The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Supplier Device Package | Base Product Number | Brand | Data Converters | Factory Pack QuantityFactory Pack Quantity | Manufacturer | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Number of I/Os | Package | Product Status | RoHS | Operating Temperature | Packaging | Series | Subcategory | Operating Supply Voltage | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | Core Processor | Peripherals | Program Memory Type | Core Size | Program Memory Size | Connectivity | Architecture | Product Type | EEPROM Size | Primary Attributes | Flash Size | Product Category |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No XCVM2502-1MSIVSVC2197 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | + 110 C | - 40 C | 800 mV | |||||||||||||||||||||||||||||||||||
| Mfr Part No XCVP1202-1MSEVSVC2197 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | + 100 C | 0 C | 800 mV | |||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-1LSIVFVB1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | + 110 C | - 40 C | 700 mV | |||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1502-2MLEVFVB1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | + 110 C | 0 C | 800 mV | |||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM2202-1MLIVSVC2197 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | + 110 C | - 40 C | 800 mV | |||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1502-2MSIVFVB1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | + 110 C | - 40 C | 800 mV | |||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-2HSIVSVD1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | + 110 C | AMD Xilinx | - 40 C | 402 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 880 mV | 800MHz, 1.65GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 70k Logic Cells | - | |||||||||||||||||||
| Mfr Part No XCVM1402-2MLIVSVF1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | + 110 C | - 40 C | 800 mV | |||||||||||||||||||||||||||||||||||
| Mfr Part No AGFD023R25A1E1V | Intel | Datasheet | 754 |
| Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | ||||||||||||||||||||||
| Mfr Part No XCZU67DR-2FSVE1156I | Xilinx | Datasheet | 72 | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | SOC - Systems on a Chip | SoC FPGA | |||||||||||||||||||||||||||||||||
| Mfr Part No CY8C4147LQE-S473T | Infineon | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | CY8C4147 | Infineon Technologies | A/D 16x10b, 20x12b SAR | 2500 | Infineon | Infineon Technologies | Yes | 34 | Tape & Reel (TR) | Active | Details | -40°C ~ 125°C (TA) | Reel | Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus | SOC - Systems on a Chip | External, Internal | 24MHz | 16K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 128KB (128K x 8) | CANbus, FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | |||||||
| Mfr Part No CY8C4126AZE-S455T | Infineon | Datasheet | 17 |
| Min: 1 Mult: 1 | Surface Mount | 64-LQFP | 64-TQFP (10x10) | Infineon Technologies | A/D 16x10b, 20x12b SAR | 1500 | Infineon | Infineon Technologies | Yes | 54 | Tape & Reel (TR) | Active | Details | -40°C ~ 125°C (TA) | Reel | Automotive, AEC-Q100, PSOC® 4 CY8C4100S Plus | SOC - Systems on a Chip | External, Internal | 24MHz | 8K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 64KB (64K x 8) | FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | ||||||||
| Mfr Part No CY8C4147LQS-S283T | Infineon | Datasheet | 17 |
| Min: 1 Mult: 1 | Surface Mount, Wettable Flank | 40-UFQFN Exposed Pad | 40-QFN (6x6) | CY8C4147 | Infineon Technologies | A/D 16x10b, 20x12b SAR | 2500 | Infineon | Infineon Technologies | Yes | 34 | Tape & Reel (TR) | Active | Details | -40°C ~ 105°C (TA) | Reel | Automotive, AEC-Q100, PSOC® 4 CY8C4100 | SOC - Systems on a Chip | External, Internal | 24MHz | 16K x 8 | 1.71V ~ 5.5V | ARM® Cortex®-M0+ | Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT | FLASH | 32-Bit | 128KB (128K x 8) | CANbus, FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART | ARM Microcontrollers - MCU | - | SoC FPGA | |||||||
| Mfr Part No 1SX040HH1F35E1VG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | 374 | Tray | Active | 0°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 400K Logic Elements | - | ||||||||||||||||||||||
| Mfr Part No XCVC1702-2MLENSVG1369 | AMD | Datasheet | 708 |
| Min: 1 Mult: 1 | AMD | Tray | Active | * | ||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA014R24B3E4X | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 768 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | ||||||||||||||||||||||
| Mfr Part No XCZU4CG-L1FBVB900I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU4 | AMD | 204 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | |||||||||||||||||||||
| Mfr Part No XCVM1502-2MSEVSVA2197 | AMD | Datasheet | 425 |
| Min: 1 Mult: 1 | AMD | Tray | Active | * | ||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA022R25A2I3E | Intel | Datasheet | 626 |
| Min: 1 Mult: 1 | - | - | Intel | 624 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||
| Mfr Part No 1SX040HH1F35I2VG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | 374 | Tray | Active | -40°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 400K Logic Elements | - |
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XCVM2502-1MSIVSVC2197
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVP1202-1MSEVSVC2197
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1302-1LSIVFVB1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1502-2MLEVFVB1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM2202-1MLIVSVC2197
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1502-2MSIVFVB1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1302-2HSIVSVD1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1402-2MLIVSVF1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFD023R25A1E1V
Intel
Package:Embedded - System On Chip (SoC)
25,648.013509
-
XCZU67DR-2FSVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
CY8C4147LQE-S473T
Infineon
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
CY8C4126AZE-S455T
Infineon
Package:Embedded - System On Chip (SoC)
7.829892
-
CY8C4147LQS-S283T
Infineon
Package:Embedded - System On Chip (SoC)
6.872101
-
1SX040HH1F35E1VG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1702-2MLENSVG1369
AMD
Package:Embedded - System On Chip (SoC)
25,237.411404
-
AGFA014R24B3E4X
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU4CG-L1FBVB900I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1502-2MSEVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
8,897.845329
-
AGFA022R25A2I3E
Intel
Package:Embedded - System On Chip (SoC)
20,301.471331
-
1SX040HH1F35I2VG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire