The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Base Product Number | Breakdown Voltage-Nom | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Mfr | Mounting | Number of I/Os | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Part Status | Resistance | Terminal Finish | HTS Code | Capacitance | Subcategory | Pitch | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Polarity | Power Supplies | Temperature Grade | Note | Voltage | Speed | Diode Type | RAM Size | Core Processor | Peripherals | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Rep Pk Reverse Voltage-Max | Primary Attributes | Number of CLBs | Number of Logic Cells | Clamping Voltage-Max | Flash Size | Height Seated (Max) | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No XCZU47DR-L1FSVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Terminal: ¼in Triple Quick-Connect, w/Resistor | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | BARKER MICROFARADS INC | AMD Xilinx | 366 | Tray | Active | Y | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-L2FSVG1517I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | SMD | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | ECE/EXCEL CELL ELECTRONIC CORP | AMD Xilinx | 561 | Tray | Active | Y | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 106.5mm (4.193 x 14.5mm (0.571in) W | 10 Amp, 300 VAC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | 16mm (0.630in) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-1FSVE1156E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Terminal: ¼in Triple Quick-Connect, w/Bracket | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | BARKER MICROFARADS INC | AMD Xilinx | 366 | Tray | Active | Y | 0°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU49DR-L1FFVF1760I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Terminal: ¼in Triple Quick-Connect, no accessories | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | BARKER MICROFARADS INC | AMD Xilinx | 622 | Tray | Active | Y | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-L1FSVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Terminal: ¼in QUAD Quick Connect, w/Resistor | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | BARKER MICROFARADS INC | AMD Xilinx | 366 | Tray | Active | Y | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-1FSVG1517I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Terminal: ¼in QUAD Quick Connect, w/Stud Can | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | BARKER MICROFARADS INC | AMD Xilinx | 561 | Tray | Active | Y | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-L1FFVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Terminal: ¼in Combos: 2, 3 or 4, Ground Lug | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | BARKER MICROFARADS INC | AMD Xilinx | 366 | Tray | Active | Y | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-1FFVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Terminal: ¼in QUAD Quick Connect, Ground Lug | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | BARKER MICROFARADS INC | AMD Xilinx | 366 | Tray | Active | Y | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | Zynq® UltraScale+™ RFSoC | ±3% | 405uF | 370VAC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-L2FSVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Term: ¼in Solder Lug Quick-Connect, Ground Lug | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | BARKER MICROFARADS INC | AMD Xilinx | 366 | Active | Y | -40°C ~ 100°C (TJ) | 2.156in x 1.312in Oval Case | ±3% | 405uF | 370VAC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB008R16A2I1V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | PCB | 384 | Tray | Active | Yes | -40°C ~ 100°C (TJ) | COMBICON MKKDS | 5 mm | - | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM58103B0KFBG | Broadcom | Datasheet | - | - | Min: 1 Mult: 1 | Terminal: ¼in Combos: 2, 3 or 4, w/Stud Can | BCM58103 | BARKER MICROFARADS INC | Broadcom Limited | Bulk | Active | Y | 1.75in Round Case | * | ±10% | 206uF | 440VAC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5ASXBB5D4F31C6N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 896-BBGA, FCBGA | YES | 896-FBGA (31x31) | 896 | INTEL CORP | Intel Corporation | 5ASXBB5D4F31C6N | MCU - 208, FPGA - 250 | 85 °C | PLASTIC/EPOXY | BGA | FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Obsolete | NOT SPECIFIED | 5.28 | Yes | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Arria V SX | e1 | Obsolete | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5ASXBB5 | S-PBGA-B896 | 250 | COMMERCIAL EXTENDED | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 250 | 17434 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 462K Logic Elements | 17434 | 462000 | -- | 31 mm | 31 mm | ||||||||||||||||||||||||||
| Mfr Part No 5ASXFB5G4F35I3N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | INTEL CORP | Intel Corporation | 5ASXFB5G4F35I3N | MCU - 208, FPGA - 385 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | End Of Life | NOT SPECIFIED | 5.28 | Yes | 1.18 V | 1.12 V | 1.15 V | -40°C ~ 100°C (TJ) | Tray | Arria V SX | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5ASXFB5 | S-PBGA-B1152 | 540 | INDUSTRIAL | 1.05GHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 17434 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 462K Logic Elements | 17434 | 462000 | -- | 35 mm | 35 mm | ||||||||||||||||||||||||
| Mfr Part No 5ASXMB5G4F40C6N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | YES | 1517-FBGA (40x40) | 1517 | INTEL CORP | Intel Corporation | 5ASXMB5G4F40C6N | MCU - 208, FPGA - 540 | 85 °C | PLASTIC/EPOXY | BGA | FBGA-1517 | BGA1517,39X39,40 | SQUARE | GRID ARRAY | Obsolete | NOT SPECIFIED | 5.28 | Yes | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | SWT | e1 | Obsolete | 5000 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5ASXMB5 | S-PBGA-B1517 | 540 | COMMERCIAL EXTENDED | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 17434 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 462K Logic Elements | 17434 | 462000 | -- | 40 mm | 40 mm | |||||||||||||||||||||||||
| Mfr Part No 5ASXFB5G4F35I5N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | 67.8 | INTEL CORP | Intel Corporation | 5ASXFB5G4F35I5N | MCU - 208, FPGA - 385 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | End Of Life | NOT SPECIFIED | 5.28 | Yes | 1.13 V | 1.07 V | 1.1 V | -40°C ~ 100°C (TJ) | Tray | Arria V SX | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5ASXFB5 | S-PBGA-B1152 | 385 | Not Qualified | BIDIRECTIONAL | 1.1,1.2/3.3,2.5 V | INDUSTRIAL | 800MHz | TRANS VOLTAGE SUPPRESSOR DIODE | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 385 | 17434 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 58 | FPGA - 462K Logic Elements | 17434 | 462000 | 93.6 | -- | 35 mm | 35 mm | ||||||||||||||||
| Mfr Part No 5ASXBB3D4F35C6N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | INTEL CORP | Intel Corporation | 5ASXBB3D4F35C6N | MCU - 208, FPGA - 385 | 85 °C | PLASTIC/EPOXY | BGA | FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Obsolete | NOT SPECIFIED | 5.28 | Yes | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Arria V SX | e1 | Obsolete | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5ASXBB3 | S-PBGA-B1152 | 385 | COMMERCIAL EXTENDED | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 385 | 13207 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 35 mm | 35 mm | ||||||||||||||||||||||||||
| Mfr Part No 5ASXBB3D4F40C6N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | YES | 1517-FBGA (40x40) | 1517 | INTEL CORP | Intel Corporation | 5ASXBB3D4F40C6N | MCU - 208, FPGA - 540 | 85 °C | PLASTIC/EPOXY | BGA | FBGA-1517 | BGA1517,39X39,40 | SQUARE | GRID ARRAY | Obsolete | NOT SPECIFIED | 5.27 | Yes | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Arria V SX | e1 | Obsolete | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5ASXBB3 | S-PBGA-B1517 | 540 | COMMERCIAL EXTENDED | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 13207 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 40 mm | 40 mm | ||||||||||||||||||||||||||
| Mfr Part No 5ASXFB3H4F40C5N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | YES | 1517-FBGA (40x40) | 1517 | INTEL CORP | Intel Corporation | 5ASXFB3H4F40C5N | MCU - 208, FPGA - 540 | 85 °C | PLASTIC/EPOXY | BGA | BGA, BGA1517,39X39,40 | BGA1517,39X39,40 | SQUARE | GRID ARRAY | End Of Life | NOT SPECIFIED | 5.28 | Yes | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Arria V SX | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5ASXFB3 | S-PBGA-B1517 | 540 | COMMERCIAL EXTENDED | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 13207 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 40 mm | 40 mm | ||||||||||||||||||||||||||
| Mfr Part No 5ASXBB5D6F31C6N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 896-BBGA, FCBGA | YES | 896-FBGA (31x31) | 896 | INTEL CORP | Intel Corporation | 5ASXBB5D6F31C6N | MCU - 208, FPGA - 250 | 85 °C | PLASTIC/EPOXY | BGA | FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | End Of Life | 5.28 | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Arria V SX | Active | BOTTOM | BALL | 1 mm | compliant | 5ASXBB5 | S-PBGA-B896 | 250 | COMMERCIAL EXTENDED | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 250 | 17434 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 462K Logic Elements | 17434 | 462000 | -- | 31 mm | 31 mm | |||||||||||||||||||||||||||||||
| Mfr Part No 5ASXFB3G4F35I3N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | INTEL CORP | Intel Corporation | 5ASXFB3G4F35I3N | MCU - 208, FPGA - 385 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | End Of Life | NOT SPECIFIED | 5.28 | Yes | 1.18 V | 1.12 V | 1.15 V | -40°C ~ 100°C (TJ) | Tray | Arria V SX | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5ASXFB3 | S-PBGA-B1152 | 540 | INDUSTRIAL | 1.05GHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 13207 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 35 mm | 35 mm |
-
XCZU47DR-L1FSVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU48DR-L2FSVG1517I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU48DR-1FSVE1156E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU49DR-L1FFVF1760I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU43DR-L1FSVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU43DR-1FSVG1517I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU43DR-L1FFVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU43DR-1FFVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU48DR-L2FSVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFB008R16A2I1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
BCM58103B0KFBG
Broadcom
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5ASXBB5D4F31C6N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5ASXFB5G4F35I3N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5ASXMB5G4F40C6N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5ASXFB5G4F35I5N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5ASXBB3D4F35C6N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5ASXBB3D4F40C6N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5ASXFB3H4F40C5N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5ASXBB5D6F31C6N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5ASXFB3G4F35I3N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire