The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Material | Number of Terminals | Base Product Number | Brand | Case Code - in | Case Code - mm | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Illuminated | Indicator Color | Indicator Style | Ir - Maximum Reverse Leakage Current | Ir - Reverse Current | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Pd - Power Dissipation | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Voltage, Rating | Vz - Zener Voltage | Zz - Zener Impedance | Operating Temperature | Packaging | Series | Tolerance | JESD-609 Code | Part Status | ECCN Code | Temperature Coefficient | Type | Resistance | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Color | Applications | HTS Code | Subcategory | Power Rating | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Current Rating | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Termination Style | JESD-30 Code | Number of Outputs | Qualification Status | Actuator Type | Operating Supply Voltage | Power Supplies | Temperature Grade | Configuration | Interface | Memory Size | Speed | RAM Size | Core Processor | Number of Poles | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Test Current | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Core Architecture | Design | Primary Attributes | Outside Diameter | Drive Size | Zener Current | Number of Logic Cells | Number of Cores | Drive Type | Overall Length | Flash Size | Product | Features | Product Category | Shaft Diameter | Height | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No 10AS016E3F29E1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 780-BBGA, FCBGA | YES | 780-FBGA (29x29) | 780 | Royalohm | 1210 | 3225 | 5000 | INTEL CORP | Royalohm | 10AS016E3F29E1SG | + 155 C | - 55 C | PCB Mount | 288 | 100 °C | PLASTIC/EPOXY | BGA | 29 X 29 MM, ROHS COMPLIANT, FBGA-780 | BGA780,28X28,40 | SQUARE | GRID ARRAY | Obsolete | NOT SPECIFIED | 5.67 | Details | Yes | 0.93 V | 0.87 V | 0.9 V | 0.000564 oz | 200 V | 0°C ~ 100°C (TJ) | Reel | General Purpose Thick Film | 1 % | Discontinued at Digi-Key | 100 PPM / C | 16.5 Ohms | General Purpose | 8542.39.00.01 | Resistors | 500 mW (1/2 W) | Thick Film | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | SMD/SMT | S-PBGA-B780 | 288 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | Thick Film Resistors | FPGA - 160K Logic Elements | 160000 | -- | Wrap-Around Termination | Thick Film Resistors - SMD | 0.55 mm | 3.1 mm | 2.6 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1702-1MSEVSVA2197 | AMD | Datasheet | 488 |
| Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 608 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS250T-1FCVG484E | Microchip | Datasheet | 2054 |
| Min: 1 Mult: 1 | FCVG-484 | 484-FCBGA (19x19) | AIRPAX | - | 3 | Not Illuminated | 4 x 32 kB | 16 kB, 4 x 32 kB | Sensata | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | Panel Mount | 372 I/O | 254000 LE | Tray | Active | This product may require additional documentation to export from the United States. | AIRPAX | 6.349313 oz | 0°C ~ 100°C | Tray | LEL/LML | Hydraulic-Magnetic | Circuit Breakers | 60 A | Stud | Handle | 1 V | - | 2.2MB | RISC-V | 2 Pole | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | Circuit Breakers | FPGA - 254K Logic Modules | 5 Core | 128kB | Circuit Protectors | Circuit Breakers | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU9EG-1FFVC900I | AMD | Datasheet | 643 | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU9 | AMD | 204 | Tray | Active | Yes | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1502-2MSIVSVA2197 | AMD | Datasheet | 588 |
| Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | AMD | 608 | Tray | Active | Yes | Versal™ Prime | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS022E4F29E3SG | ALTERA | Datasheet | 670 |
| Min: 1 Mult: 1 | FBGA-780 | YES | 780 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS022E4F29E3SG | 1.2 GHz | Yes | SMD/SMT | 288 | 27500 LAB | 220000 LE | 100 °C | PLASTIC/EPOXY | BGA | BGA, BGA780,28X28,40 | BGA780,28X28,40 | SQUARE | GRID ARRAY | 973476 | Active | NOT SPECIFIED | 5.46 | Non-Compliant | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B780 | 288 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 220K Logic Elements | 3/8 in | 220000 | 2 Core | Square | 76 mm | -- | SoC FPGA | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA4U19I7N | ALTERA | Datasheet | 2116 |
| Min: 1 Mult: 1 | 484-FBGA | 484 | 484-UBGA (19x19) | MCU - 151, FPGA - 66 | Compliant | -40°C ~ 100°C (TJ) | Tray | Cyclone® V SE | Active | 100 °C | -40 °C | 800 MHz | 5CSEBA4 | 1.1 V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 2.9 MB | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 40000 | ARM | FPGA - 40K Logic Elements | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS095T-FCSG536E | Microchip | Datasheet | 2160 |
| Min: 1 Mult: 1 | 536-BGA | 536-LFBGA | - | 4 x 32 kB | 16 kB, 4 x 32 kB | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | SMD/SMT | MCU - 136, FPGA - 276 | 93000 LE | Tray | Active | 0°C ~ 100°C | PolarFire® | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 93K Logic Modules | 5 Core | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU2EG-2SFVC784I | AMD | Datasheet | 584 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU2 | AMD | 252 | Tray | Active | Yes | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB022R25A2E3V | Intel | Datasheet | 483 |
| Min: 1 Mult: 1 | - | - | Intel | 624 | Tray | Active | Yes | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027H2F35I2LG | ALTERA | Datasheet | 522 |
