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Embedded - System On Chip (SoC) (6000)

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Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Lifecycle Status	Contact Plating	Mounting Type	Package / Case	Surface Mount	Supplier Device Package	Material	Body Material	Number of Terminals	Mounting Hole Diameter	Package Quantity	Base Product Number	Body Orientation	Brand	Clock Frequency-Max	Contact Materials	Country of Origin	Data RAM Size	Device Logic Gates	Device System Gates	ECCN	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	Inside Diameter	Instruction Set Architecture	Interface Type	L1 Cache Data Memory	L1 Cache Instruction Memory	Manufacturer	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Temperature	Mfr	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting	Mounting Method	Mounting Orientation	Mounting Styles	Number of CPU Cores	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Elements	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Special Features	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Terminate To	Termination Method	Tradename	Typical Operating Supply Voltage	Unit Weight	Voltage, Rating	Operating Temperature	Packaging	Series	JESD-609 Code	Temperature Coefficient	Type	Resistance	Terminal Finish	Color	Applications	Gender	HTS Code	Subcategory	Power Rating	Technology	Voltage - Supply	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Terminal Pitch	Resistor Type	Reach Compliance Code	JESD-30 Code	Function	Number of Outputs	Qualification Status	Operating Frequency	Operating Supply Voltage	Power Supplies	Temperature Grade	Interface	Operating Supply Current	Speed	RAM Size	Core Processor	Number of Resistors	Illumination	Peripherals	Program Memory Size	Connectivity	Current - Supply	Family	Architecture	Data Bus Width	Number of Inputs	Organization	Seated Height-Max	Programmable Logic Type	Product Type	Includes	Number of Gates	Overall Height	Speed Grade	Resistance Tolerance	Primary Attributes	Number of CLBs	Number of Logic Cells	Finish	Number of Cores	Number of Equivalent Gates	Overall Length	Flash Size	Pin Diameter	Product Category	Product Length	Product Width	Device Core	Adhesive Type	Length	Width	Panel Thickness
Mfr Part No XCVC1502-1MLIVBVA1024	Xilinx	Datasheet	-	-	Min: 1 Mult: 1		Gold											Straight	Xilinx		Phosphor Bronze						1							Xilinx			+ 110 C		- 40 C			Panel Mount																											Flexible Cable	Solder					-65 to 165 °C										Receptacle		SOC - Systems on a Chip														0, 11 GHz	800 mV																					System-On-Modules - SOM															SoC FPGA	17.5 mm
Mfr Part No XCVM1502-2MLIVFVB1369	Xilinx	Datasheet	-	-	Min: 1 Mult: 1														Xilinx															Xilinx			+ 110 C		- 40 C																																			30 V					200 ppm/K		3.3						SOC - Systems on a Chip	0.05 W							General Purpose							800 mV																					System-On-Modules - SOM					5										SoC FPGA	0.6 mm	0.3 mm
Mfr Part No XCVC1502-1LSEVSVA1596	Xilinx	Datasheet	-	-	Min: 1 Mult: 1				1596-BFBGA		1596-BGA (37.5x37.5)								Xilinx								1							Xilinx			+ 100 C	AMD Xilinx	0 C								478					Tray								Active															0°C ~ 100°C (TJ)		Versal™ AI Core										SOC - Systems on a Chip															700 mV					400MHz, 1GHz	-	Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™			DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG		High Frequency Relays	MPU, FPGA						System-On-Modules - SOM						Versal™ Prime FPGA, 80k Logic Cells							-		SoC FPGA
Mfr Part No XCVM1502-1LSEVFVC1760	Xilinx	Datasheet	-	-	Min: 1 Mult: 1														Xilinx								1							Xilinx			+ 100 C		0 C																																																SOC - Systems on a Chip															700 mV																					System-On-Modules - SOM															SoC FPGA
