The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
- Number of I/Os
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- Peripherals
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- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Contact Plating | Mount | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Illuminated | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Number of Terminations | Termination | Temperature Coefficient | Connector Type | Type | Resistance | Number of Positions | Max Operating Temperature | Min Operating Temperature | Composition | Gender | Power (Watts) | HTS Code | Fastening Type | Subcategory | Technology | Terminal Position | Orientation | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Depth | Reach Compliance Code | Termination Style | JESD-30 Code | Number of Outputs | Qualification Status | Number of Contacts | Actuator Type | Power Supplies | Temperature Grade | Plating | Speed | RAM Size | Core Processor | Number of Poles | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Product Type | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Product | Features | Product Category | Height Seated (Max) | Length | Width | Radiation Hardening | Ratings |
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 | Mfr Part No AGFA023R24C3E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | 480 | 0°C ~ 100°C (TJ) | Tray | Agilex F | Active | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA006R24C2I1VB | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | 576 | -40°C ~ 100°C (TJ) | Tray | Agilex F | Active | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA008R24C2E1VB | Intel | Datasheet | 685 |
| Min: 1 Mult: 1 | 2340-BFBGA Exposed Pad | 2340-BGA (45x42) | 576 | 0°C ~ 100°C (TJ) | Tray | Agilex F | Active | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AMA3B1KK-KCR-TB | Ambiq Micro, Inc. | Datasheet | 17491 |
| Min: 1 Mult: 1 | 66-UFBGA, CSPBGA | 66-CSP (3.38x3.25) | AMA3B1KK | 37 | -40°C ~ 85°C (TA) | Tape & Reel (TR) | Apollo3 Blue | Active | 96MHz | 384KB | ARM® Cortex®-M4F | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | I2C, SPI, UART/USART | MCU | 1MB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3CG-1SFVC784E | AMD | Datasheet | 1615 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU3 | AMD | 252 | Tray | Active | Non-Compliant | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVE1752-2MLEVSVA1596 | AMD | Datasheet | 539 | - | Min: 1 Mult: 1 | 1596-BFBGA, FCBGA | AIRPAX | 3 | Not Illuminated | Sensata | + 85 C | AMD | - 40 C | Panel Mount | 500 | Tray | Active | AIRPAX | 3.174657 oz | IAL/IDL/IML/IUL | Hydraulic-Magnetic | Circuit Breakers | Stud | Handle | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 1 Pole | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Magnetic Circuit Breakers | - | Circuit Breakers | Circuit Breakers | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3CG-1SBVA484I | AMD | Datasheet | 551 |
| Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | XCZU3 | AIRPAX | 3 | Not Illuminated | Sensata | + 85 C | AMD | - 40 C | Panel Mount | 82 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | Circuit Breakers | Push-On | Toggle | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | 2 Pole | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | Circuit Breakers | Circuit Breakers | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU19EG-2FFVB1517I | AMD | Datasheet | 436 |
| Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU19 | TE Connectivity / AMP | 5000 | TE Connectivity | AMD | 644 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | Wire & Cable Management | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Wire Labels & Markers | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | Wire Labels & Markers | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS016E3F29I1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 780-BBGA, FCBGA | 780-FBGA (29x29) | 288 | Non-Compliant | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Discontinued at Digi-Key | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 160K Logic Elements | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027H3F34I2SG | ALTERA | Datasheet | 547 |
| Min: 1 Mult: 1 | FBGA-1152 | YES | 1152 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS027H3F34I2SG | 1.2 GHz | Yes | SMD/SMT | 384 | 33750 LAB | 270000 LE | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 964831 | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 384 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||
| Mfr Part No LH79525N0Q100A0，55 | NXP | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB006R24C3E3V | Intel | Datasheet | 539 | - | Min: 1 Mult: 1 | Gold | Bulkhead, Front Side Nut, Jam Nut, Panel | - | - | Intel | 576 | Tray | Active | Compliant | 0°C ~ 100°C (TJ) | Bulk | Agilex F | Crimp | Crimp, Receptacle | 66 | 175 °C | -65 °C | Female | Threaded | Straight | 46.02 mm | 66 | Cadmium | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | 31.57 mm | No | Environment Resistant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB006R24C2I3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 576 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA012R24C3E3V | Intel | Datasheet | 532 |
| Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | Non-Compliant | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3EG-1SFVC784E | AMD | Datasheet | 706 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU3 | AMD | 252 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-L2FSVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Panduit Corp | 366 | Bulk | Obsolete | -40°C ~ 100°C (TJ) | * | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-2FSVE1156E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 0805 (2012 Metric) | 0805 | RN732A | KOA Speer Electronics, Inc. | 366 | Tape & Reel (TR) | Obsolete | -55°C ~ 155°C | RN73 | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±0.5% | 2 | ±25ppm/°C | 1.18 kOhms | Thin Film | 0.1W, 1/10W | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | Moisture Resistant | 0.024 (0.60mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-L2FFVG1517I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | 505433 | Molex | 561 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-1FFVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Pulse Electronics | 366 | Bulk | Obsolete | -40°C ~ 100°C (TJ) | - | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU46DR-2FSVH1760E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | BLF6 | NXP USA Inc. | 574 | Tube | Active | 0°C ~ 100°C (TJ) | * | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - |
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AGFA023R24C3E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA006R24C2I1VB
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA008R24C2E1VB
Intel
Package:Embedded - System On Chip (SoC)
11,191.195794
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AMA3B1KK-KCR-TB
Ambiq Micro, Inc.
Package:Embedded - System On Chip (SoC)
5.467381
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XCZU3CG-1SFVC784E
AMD
Package:Embedded - System On Chip (SoC)
425.840571
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XCVE1752-2MLEVSVA1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU3CG-1SBVA484I
AMD
Package:Embedded - System On Chip (SoC)
556.027146
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XCZU19EG-2FFVB1517I
AMD
Package:Embedded - System On Chip (SoC)
7,601.513387
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10AS016E3F29I1SG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS027H3F34I2SG
ALTERA
Package:Embedded - System On Chip (SoC)
2,091.702166
-
LH79525N0Q100A0，55
NXP
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB006R24C3E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB006R24C2I3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA012R24C3E3V
Intel
Package:Embedded - System On Chip (SoC)
8,768.564807
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XCZU3EG-1SFVC784E
AMD
Package:Embedded - System On Chip (SoC)
561.841450
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XCZU47DR-L2FSVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU47DR-2FSVE1156E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU47DR-L2FFVG1517I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU48DR-1FFVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU46DR-2FSVH1760E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire