The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | MSL | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Schedule B | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Voltage, Rating | Operating Temperature | Packaging | Series | Tolerance | JESD-609 Code | Part Status | ECCN Code | Temperature Coefficient | Resistance | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | HTS Code | Subcategory | Power Rating | Technology | Terminal Position | Orientation | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Note | Interface | Number of Circuits | Memory Size | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Core Architecture | Number of Transceivers | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Product Category | Height | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr Part No 1SX280LH3F55I3VG | ALTERA | Datasheet | 735 |
| Min: 1 Mult: 1 | FBGA-2912 | Intel / Altera | - | 10 | 4 x 32 kB | 4 x 32 kB | Intel | 1 GHz | + 100 C | - 40 C | Yes | SMD/SMT | 1160 | 350000 LAB | 2800000 LE | 956216 | Details | This product may require additional documentation to export from the United States. | Stratix | -40°C ~ 100°C (TJ) | Tray | Stratix® 10 SX | Active | SOC - Systems on a Chip | 0.85 V | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 24 Transceiver | FPGA - 2800K Logic Elements | 4 Core | -- | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS022E4F27I3SG | ALTERA | Datasheet | 681 |
| Min: 1 Mult: 1 | FBGA-672 | YES | 672 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS022E4F27I3SG | 1.2 GHz | Yes | SMD/SMT | 240 | 27500 LAB | 220000 LE | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA672,26X26,40 | BGA672,26X26,40 | SQUARE | GRID ARRAY | 964750 | Active | NOT SPECIFIED | 5.48 | Non-Compliant | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B672 | 240 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 220K Logic Elements | 220000 | 2 Core | -- | SoC FPGA | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS066N2F40I2LG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | YES | 1517-FCBGA (40x40) | 1517 | Intel / Altera | - | 21 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS066N2F40I2LG | 1.2 GHz | Yes | SMD/SMT | 588 | 82500 LAB | 660000 LE | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA1517,39X39,40 | BGA1517,39X39,40 | SQUARE | GRID ARRAY | 965031 | Active | NOT SPECIFIED | 5.46 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1517 | 588 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 588 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 660K Logic Elements | 660000 | 2 Core | -- | SoC FPGA | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS048E2F29I1HG | ALTERA | Datasheet | 415 |
| Min: 1 Mult: 1 | 780-BBGA, FCBGA | 780-FBGA (29x29) | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS048E2F29I1HG | 1.2 GHz | + 100 C | - 40 C | Yes | SMD/SMT | 360 | 60000 LAB | 480000 LE | 965033 | Active | 5.68 | Details | Yes | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | SOC - Systems on a Chip | unknown | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 12 Transceiver | FPGA - 480K Logic Elements | 2 Core | -- | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS066K4F35I3LG | ALTERA | Datasheet | 662 |
| Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel / Altera | - | 24 | 2 x 32 kB | 2 x 32 kB | Intel | 1.2 GHz | Yes | SMD/SMT | 396 | 82500 LAB | 660000 LE | 965078 | Details | This product may require additional documentation to export from the United States. | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | SOC - Systems on a Chip | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | FPGA - 660K Logic Elements | 2 Core | -- | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU43DR-2FFVG1517I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD Xilinx | 561 | Tray | Active | Yes | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU47DR-2FSVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD Xilinx | 366 | Tray | Active | Yes | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS027H2F35I1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | INTEL CORP | Intel Corporation | 10AS027H2F35I1SG | n/a | 384 | 100 °C | -40 °C | DFN16 | PLASTIC/EPOXY | BGA | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | SQUARE | GRID ARRAY | Obsolete | 5.64 | Yes | Yes | 0.93 V | 0.87 V | 0.9 V | 0...+70°C | Tray | n/a | Discontinued at Digi-Key | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1152 | INDUSTRIAL | n/a | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 270K Logic Elements | -- | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFB027R31C2I2V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S060T-VFG784 | Microchip | Datasheet | 1788 |
| Min: 1 Mult: 1 | 784-FBGA | 784-VFBGA (23x23) | + 85 C | Microchip Technology | 0 C | 56500 LE | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFA014R24B2I2V | Intel | Datasheet | 432 |
| Min: 1 Mult: 1 | - | - | Intel | 768 | Tray | Active | Non-Compliant | -40°C ~ 100°C (TJ) | Agilex F | Right Angle | 12 | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFB027R25A2E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 624 | Tray | Active | 50 V | 0°C ~ 100°C (TJ) | Agilex F | 1 % | 100 ppm/°C | 1.93 kΩ | 155 °C | -55 °C | Thin Film | 100 mW | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | 550 µm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 5CSEBA2U23C8SN | ALTERA | Datasheet | 40 |
