The category is 'Embedded - System On Chip (SoC)'
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- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Connectivity | Architecture | Data Bus Width | Number of Inputs | Programmable Logic Type | Core Architecture | Boundary Scan | RAM (words) | Primary Attributes | Number of Logic Cells | Bus Compatibility | UV Erasable | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No XCZU3EG-L1SFVC784I | Xilinx Inc. | Datasheet | 3 | - | Min: 1 Mult: 1 | 11 Weeks | 784-BFBGA, FCBGA | YES | 252 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 784 | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | R-PBGA-B784 | 0.742V | 0.698V | 500MHz, 600MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||||
| Mfr Part No XCZU4EG-2SFVC784I | Xilinx Inc. | Datasheet | 1440 | - | Min: 1 Mult: 1 | 11 Weeks | 784-BFBGA, FCBGA | 252 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XCZU6EG-2FFVB1156I | Xilinx Inc. | Datasheet | 497 | - | Min: 1 Mult: 1 | 11 Weeks | 1156-BBGA, FCBGA | 328 | -40°C~100°C TJ | Tray | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU5CG-1SFVC784E | Xilinx Inc. | Datasheet | 535 |
| Min: 1 Mult: 1 | 11 Weeks | 784-BFBGA, FCBGA | 252 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4CG-2SFVC784I | Xilinx Inc. | Datasheet | 532 |
| Min: 1 Mult: 1 | 11 Weeks | 784-BFBGA, FCBGA | YES | 252 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | 784 | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | NOT SPECIFIED | S-PBGA-B784 | 533MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||
 | Mfr Part No 10AS066H3F34I2LG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 1152-BBGA, FCBGA | YES | 492 | -40°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B1152 | 492 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 660K Logic Elements | 660000 | 3.65mm | 35mm | 35mm | RoHS Compliant | |||||||||||||||||||||||||
 | Mfr Part No XCZU3CG-1SBVA484I | Xilinx Inc. | Datasheet | 491 |
| Min: 1 Mult: 1 | 11 Weeks | 484-BFBGA, FCBGA | 82 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU6EG-L1FFVB1156I | Xilinx Inc. | Datasheet | 360 | - | Min: 1 Mult: 1 | 11 Weeks | 1156-BBGA, FCBGA | YES | 328 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | R-PBGA-B1156 | 0.742V | 0.698V | 500MHz, 600MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
| Mfr Part No XCZU2EG-L1SBVA484I | Xilinx Inc. | Datasheet | 2400 | - | Min: 1 Mult: 1 | 11 Weeks | 484-BFBGA, FCBGA | YES | 82 | -40°C~100°C TJ | Tray | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 484 | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | R-PBGA-B484 | 0.742V | 0.698V | 500MHz, 600MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||||||||
 | Mfr Part No XCZU4CG-2FBVB900E | Xilinx Inc. | Datasheet | 800 | - | Min: 1 Mult: 1 | 11 Weeks | 900-BBGA, FCBGA | 204 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | yes | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU5CG-2SFVC784I | Xilinx Inc. | Datasheet | 606 |
| Min: 1 Mult: 1 | 11 Weeks | 784-BFBGA, FCBGA | YES | 252 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | 784 | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | NOT SPECIFIED | S-PBGA-B784 | 533MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EV-3FBVB900E | Xilinx Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 11 Weeks | 900-BBGA, FCBGA | 204 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC7Z045-2FF900I | Xilinx Inc. | Datasheet | 636 |
| Min: 1 Mult: 1 | 10 Weeks | 900-BBGA, FCBGA | YES | 130 | -40°C~100°C TJ | Tray | 2016 | Zynq®-7000 | Active | 4 (72 Hours) | 900 | GPIO WITH FOUR 32-BIT BANKS | 8542.39.00.01 | BOTTOM | BALL | compliant | S-PBGA-B900 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 800MHz | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | YES | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN, ETHERNET, I2C, PCI, SPI, UART, USB | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| Mfr Part No XCZU5EV-2SFVC784I | Xilinx Inc. | Datasheet | 484 |
| Min: 1 Mult: 1 | 11 Weeks | 784-BFBGA, FCBGA | 252 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EV-3FFVC1156E | Xilinx Inc. | Datasheet | 3600 | - | Min: 1 Mult: 1 | 11 Weeks | 1156-BBGA, FCBGA | 360 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XA7Z010-1CLG225Q | Xilinx Inc. | Datasheet | 5332 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 225-LFBGA, CSPBGA | 225 | 86 | Automotive grade | -40°C~125°C TJ | Tray | 2010 | Automotive, AEC-Q100, Zynq®-7000 XA | e1 | Active | 3 (168 Hours) | 225 | EAR99 | TIN SILVER COPPER | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.8mm | 667MHz | NOT SPECIFIED | Not Qualified | 1V | 11.8V | CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | Artix™-7 FPGA, 28K Logic Cells | N | 1.5mm | 13mm | ROHS3 Compliant | ||||||||||||||||||||
| Mfr Part No XCZU3EG-L2SFVC784E | Xilinx Inc. | Datasheet | 335 | - | Min: 1 Mult: 1 | 11 Weeks | 784-BFBGA, FCBGA | YES | 252 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 784 | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | R-PBGA-B784 | 0.742V | 0.698V | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||||
| Mfr Part No XCZU4EG-3SFVC784E | Xilinx Inc. | Datasheet | 124 | - | Min: 1 Mult: 1 | 11 Weeks | 784-BFBGA, FCBGA | 252 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3EG-2SBVA484I | Xilinx Inc. | Datasheet | 726 | - | Min: 1 Mult: 1 | 11 Weeks | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | 82 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XCZU9CG-2FFVC900E | Xilinx Inc. | Datasheet | 771 | - | Min: 1 Mult: 1 | 11 Weeks | 900-BBGA, FCBGA | 204 | 0°C~100°C TJ | Tray | 2013 | Zynq® UltraScale+™ MPSoC CG | yes | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | ROHS3 Compliant |
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XCZU3EG-L1SFVC784I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU4EG-2SFVC784I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU6EG-2FFVB1156I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU5CG-1SFVC784E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
1,356.470390
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XCZU4CG-2SFVC784I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
1,541.092741
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10AS066H3F34I2LG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU3CG-1SBVA484I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
558.253399
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XCZU6EG-L1FFVB1156I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU2EG-L1SBVA484I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU4CG-2FBVB900E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU5CG-2SFVC784I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
2,441.332165
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XCZU7EV-3FBVB900E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z045-2FF900I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
1,743.398413
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XCZU5EV-2SFVC784I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
2,853.866066
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XCZU7EV-3FFVC1156E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XA7Z010-1CLG225Q
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
86.557476
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XCZU3EG-L2SFVC784E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU4EG-3SFVC784E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU3EG-2SBVA484I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU9CG-2FFVC900E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire