The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Package / Case | Supplier Device Package | Base Product Number | Data RAM Size | Interface Type | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Mounting Styles | MSL | Number of I/Os | Package | Product Status | Supply Voltage-Max | Supply Voltage-Min | Operating Temperature | Series | Operating Supply Voltage | Interface | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Data Bus Width | Primary Attributes | Flash Size | Device Core |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No AGFB006R16A2I3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 384 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | ||||||||||||||||
| Mfr Part No AGIB019R18A2E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | ||||||||||||||||
| Mfr Part No XCZU5EV-2SFVC784I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU5 | AMD | 252 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | |||||||||||||||
| Mfr Part No XAZU2EG-1SFVC784Q | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XAZU2 | AMD | 128 | Tray | Active | -40°C ~ 125°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 1.2GHz | 1.2MB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I²C, SPI, UART/USART, USB | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | |||||||||||||||
| Mfr Part No XC7Z045-2FF900I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XC7Z045 | AMD | 130 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq®-7000 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 350K Logic Cells | - | |||||||||||||||
| Mfr Part No AGFB023R25A3I3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | ||||||||||||||||
| Mfr Part No AGFB023R25A2E2V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | ||||||||||||||||
| Mfr Part No XCZU17EG-3FFVC1760E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | XCZU17 | AMD | 512 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | |||||||||||||||
| Mfr Part No AGIB022R31B1E1V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||
| Mfr Part No AGFB008R24C2I3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 576 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | ||||||||||||||||
| Mfr Part No XCZU11EG-1FFVC1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | XCZU11 | AMD | 360 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | |||||||||||||||
| Mfr Part No XCVC1502-1MLIVSVA2197 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 586 | Tray | Active | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 800k Logic Cells | - | |||||||||||||||||
| Mfr Part No AGFA008R24C3I3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 576 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | ||||||||||||||||
| Mfr Part No XCVC1502-1MLIVSVA1596 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA, FCBGA | AMD | 478 | Tray | Active | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 800k Logic Cells | - | ||||||||||||||||||
| Mfr Part No AGFD019R25A2E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | ||||||||||||||||
| Mfr Part No MAX32680GLR | Analog Devices | Datasheet | - | - | Min: 1 Mult: 1 | 88-VFLGA Exposed Pad | 88-LGA (10x10) | 128 kB | I2C, SPI, UART | 100 MHz | + 85 C | Analog Devices Inc./Maxim Integrated | - 40 C | SMD/SMT | MSL 3 - 168 hours | 36 | Tray | Active | 3.6 V | 2 V | -40°C ~ 85°C (TA) | - | I2C, I2S, SPI, UART | 100MHz | 128kB | ARM® Cortex®-M4F | DMA, I²S, PWM, WDT | 512KB | Bluetooth, I²C, SPI, UART | MCU | 32bit | - | 512kB | ARM Cortex-M4F | |||
| Mfr Part No XCVC1802-1MSIVIVA1596 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | + 110 C | AMD Xilinx | - 40 C | 500 | Active | -40°C ~ 100°C (TJ) | 800 mV | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | |||||||||||||||
| Mfr Part No XCVM1802-2MSIVSVA2197 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD Xilinx | 770 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||
| Mfr Part No XCVM1802-2MSIVSVD1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD Xilinx | 726 | Active | -40°C ~ 100°C (TJ) | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||
| Mfr Part No XCVM1802-1MSIVSVD1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD Xilinx | 726 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - |
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AGFB006R16A2I3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGIB019R18A2E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU5EV-2SFVC784I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XAZU2EG-1SFVC784Q
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z045-2FF900I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB023R25A3I3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB023R25A2E2V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU17EG-3FFVC1760E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGIB022R31B1E1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB008R24C2I3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU11EG-1FFVC1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1502-1MLIVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA008R24C3I3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1502-1MLIVSVA1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFD019R25A2E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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MAX32680GLR
Analog Devices
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1802-1MSIVIVA1596
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1802-2MSIVSVA2197
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1802-2MSIVSVD1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1802-1MSIVSVD1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire