BGA-484 | 484-FCBGA (19x19) | RV64GC, RV64IMAC | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | SMD/SMT | 312 I/O | 161000 LE | Tray | Active | This product may require additional documentation to export from the United States. | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS160TL-FCVG784E | Microchip Technology | Datasheet | 2008 |
| Min: 1 Mult: 1 | BGA-784 | 784-FCBGA (23x23) | RV64GC, RV64IMAC | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | SMD/SMT | 312 I/O | 161000 LE | Tray | Active | This product may require additional documentation to export from the United States. | 0°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS095TL-FCSG536I | Microchip Technology | Datasheet | 1849 |
| Min: 1 Mult: 1 | BGA-536 | 536-LFBGA | RV64GC, RV64IMAC | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | Microchip Technology | - 40 C | SMD/SMT | 276 I/O | 93000 LE | Tray | Active | This product may require additional documentation to export from the United States. | -40°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS250TS-FCVG484I | Microchip Technology | Datasheet | 1932 |
| Min: 1 Mult: 1 | BGA-484 | 484-FCBGA (19x19) | RV64GC, RV64IMAC | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | Microchip Technology | - 40 C | SMD/SMT | 372 I/O | 254000 LE | Tray | Active | This product may require additional documentation to export from the United States. | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS160TL-FCVG784I | Microchip Technology | Datasheet | 1812 |
| Min: 1 Mult: 1 | BGA-784 | 784-FCBGA (23x23) | RV64GC, RV64IMAC | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | SMD/SMT | 312 I/O | 161000 LE | Tray | Active | This product may require additional documentation to export from the United States. | -40°C ~ 100°C | Tray | PolarFire™ | 1 V | - | 1.4125MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 161K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS095T-1FCSG536I | Microchip Technology | Datasheet | 2175 |
| Min: 1 Mult: 1 | BGA-536 | 536-LFBGA | RV64GC, RV64IMAC | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | SMD/SMT | 276 I/O | 93000 LE | Tray | Active | This product may require additional documentation to export from the United States. | -40°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS095TL-FCVG784I | Microchip Technology | Datasheet | 2132 |
| Min: 1 Mult: 1 | BGA-784 | 784-BGA | RV64GC, RV64IMAC | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | Microchip Technology | - 40 C | SMD/SMT | 276 I/O | 93000 LE | Tray | Active | This product may require additional documentation to export from the United States. | -40°C ~ 100°C | Tray | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-2FSVE1156I5149 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-1156 | ARM Cortex A53, ARM Cortex R5F | 256 kB | 13 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | - 40 C | SMD/SMT | 394 I/O | 53160 LAB | 930300 LE | 850 mV | 16 Transceiver | 6 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3CG-L1UBVA530I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-530 | 530-FCBGA (16x9.5) | ARM Cortex A53, ARM Cortex R5F | 256 kB | 1.8 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | AMD Xilinx | - 40 C | SMD/SMT | 82 I/O | 8820 LAB | 154350 LE | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 850 mV | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 4 Core | - | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU2CG-L2UBVA530E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-530 | 530-FCBGA (16x9.5) | ARM Cortex A53, ARM Cortex R5F | 256 kB | 1.2 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 110 C | AMD Xilinx | 0 C | SMD/SMT | 82 I/O | 5904 LAB | 103320 LE | Active | 0°C ~ 100°C (TJ) | 850 mV | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 4 Core | - | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3EG-2UBVA530I | Xilinx | Datasheet | 1698 | - | Min: 1 Mult: 1 | FBGA-530 | 530-FCBGA (16x9.5) | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 256 kB | 1.8 Mb | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | + 100 C | AMD Xilinx | - 40 C | SMD/SMT | 82 I/O | 8820 LAB | 154350 LE | Tray | Active | -40°C ~ 100°C (TJ) | - | 850 mV | 533MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 7 Core | - | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No ESP32-C3FN4 | Espressif Systems | Datasheet | 92 |
| Min: 1 Mult: 1 | Surface Mount | QFN-32 | RISC-V | 400 kB | SRAM | 5000 | GPIO, I2C, I2S, SPI, UART | 160 MHz | 150 Mbps | + 85 C | Espressif Systems | - 40 C | Yes | SMD/SMT | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | Active | Details | 87 mA | 325 mA | 3.6 V | 3 V | -40°C ~ 85°C (TA) | MouseReel | ESP32 | Bluetooth, Wi-Fi | 3V ~ 3.6V | 2.402GHz ~ 2.48GHz | 2.4 GHz | 4MB Flash, 400kB SRAM, 384kB ROM | Flash | 4 MB | 18 dBm | 54Mbps | 32 bit | - | 802.11b/g/n, Bluetooth v5.0 | 21dBm | Bluetooth, WiFi | Antenna Not Included | - 105 dBm | 6 Channel | GPIO, I²C, I²S, SPI, JTAG, UART, USB | 84mA ~ 87mA | 276mA ~ 335mA | - | 12 bit | 0.85 mm | 5 mm | 5 mm | ||||||||||||||||||||||||||
| Mfr Part No XCZU1EG-2SBVA484E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-484 | 484-FCBGA (19x19) | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 256 kB | 1 Mb | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | + 100 C | AMD Xilinx | 0 C | SMD/SMT | 82 I/O | 4680 LAB | 81900 LE | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ | 850 mV | 533MHz, 600MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | - | 7 Core | - | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU1EG-2UBVA494E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-494 | 494-FCBGA (14x14) | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 256 kB | 1 Mb | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | + 100 C | AMD Xilinx | 0 C | SMD/SMT | 82 I/O | 4680 LAB | 81900 LE | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 850 mV | 533MHz, 600MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | Zynq®UltraScale+™ FPGA, 81K+ Logic Cells | 7 Core | - | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU1EG-2UBVA494I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-494 | 494-FCBGA (14x14) | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 256 kB | 1 Mb | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | + 100 C | AMD Xilinx | - 40 C | SMD/SMT | 82 I/O | 4680 LAB | 81900 LE | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 850 mV | 533MHz, 600MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | Zynq®UltraScale+™ FPGA, 81K+ Logic Cells | 7 Core | - | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU6CG-2FFVC900I4895 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FCBGA-900 | ARM Cortex A53, ARM Cortex R5 | - | 6.9 Mbit | 25.1 Mbit | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | 600 MHz, 1.5 GHz | + 100 C | - 40 C | SMD/SMT | 204 I/O | 26825.5 LAB | 469446 LE | This product may require additional documentation to export from the United States. | Zynq UltraScale+ | XCZU6CG | 0.85 V | - | 16 Transceiver | 4 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3EG-L1SFVC784I4560 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FCBGA-784 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | - | 1.8 Mbit | 7.6 Mbit | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 600 MHz, 667 MHz, 1.5 GHz | + 100 C | - 40 C | SMD/SMT | 252 I/O | 8820 LAB | 154350 LE | This product may require additional documentation to export from the United States. | Zynq UltraScale+ | XCZU3EG | 720 mV/850 mV | - | 7 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU42DR-1FFVE1156E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-1156 | 1156-FCBGA (35x35) | ARM Cortex A53, ARM Cortex R5F | 256 kB | 6.8 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | AMD Xilinx | 0 C | SMD/SMT | 396 I/O | 27960 LAB | 489300 LE | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 850 mV | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 8 Transceiver | Zynq®UltraScale+™ FPGA, 489K+ Logic Cells | 6 Core | - |
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MPFS095T-1FCVG484E
Microchip Technology
Package:Embedded - System On Chip (SoC)
172.793373
-
UC200TEMAA-N06-MN0AA
Quectel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
MPFS160TS-FCVG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
300.274154
-
MPFS160TL-FCVG784E
Microchip Technology
Package:Embedded - System On Chip (SoC)
320.705123
-
MPFS095TL-FCSG536I
Microchip Technology
Package:Embedded - System On Chip (SoC)
213.751972
-
MPFS250TS-FCVG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
397.811268
-
MPFS160TL-FCVG784I
Microchip Technology
Package:Embedded - System On Chip (SoC)
346.217705
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MPFS095T-1FCSG536I
Microchip Technology
Package:Embedded - System On Chip (SoC)
288.314756
-
MPFS095TL-FCVG784I
Microchip Technology
Package:Embedded - System On Chip (SoC)
236.103947
-
XCZU47DR-2FSVE1156I5149
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU3CG-L1UBVA530I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU2CG-L2UBVA530E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU3EG-2UBVA530I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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ESP32-C3FN4
Espressif Systems
Package:Embedded - System On Chip (SoC)
1.467514
-
XCZU1EG-2SBVA484E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU1EG-2UBVA494E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU1EG-2UBVA494I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU6CG-2FFVC900I4895
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU3EG-L1SFVC784I4560
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU42DR-1FFVE1156E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire