Embedded - System On Chip (SoC) (6000)

-

-

Min: 1

Mult: 1

QFN-48

ARM Cortex M33

64 kB

RAM

I2C, SPI, UART

78 MHz

2 Mbps

+ 125 C

- 40 C

Yes

SMD/SMT

31 I/O

Details

4.2 mA

25 mA

3.8 V

1.71 V

Wi-Fi

868 MHz, 915 MHz, 920 MHz

Flash

512 kB

14 dBm

32 bit

- 96.9 dBm

1 Channel

5

12 bit, 16 bit

6 mm

6 mm

6 mm

-

-

Min: 1

Mult: 1

QFN-48

ARM Cortex M33

64 kB

RAM

I2C, SPI, UART

78 MHz

2 Mbps

+ 125 C

- 40 C

Yes

SMD/SMT

30 I/O

Details

4.2 mA

25 mA

3.8 V

1.71 V

Wi-Fi

922.3 MHz to 928.1 MHz

Flash

512 kB

20 dBm

32 bit

- 110.1 dBm

1 Channel

5

12 bit, 16 bit

6 mm

6 mm

6 mm

-

-

Min: 1

Mult: 1

Surface Mount

QFN-24

24-QFN (4x4)

ESP8684

RISC-V

272 kB

SRAM

5000

GPIO, I2C, SPI, UART

120 MHz

72.2 Mbps

+ 105 C

Espressif Systems

- 40 C

Yes

SMD/SMT

Tape & Reel (TR)

Active

62 mA

370 mA

3.6 V

3 V

-40°C ~ 105°C

ESP8684

Bluetooth, Wi-Fi

3V ~ 3.6V

2.402GHz ~ 2.48GHz, 2.412GHz ~ 2.484GHz

2.4 GHz

576KB ROM, 272KB SRAM

Flash

4 MB

20 dBm

802.11b/g/n, Bluetooth v5.0

35dBm

Bluetooth, WiFi

- 106.5 dBm

72.2Mbps

5 Channel

ADC, GPIO, I²C, I²S, PWM, SPI, UART

65mA

300mA ~ 370mA

3

-

14

12 bit

0.85 mm

4 mm

4 mm

-

-

Min: 1

Mult: 1

FCBGA-900

ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2

-

6.2 Mbit

11 Mbit

1

2 x 32 kB, 4 x 32 kB

2 x 32 kB, 4 x 32 kB

600 MHz, 667 MHz, 1.5 GHz

+ 100 C

0 C

SMD/SMT

204 I/O

28800 LAB

504000 LE

This product may require additional documentation to export from the United States.

Zynq UltraScale+

XCZU7EV

0.85 V

-

16 Transceiver

7 Core

-

-

Min: 1

Mult: 1

ARM Cortex A9

-

943

2 x 32 kB

2 x 32 kB

667 MHz

6650 LAB

85000 LE

Zynq

XC7Z045

-

2 Core

-

-

Min: 1

Mult: 1

FBGA-1156

ARM Cortex A53, ARM Cortex R5F

256 kB

6.9 Mb

1

2 x 32 kB, 2 x 32 kB

2 x 32 kB, 2 x 32 kB

+ 100 C

0 C

SMD/SMT

353 I/O

26825.5 LAB

469446 LE

850 mV

24 Transceiver

4 Core

-

-

Min: 1

Mult: 1

WLBGA-128

ARM Cortex M3, ARM Cortex R4

5000

433.3 Mbps

+ 70 C

- 20 C

SMD/SMT

Details

-

-

1.26 V

1.14 V

Cut Tape

Bluetooth, Wi-Fi

2.4 GHz, 5 GHz

768 B

9.5 dBm

- 96.2 dBm

-

-

Min: 1

Mult: 1

Surface Mount

WLBGA-194

194-WLBGA (5.16x7.7)

ARM Cortex M4, ARM Cortex R4

5000

867 Mbps

+ 85 C

Infineon Technologies

- 40 C

SMD/SMT

Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;

Active

Details

-

-

1.26 V

1.14 V

-20°C ~ 70°C (TA)

MouseReel

-

Bluetooth, Wi-Fi

3V ~ 4.8V

2.4GHz, 5GHz

2.4 GHz, 5 GHz

896kB RAM, 896kB ROM

-

13 dBm

802.11a/b/g/-c, Bluetooth v5.0

21dBm

Bluetooth, WiFi

- 98.5 dBm

433.3Mbps

I²S, PCM, UART, USB

-

-

16QAM, 64QAM, 256QAM, BPSK, CCK, DSSS, GFSK, OFDM

-

-

Min: 1

Mult: 1

Surface Mount

60-VFQFN Exposed Pad

60-QFN (7x7)

ARM Cortex M4

2600

6 Mbps

+ 70 C

Infineon Technologies

0 C

Tray

Discontinued at Digi-Key

Details

8 mA

18 mA

3.63 V

1.7 V

0°C ~ 70°C

Tray

AIROC™ Bluetooth

Bluetooth

1.62V ~ 3.63V

2.4GHz

2.4 GHz

384kB RAM, 2MB ROM

2 MB

12 dBm

Bluetooth v5.2

12dBm

Bluetooth

- 94.5 dBm

2Mbps

ADC, I²C, PWM, SPI, UART

8mA

18mA

GFSK

24

-

-

Min: 1

Mult: 1

FPBGA-484

484-FPBGA (23x23)

M2S005

ARM Cortex M3

64 kB

60

-

-

166 MHz

Microchip Technology

Yes

SMD/SMT

209

505 LAB

6060 LE

Tray

Active

N

This product may require additional documentation to export from the United States.

1.2000 V

-40 to 100 °C

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

1

FPGA - 5K Logic Modules

1 Core

128KB

-

-

Min: 1

Mult: 1

Production (Last Updated: 2 months ago)

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

M2S060

ARM Cortex M3

64 kB

176

MICROSEMI CORP

-

-

M2S060T-1FCS325

166 MHz

Microchip Technology

Yes

200

4710 LAB

56520 LE

85 °C

Tray

PLASTIC/EPOXY

TFBGA

TFBGA, BGA325,21X21,20

BGA325,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

Active

Active

30

5.86

N

No

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

SmartFusion2

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

S-PBGA-B325

200

Not Qualified

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

FIELD PROGRAMMABLE GATE ARRAY

FPGA - 60K Logic Modules

56520

1 Core

256KB

11 mm

11 mm

-

-

Min: 1

Mult: 1

Production (Last Updated: 2 months ago)

325-TFBGA, FCBGA

YES

325-FCBGA (11x11)

325

M2S050

ARM Cortex M3

64 kB

176

MICROSEMI CORP

-

-

M2S050-FCS325

166 MHz

Microchip Technology

Yes

200

4695 LAB

56340 LE

85 °C

Tray

PLASTIC/EPOXY

TFBGA

FBGA-325

BGA325,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

Active

Active

30

5.81

N

No

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

S-PBGA-B325

200

Not Qualified

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

FIELD PROGRAMMABLE GATE ARRAY

FPGA - 50K Logic Modules

56340

1 Core

256KB

11 mm

11 mm

Contains Lead

-

-

Min: 1

Mult: 1

VFPBGA-400

YES

400-VFBGA (17x17)

400

M2S050

ARM Cortex M3

64 kB

90

MICROSEMI CORP

-

-

M2S050-VFG400I

166 MHz

Microchip Technology

Yes

3

SMD/SMT

207

4695 LAB

56340 LE

Tray

PLASTIC/EPOXY

LFBGA

LFBGA, BGA400,20X20,32

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Active

Active

40

5.76

Details

Yes

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B400

207

Not Qualified

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

207

1.51 mm

FIELD PROGRAMMABLE GATE ARRAY

FPGA - 50K Logic Modules

56340

1 Core

256KB

17 mm

17 mm

-

-

Min: 1

Mult: 1

VFPBGA-400

YES

400-VFBGA (17x17)

400

M2S005

ARM Cortex M3

64 kB

90

MICROSEMI CORP

-

-

M2S005-1VFG400I

166 MHz

1.26 V

Microchip Technology

1.14 V

Yes

3

SMD/SMT

169

505 LAB

6060 LE

Tray

PLASTIC/EPOXY

LFBGA

VFBGA-400

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Active

Active

40

5.79

Details

Yes

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

1.2000 V

-40 to 100 °C

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

CMOS

BOTTOM

BALL

250

0.8 mm

compliant

S-PBGA-B400

171

Not Qualified

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR

128 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

171

1.51 mm

FIELD PROGRAMMABLE GATE ARRAY

1

FPGA - 5K Logic Modules

6060

1 Core

128KB

17 mm

17 mm

-

-

Min: 1

Mult: 1

Production (Last Updated: 2 months ago)

676-BGA

676-FBGA (27x27)

M2S060

ARM Cortex M3

64 kB

40

-

-

166 MHz

Microchip Technology

Yes

387

4710 LAB

56520 LE

Tray

Active

Details

This product may require additional documentation to export from the United States.

SmartFusion2

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 60K Logic Modules

1 Core

256KB

-

-

Min: 1

Mult: 1

Production (Last Updated: 2 months ago)

FPBGA-484

484-FPBGA (23x23)

M2S050

ARM Cortex M3

64 kB

60

-

-

166 MHz

Microchip Technology

Yes

SMD/SMT

267

4695 LAB

56340 LE

Tray

Active

Details

This product may require additional documentation to export from the United States.

0°C ~ 85°C (TJ)

Tray

SmartFusion2

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

FPGA - 50K Logic Modules

1 Core

256KB

-

-

Min: 1

Mult: 1

1152-BBGA, FCBGA

YES

1152-FCBGA (35x35)

1152

M2S150

ARM Cortex M3

64 kB

24

MICROSEMI CORP

-

-

M2S150TS-FCG1152

166 MHz

Microchip Technology

Yes

4

574

12177 LAB

146124 LE

85 °C

Tray

PLASTIC/EPOXY

BGA

BGA, BGA1152,34X34,40

BGA1152,34X34,40

SQUARE

GRID ARRAY

Active

Active

5.8

Details

Yes

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e1

Tin/Silver/Copper (Sn/Ag/Cu)

CMOS

BOTTOM

BALL

250

1 mm

compliant

40

S-PBGA-B1152

574

Not Qualified

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

512 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

574

2.9 mm

FIELD PROGRAMMABLE GATE ARRAY

STD

FPGA - 150K Logic Modules

146124

1 Core

512KB

35 mm

35 mm

-

-

Min: 1

Mult: 1

Production (Last Updated: 2 months ago)

FCBGA-325

YES

325-FCBGA (11x11)

325

M2S050

ARM Cortex M3

64 kB

176

MICROSEMI CORP

-

-

M2S050T-1FCS325I

166 MHz

Microchip Technology

Yes

SMD/SMT

200

4695 LAB

56340 LE

Tray

PLASTIC/EPOXY

TFBGA

FBGA-325

BGA325,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

Active

Active

30

5.81

N

No

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

S-PBGA-B325

200

Not Qualified

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

200

1.01 mm

FIELD PROGRAMMABLE GATE ARRAY

FPGA - 50K Logic Modules

56340

1 Core

256KB

11 mm

11 mm

-

-

Min: 1

Mult: 1

Production (Last Updated: 1 month ago)

VFPBGA-400

YES

400-VFBGA (17x17)

400

M2S010

ARM Cortex M3

64 kB

90

MICROSEMI CORP

-

-

M2S010TS-1VF400

166 MHz

Microchip Technology

Yes

SMD/SMT

195

1007 LAB

12084 LE

85 °C

Tray

PLASTIC/EPOXY

LFBGA

LFBGA, BGA400,20X20,32

BGA400,20X20,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Active

Active

30

5.88

N

No

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

0°C ~ 85°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.8 mm

not_compliant

S-PBGA-B400

195

Not Qualified

1.2 V

OTHER

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

195

1.51 mm

FIELD PROGRAMMABLE GATE ARRAY

FPGA - 10K Logic Modules

12084

1 Core

256KB

17 mm

17 mm

-

-

Min: 1

Mult: 1

Production (Last Updated: 2 months ago)

FCBGA-325

YES

325-FCBGA (11x11)

325

M2S025

ARM Cortex M3

64 kB

176

MICROSEMI CORP

-

-

M2S025T-FCS325I

166 MHz

Microchip Technology

Yes

SMD/SMT

MSL 3 - 168 hours

180

2308 LAB

27696 LE

Tray

PLASTIC/EPOXY

TFBGA

FBGA-325

BGA325,21X21,20

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

Active

Active

30

5.84

N

No

This product may require additional documentation to export from the United States.

1.26 V

1.14 V

1.2 V

-40°C ~ 100°C (TJ)

Tray

SmartFusion2

e0

Tin/Lead (Sn/Pb)

LG-MIN, WD-MIN

8542.39.00.01

CMOS

BOTTOM

BALL

240

0.5 mm

not_compliant

S-PBGA-B325

180

Not Qualified

1.2 V

166MHz

64KB

ARM® Cortex®-M3

DDR, PCIe, SERDES

256 kB

CANbus, Ethernet, I²C, SPI, UART/USART, USB

MCU, FPGA

180

1.01 mm

FIELD PROGRAMMABLE GATE ARRAY

592Kbit

FPGA - 25K Logic Modules

27696

1 Core

256KB

11 mm

11 mm