The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Dielectric Material | Number of Terminals | Approvals | Base Product Number | Brand | Class | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Voltage Rating AC | Voltage Rating DC | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Moisture Sensitivity Level (MSL) | Termination | Type | Max Operating Temperature | Min Operating Temperature | Applications | HTS Code | Capacitance | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Current Rating | Frequency | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Lead Spacing | Power Supplies | Interface | Memory Size | Speed | RAM Size | Core Processor | Peripherals | Power Line Protection | Program Memory Size | Connectivity | Voltage - Breakdown (Min) | Power - Peak Pulse | Current - Peak Pulse (10/1000μs) | Response Time | Voltage - Clamping (Max) @ Ipp | Architecture | Voltage - Reverse Standoff (Typ) | Number of Inputs | Fuse Type | Seated Height-Max | Programmable Logic Type | Breaking Capacity @ Rated Voltage | Number of Logic Elements/Cells | Product Type | Bidirectional Channels | Core Architecture | Capacitance @ Frequency | Speed Grade | Number of Transceivers | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Features | Product Category | Height Seated (Max) | Length | Width | Ratings |
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 | Mfr Part No XCZU4EG-3FBVB900E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU4 | PEI-Genesis | 204 | Bulk | Active | 0°C ~ 100°C (TJ) | * | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB027R24C2I2V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7CG-L2FFVF1517E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU7 | AMD | 464 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2L | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EG-L1FFVF1517I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU7 | PEI-Genesis | 464 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-1FSVE1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Knowles Syfer | 366 | Tape & Reel (TR) | Active | -40°C ~ 100°C (TJ) | * | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM3382DKFEBG | AVAGO | Datasheet | - | - | Min: 1 Mult: 1 | Holder | Rectangular, Blade | CSA, UR | -- | -- | Compliant | 1.3kV | -- | Bulk | -- | 2.913 L x 2.402 W x 3.032 H (74.00mm x 61.00mm x 77.00mm) | Active | -- | Electrical, Industrial | 350A | -- | Square | 100kA | Indicating | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM33843MKFSBGB0T | Broadcom | Datasheet | - | - | Min: 1 Mult: 1 | - | - | BCM33843 | Broadcom Limited | - | Tray | Active | - | - | 2.4GHz, 5GHz | - | - | - | - | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFC023R25A1I1V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | Radial | - | Polypropylene (PP), Metallized | Nichicon | 480 | Bulk | Active | 250V | - | -25°C ~ 85°C | EEC | 2.283 L x 1.024 W (58.00mm x 26.00mm) | -5%, +10% | PC Pins | General Purpose | 22 µF | - | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | - | 1.614 (41.00mm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA014R24C2E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1502-2MLENSVG1369 | AMD | Datasheet | 777 |
| Min: 1 Mult: 1 | AMD | Tray | Active | * | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB008R24C2E4X | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 576 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA2U19I7SN | ALTERA | Datasheet | 8068 |
| Min: 1 Mult: 1 | 484-FBGA | YES | 484 | 484-UBGA (19x19) | 484 | 121050 | INTEL CORP | Intel Corporation | 5CSEBA2U19I7SN | Molex | MCU - 151, FPGA - 66 | Bulk | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | Active | NOT SPECIFIED | 2 | Compliant | Yes | 8542390000 | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Brad 121050 mPm | Active | 100 °C | -40 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 800 MHz | 5CSEBA2 | S-PBGA-B484 | 66 | Not Qualified | 1.1 V | 1.1,1.2/3.3,2.5 V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.5 MB | 800MHz | 64KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | 1.9 mm | FIELD PROGRAMMABLE GATE ARRAY | 25000 | ARM | FPGA - 25K Logic Elements | 25000 | -- | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4EV-3SFVC784E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU4 | AMD | 252 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU11EG-L2FFVB1517E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU11 | AMD | 488 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA027R25A1E1V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | DO-214AB, SMC | DO-214AB (SMCJ) | MDE Semiconductor Inc | 624 | Tape & Reel (TR) | Active | -55°C ~ 150°C (TJ) | 5.0SMDJ | Zener | General Purpose | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | No | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 86.7V | 5000W (5kW) | 39.7A | 126V | MPU, FPGA | 78V | 1 | - | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XAZU2EG-1SFVC784I | AMD | Datasheet | 1628 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XAZU2 | AMD | 128 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 1.2GHz | 1.2MB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I²C, SPI, UART/USART, USB | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA006R24C3E4X | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 576 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MSC7104ZQF | Freescale | Datasheet | 7 | - | Min: 1 Mult: 1 | 456-BBGA | 456-PBGA (35x35) | Freescale Semiconductor - NXP | 48 | Bulk | Obsolete | - | - | 266MHz | - | PowerPC e300 | DDR2, JTAG | Ethernet, I²C, SPI, UART/USART | MPU | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1702-2MSEVSVA1596 | AMD | Datasheet | 562 | - | Min: 1 Mult: 1 | AMD | Tray | Active | * | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX280LH3F55E1VG | ALTERA | Datasheet | 543 |
| Min: 1 Mult: 1 | FBGA-2912 | Intel / Altera | - | 10 | 4 x 32 kB | 4 x 32 kB | Intel | 1 GHz | + 100 C | 0 C | Yes | SMD/SMT | 1160 | 350000 LAB | 2800000 LE | 956208 | Details | This product may require additional documentation to export from the United States. | Stratix | 0°C ~ 100°C (TJ) | Tray | Stratix® 10 SX | Active | SOC - Systems on a Chip | 0.85 V | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 24 Transceiver | FPGA - 2800K Logic Elements | 4 Core | -- | SoC FPGA |
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XCZU4EG-3FBVB900E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB027R24C2I2V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU7CG-L2FFVF1517E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU7EG-L1FFVF1517I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU48DR-1FSVE1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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BCM3382DKFEBG
AVAGO
Package:Embedded - System On Chip (SoC)
Price: please inquire
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BCM33843MKFSBGB0T
Broadcom
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFC023R25A1I1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA014R24C2E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1502-2MLENSVG1369
AMD
Package:Embedded - System On Chip (SoC)
18,375.195017
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AGFB008R24C2E4X
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5CSEBA2U19I7SN
ALTERA
Package:Embedded - System On Chip (SoC)
104.091164
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XCZU4EV-3SFVC784E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU11EG-L2FFVB1517E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA027R25A1E1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XAZU2EG-1SFVC784I
AMD
Package:Embedded - System On Chip (SoC)
391.196728
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AGFA006R24C3E4X
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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MSC7104ZQF
Freescale
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1702-2MSEVSVA1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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1SX280LH3F55E1VG
ALTERA
Package:Embedded - System On Chip (SoC)
21,330.370310