| Min: 1 Mult: 1 | 672-FBGA | YES | 484 | 672-UBGA (23x23) | 672 | INTEL CORP | Intel Corporation | 5CSEBA2U23C8SN | MCU - 181, FPGA - 145 | 85 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA672,28X28,32 | BGA672,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 2.04 | Non-Compliant | Yes | FPGA - Field Programmable Gate Array CycloneV SoC SE SNGL -core ARM Cortex-A9 | 8542390000 | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | Active | 85 °C | 0 °C | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 600 MHz | S-PBGA-B672 | 145 | Not Qualified | 1.1 V | 1.1,1.2/3.3,2.5 V | OTHER | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.5 MB | 600MHz | 64KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | FIELD PROGRAMMABLE GATE ARRAY | 25000 | ARM | FPGA - 25K Logic Elements | 25000 | -- | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS016E3F27E2LG | ALTERA | Datasheet | 556 |
| Min: 1 Mult: 1 | 672-BBGA, FCBGA | YES | 672-FBGA (27x27) | 672 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS016E3F27E2LG | 1.2 GHz | Yes | SMD/SMT | 240 | 20000 LAB | 160000 LE | 100 °C | PLASTIC/EPOXY | BGA | BGA, BGA672,26X26,40 | BGA672,26X26,40 | SQUARE | GRID ARRAY | 964683 | Active | NOT SPECIFIED | 5.47 | Non-Compliant | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B672 | 240 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 160K Logic Elements | 160000 | 2 Core | -- | SoC FPGA | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU7CG-L1FBVB900I | AMD | Datasheet | 513 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU7 | AMD | 204 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S050TS-1FG484M | Microchip | Datasheet | 1900 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S050 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S050TS-1FG484M | 166 MHz | Microchip Technology | 3 | SMD/SMT | 267 | 56340 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.87 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | -55°C ~ 125°C (TJ) | SmartFusion®2 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S010-1TQ144I | Microchip | Datasheet | 2149 | - | Min: 1 Mult: 1 | 144-LQFP | YES | 144-TQFP (20x20) | 144 | MICROSEMI CORP | Microsemi Corporation | M2S010-1TQ144I | Microchip Technology | 3 | 84 | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, QFP144,.87SQ,20 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | Obsolete | 30 | 5.88 | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | QUAD | GULL WING | 240 | 0.5 mm | not_compliant | S-PQFP-G144 | 84 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 84 | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 256KB | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A2F200M3F-1PQ208 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 208-BFQFP | 208-PQFP (28x28) | A2F200 | Microchip Technology | MCU - 22, FPGA - 66 | Tray | Obsolete | 0°C ~ 85°C (TJ) | SmartFusion® | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S010T-1FG484M | Microchip | Datasheet | 2182 |
| Min: 1 Mult: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S010 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S010T-1FG484M | 166 MHz | Microchip Technology | 3 | SMD/SMT | 233 | 12084 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | No | 1.26 V | 1.14 V | 1.2 V | 150 V | -55°C ~ 125°C (TJ) | SmartFusion®2 | 1 % | e0 | 3A001.A.2.C | 50 ppm/°C | 3.4 Ω | Tin/Lead (Sn/Pb) | 155 °C | -55 °C | Thin Film | 8542.39.00.01 | Field Programmable Gate Arrays | 250 mW | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 650 µm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S005S-TQ144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 144-LQFP | 144-TQFP (20x20) | Microchip Technology | 84 | Tray | Obsolete | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 5K Logic Modules | 128KB |
1SX280LH3F55I3VG
ALTERA
Package:Embedded - System On Chip (SoC)
20,489.425250
10AS022E4F27I3SG
ALTERA
Package:Embedded - System On Chip (SoC)
972.558208
10AS066N2F40I2LG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
10AS048E2F29I1HG
ALTERA
Package:Embedded - System On Chip (SoC)
3,406.120028
10AS066K4F35I3LG
ALTERA
Package:Embedded - System On Chip (SoC)
5,453.869284
XCZU43DR-2FFVG1517I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
XCZU47DR-2FSVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
10AS027H2F35I1SG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
AGFB027R31C2I2V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S060T-VFG784
Microchip
Package:Embedded - System On Chip (SoC)
170.188472
AGFA014R24B2I2V
Intel
Package:Embedded - System On Chip (SoC)
14,594.246676
AGFB027R25A2E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
5CSEBA2U23C8SN
ALTERA
Package:Embedded - System On Chip (SoC)
76.232799
10AS016E3F27E2LG
ALTERA
Package:Embedded - System On Chip (SoC)
1,119.641021
XCZU7CG-L1FBVB900I
AMD
Package:Embedded - System On Chip (SoC)
3,615.670010
M2S050TS-1FG484M
Microchip
Package:Embedded - System On Chip (SoC)
437.253237
M2S010-1TQ144I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
A2F200M3F-1PQ208
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
M2S010T-1FG484M
Microchip
Package:Embedded - System On Chip (SoC)
169.872618
M2S005S-TQ144
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