Mfr Part No XCVM1302-2LSEVFVB1369	Xilinx	Datasheet	-	-	Min: 1 Mult: 1														Xilinx															Xilinx			+ 110 C		0 C																																																SOC - Systems on a Chip	125 mW							High Reliability, MIL-PRF-55182							700 mV																					System-On-Modules - SOM					1										SoC FPGA
Mfr Part No XCVC1502-1MSEVBVA1024	Xilinx	Datasheet	-	-	Min: 1 Mult: 1														Xilinx								1							Xilinx			+ 100 C		0 C																																																SOC - Systems on a Chip															800 mV														High Frequency Relays							System-On-Modules - SOM															SoC FPGA
Mfr Part No XCVM1302-2MSIVFVB1369	Xilinx	Datasheet	-	-	Min: 1 Mult: 1														Xilinx															Xilinx			+ 110 C		- 40 C																																								200 ppm/K		3.9 kOhm						SOC - Systems on a Chip	0.125 W							General Purpose							800 mV																					System-On-Modules - SOM					5										SoC FPGA	2	1.25
Mfr Part No XCVC1502-2MLEVBVA1024	Xilinx	Datasheet	-	-	Min: 1 Mult: 1														Xilinx								1							Xilinx			+ 110 C		0 C																																			25 V					200.0000 ppm/°C		2.2						SOC - Systems on a Chip	0.125 W						0.65 mm								800 mV								2													System-On-Modules - SOM					5										SoC FPGA	1 mm	1 mm
Mfr Part No XCVC1502-2MLIVSVG1369	Xilinx	Datasheet	-	-	Min: 1 Mult: 1														Xilinx															Xilinx			+ 110 C		- 40 C			Bolt-On																																													SOC - Systems on a Chip											Fuse Block				800 mV																					System-On-Modules - SOM															SoC FPGA
Mfr Part No XCVM1402-1MSIVFVB1369	Xilinx	Datasheet	-	-	Min: 1 Mult: 1														Xilinx															Xilinx			+ 110 C		- 40 C																																								25.0000 ppm/°C		953 Ohm						SOC - Systems on a Chip	0.125 W							High Reliability, MIL-PRF-55182							800 mV																					System-On-Modules - SOM					0.1										SoC FPGA	7.62
Mfr Part No XCVM1502-2HSIVFVC1760	Xilinx	Datasheet	-	-	Min: 1 Mult: 1														Xilinx								1							Xilinx			+ 110 C		- 40 C																																								30.0000 ppm/°C		20 kOhm						SOC - Systems on a Chip	10.0000 W							Power							880 mV																					System-On-Modules - SOM					5										SoC FPGA	47.62
Mfr Part No XCVC1502-2MSEVBVA1024	Xilinx	Datasheet	-	-	Min: 1 Mult: 1														Xilinx								1							Xilinx			+ 110 C		0 C																																								200 ppm/K		2.15 Ohm						SOC - Systems on a Chip	0.0625 W							General Purpose							800 mV																					System-On-Modules - SOM					1										SoC FPGA	1	0.5
Mfr Part No M2S060T-FGG484	Microchip	Datasheet	1982 In Stock	-	Min: 1 Mult: 1	Production (Last Updated: 2 months ago)			484-BGA	YES	484-FPBGA (23x23)			484			M2S060						64 kB					MICROSEMI CORP				-	-	Microsemi Corporation	M2S060T-FGG484	166 MHz		Microchip Technology			3						267		56520 LE	85 °C		Tray	PLASTIC/EPOXY	BGA	FBGA-484	BGA484,22X22,40	SQUARE	GRID ARRAY	Active	Active	40	5.81	Non-Compliant	Yes		1.26 V	1.14 V	1.2 V							0°C ~ 85°C (TJ)		SmartFusion®2	e1				Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	Field Programmable Gate Arrays		CMOS		BOTTOM	BALL	250	1 mm		compliant	S-PBGA-B484		267	Not Qualified			1.2 V	OTHER			166MHz	64KB	ARM® Cortex®-M3			DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA		267		2.44 mm	FIELD PROGRAMMABLE GATE ARRAY							FPGA - 60K Logic Modules		56520		1 Core			256KB							23 mm	23 mm
Mfr Part No M2S150-1FC1152	Microchip	Datasheet	2345 In Stock	-	Min: 1 Mult: 1				1152-BBGA, FCBGA	YES	1152-FCBGA (35x35)	Stainless Steel	Stainless Steel	1152	6.5 X 12 mm X 2	1	M2S150						64 kB					MICROSEMI CORP				-	-	Microsemi Corporation	M2S150-1FC1152	166 MHz		Microchip Technology					Screw, Weld	Universal	SMD/SMT		574		146124 LE	85 °C		Tray	PLASTIC/EPOXY	BGA	FBGA-1152	BGA1152,34X34,40	SQUARE	GRID ARRAY	Active	Active	30	5.81		No	Concealed, Removable	1.26 V	1.14 V	1.2 V							0°C ~ 85°C (TJ)		SmartFusion®2	e0				Tin/Lead (Sn/Pb)	Natural			8542.39.00.01	Field Programmable Gate Arrays		CMOS		BOTTOM	BALL	240	1 mm		not_compliant	S-PBGA-B1152		574	Not Qualified			1.2 V	OTHER			166MHz	64KB	ARM® Cortex®-M3			DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB			MCU, FPGA		574		2.9 mm	FIELD PROGRAMMABLE GATE ARRAY		Fasteners not included					FPGA - 150K Logic Modules		146124	Natural	1 Core		60.0 mm	512KB	5.0 mm						35 mm	35 mm
Mfr Part No XCZU47DR-L1FFVE1156I	AMD	Datasheet	-	-	Min: 1 Mult: 1				1156-BBGA, FCBGA		1156-FCBGA (35x35)	Thermoplastic Rubber				4000													12.5 mm								135 Â°C	AMD	-40 Â°C								366					Tray								Active															-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC			Hole Grommet			Black																								500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™			DMA, WDT		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA									6.4 mm			Zynq®UltraScale+™ FPGA, 930K+ Logic Cells							-									1.6 mm
Mfr Part No BCM63138DKFSBG	Broadcom	Datasheet	-	-	Min: 1 Mult: 1			-	-		-								Broadcom								420			RISC	Ethernet			Broadcom Limited				Broadcom Limited								2						Tray								Active															-		-										Ethernet & Communication Modules			-								Ethernet							Ethernet										-			32 Bit					Gateways															Gateways			ARM Cortex A9
Mfr Part No A2F200M3F-FGG256I	Microchip	Datasheet	724 In Stock	-	Min: 1 Mult: 1				FPBGA-256	YES	256-FPBGA (17x17)			256			A2F200		Microchip Technology / Atmel	80 MHz			64 kB	200000	200000		90	MICROSEMI CORP				-	-	Microchip	A2F200M3F-FGG256I	80 MHz	+ 100 C	Microchip Technology	- 40 C	Yes	3				SMD/SMT		117 I/O	-	2000 LE	100 °C	-40 °C	Tray	PLASTIC/EPOXY	LBGA	17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-256	BGA256,16X16,40	SQUARE	GRID ARRAY, LOW PROFILE	Active	Active	30	1.33	Details	Yes		1.575 V	1.425 V	1.5 V			SmartFusion	1.5000 V	0.690329 oz		-40 to 100 °C	Tray	A2F200	e3				Matte Tin (Sn)				8542.39.00.01	SOC - Systems on a Chip		CMOS		BOTTOM	BALL	250	1 mm		compliant	S-PBGA-B256		66	Not Qualified		1.5 V	1.5,1.8,2.5,3.3 V	INDUSTRIAL		7 mA	80MHz	64KB	ARM® Cortex®-M3			DMA, POR, WDT	256 kB	EBI/EMI, Ethernet, I²C, SPI, UART/USART			MCU, FPGA		66	4608 CLBS, 200000 GATES	1.7 mm	FIELD PROGRAMMABLE GATE ARRAY	SoC FPGA		200000		STD		ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops	4608	4608		1 Core	200000		256KB		SoC FPGA					17 mm	17 mm
Mfr Part No A2F060M3E-FGG256	Microchip	Datasheet	240 In Stock	-	Min: 1 Mult: 1					YES				256														MICROSEMI CORP						Microsemi Corporation	A2F060M3E-FGG256						3									85 °C			PLASTIC/EPOXY	LBGA	LBGA,		SQUARE	GRID ARRAY, LOW PROFILE	Obsolete		30	5.82		Yes		1.575 V	1.425 V	1.5 V										e1				Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01			CMOS		BOTTOM	BALL	250	1 mm		compliant	S-PBGA-B256							OTHER																1536 CLBS, 60000 GATES	1.7 mm	FIELD PROGRAMMABLE GATE ARRAY								1536				60000									17 mm	17 mm
Mfr Part No XCZU46DR-1FFVH1760I	AMD	Datasheet	-	-	Min: 1 Mult: 1				1760-BBGA, FCBGA		1760-FCBGA (42.5x42.5)																											AMD									574					Tray								Active															-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC																														500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™			DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA												Zynq®UltraScale+™ FPGA, 930K+ Logic Cells							-
Mfr Part No XCZU48DR-L1FFVE1156I	AMD	Datasheet	-	-	Min: 1 Mult: 1			Corner Holes	1156-BBGA, FCBGA		1156-FCBGA (35x35)	Vinyl										US				EAR99												AMD									366					Tray								Active															-40°C ~ 100°C (TJ)		Zynq® UltraScale+™ RFSoC						Green/Red on White	General Purpose																							500MHz, 1.2GHz	256KB	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™		Not Illuminated	DDR, DMA, PCIe		CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG			MCU, FPGA												Zynq®UltraScale+™ FPGA, 930K+ Logic Cells			Gloss				-						Repositionable Acrylic

XCVC1502-1MLIVBVA1024

Xilinx

Package:Embedded - System On Chip (SoC)

Price: please inquire
XCVM1502-2MLIVFVB1369

Xilinx

Package:Embedded - System On Chip (SoC)

Price: please inquire
XCVC1502-1LSEVSVA1596

Xilinx

Package:Embedded - System On Chip (SoC)

Price: please inquire
XCVM1502-1LSEVFVC1760

Xilinx

Package:Embedded - System On Chip (SoC)

Price: please inquire
XCVM1302-2LSEVFVB1369

Xilinx

Package:Embedded - System On Chip (SoC)

Price: please inquire
XCVC1502-1MSEVBVA1024

Xilinx

Package:Embedded - System On Chip (SoC)

Price: please inquire
XCVM1302-2MSIVFVB1369

Xilinx

Package:Embedded - System On Chip (SoC)

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XCVC1502-2MLEVBVA1024

Xilinx

Package:Embedded - System On Chip (SoC)

Price: please inquire
XCVC1502-2MLIVSVG1369

Xilinx

Package:Embedded - System On Chip (SoC)

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XCVM1402-1MSIVFVB1369

Xilinx

Package:Embedded - System On Chip (SoC)

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XCVM1502-2HSIVFVC1760

Xilinx

Package:Embedded - System On Chip (SoC)

Price: please inquire
XCVC1502-2MSEVBVA1024

Xilinx

Package:Embedded - System On Chip (SoC)

Price: please inquire
M2S060T-FGG484

Microchip

Package:Embedded - System On Chip (SoC)

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M2S150-1FC1152

Microchip

Package:Embedded - System On Chip (SoC)

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XCZU47DR-L1FFVE1156I

AMD

Package:Embedded - System On Chip (SoC)

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BCM63138DKFSBG

Broadcom

Package:Embedded - System On Chip (SoC)

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A2F200M3F-FGG256I

Microchip

Package:Embedded - System On Chip (SoC)

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A2F060M3E-FGG256

Microchip

Package:Embedded - System On Chip (SoC)

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XCZU46DR-1FFVH1760I

AMD

Package:Embedded - System On Chip (SoC)

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XCZU48DR-L1FFVE1156I

AMD

Package:Embedded - System On Chip (SoC)

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Embedded - System On Chip (SoC) (6000)