| Min: 1 Mult: 1 | FBGA-1152 | YES | 1152 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS027H2F35I2LG | 1.2 GHz | Yes | SMD/SMT | 384 | 33750 LAB | 270000 LE | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 964931 | Active | NOT SPECIFIED | 5.43 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 384 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB027R24C3I3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | SOT-23-3 | - | Panjit | 3000 | 50 uA | 50 uA | Panjit | + 150 C | Intel | - 55 C | SMD/SMT | 744 | Tray | 200 mW | Active | Details | 0.000176 oz | 2.4 V | 100 Ohms | -40°C ~ 100°C (TJ) | Reel | ZSM-02TA | Diodes & Rectifiers | Single | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | 5 mA | Zener Diodes | FPGA - 2.7M Logic Elements | 50 uA | - | Zener Diodes | 1 mm | 2.2 mm | 1.35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGID023R18A2E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Advanced Energy | 1 | Advanced Energy | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex I | DC-DC Converter | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Non-Isolated DC-DC Converters | FPGA - 2.3M Logic Elements | - | Non-Isolated DC/DC Converters | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XQZU1CG-2SFQC784I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Amphenol Aerospace | 1 | Amphenol | Details | This product may require additional documentation to export from the United States. | 38999 | D38999 III | Circular Connectors | Circular MIL Spec Connector | Circular MIL Spec Connector | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XQZU1EG-1SBQA484I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Amphenol Aerospace | 1 | Amphenol | Details | 38999 | D38999 III | Circular Connectors | Circular MIL Spec Connector | Circular MIL Spec Connector | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-1PQ208I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 208-BFQFP | 208-PQFP (28x28) | A2F200 | TE Connectivity | TE Connectivity | Microchip Technology | MCU - 22, FPGA - 66 | Tray | 3-1191563-0 | Obsolete | Details | -40°C ~ 100°C (TJ) | SmartFusion® | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | Hook-up Wire | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | Hook-up Wire | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150TS-1FCG1152M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | M2S150 | Glenair | 1 | MICROSEMI CORP | Glenair | M2S150TS-1FCG1152M | Microchip Technology | 4 | 574 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 5.8 | Yes | 1.26 V | 1.14 V | 1.2 V | -55°C ~ 125°C (TJ) | SmartFusion®2 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | D-Sub Connectors | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 40 | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | Mixed Contact D-Sub Connectors | FPGA - 150K Logic Modules | 146124 | 512KB | D-Sub Mixed Contact Connectors | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-1TQ144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Obsolete (Last Updated: 2 months ago) | 144-LQFP | YES | 144-TQFP (20x20) | 144 | TE Connectivity | MICROSEMI CORP | TE Connectivity | M2S005-1TQ144 | Microchip Technology | 3 | 84 | 85 °C | Tray | PLASTIC/EPOXY | LFQFP | TQFP-144 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 7-1617785-8 | Obsolete | Obsolete | 30 | 5.88 | N | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Relays | CMOS | QUAD | GULL WING | 240 | 0.5 mm | not_compliant | S-PQFP-G144 | 84 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 84 | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | Industrial Relays | FPGA - 5K Logic Modules | 6060 | 128KB | Military/Aerospace Relays | Industrial Relays | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS095TL-FCVG484E | Microchip | Datasheet | 1927 |
| Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | Phenolic with Aluminum Insert | TE Connectivity / P&B | - | 25 | White | Line on Top, Side and Skirt | 4 x 32 kB | 16 kB, 4 x 32 kB | TE Connectivity | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | SMD/SMT | MCU - 136, FPGA - 276 | 93000 LE | Tray | 5-1437624-3 | Active | Details | 0.248011 oz | 0°C ~ 100°C | PKES | Cylindrical Knob with Skirt | Black, Silver | Knobs & Dials | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | Knobs & Dials | Fluted | FPGA - 93K Logic Modules | 26 mm | 5 Core | 128kB | Knobs | Top spun aluminum inlay, with skirt | Knobs & Dials | 1/4 in | 15 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS095TL-FCVG484I | Microchip | Datasheet | 2270 |
| Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | TE Connectivity | - | 4 x 32 kB | 16 kB, 4 x 32 kB | TE Connectivity | 667 MHz, 667 MHz | + 100 C | Microchip Technology | - 40 C | SMD/SMT | MCU - 136, FPGA - 276 | 93000 LE | Tray | Active | -40°C ~ 100°C | PolarFire® | Relays | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | Industrial Relays | FPGA - 93K Logic Modules | 5 Core | 128kB | Industrial Relays |
-
10AS016E3F29E1SG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1702-1MSEVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
18,346.318958
-
MPFS250T-1FCVG484E
Microchip
Package:Embedded - System On Chip (SoC)
300.485945
-
XCZU9EG-1FFVC900I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1502-2MSIVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
9,881.577420
-
10AS022E4F29E3SG
ALTERA
Package:Embedded - System On Chip (SoC)
869.612816
-
5CSEBA4U19I7N
ALTERA
Package:Embedded - System On Chip (SoC)
180.267113
-
MPFS095T-FCSG536E
Microchip
Package:Embedded - System On Chip (SoC)
164.974095
-
XCZU2EG-2SFVC784I
AMD
Package:Embedded - System On Chip (SoC)
554.689460
-
AGFB022R25A2E3V
Intel
Package:Embedded - System On Chip (SoC)
16,343.684044
-
10AS027H2F35I2LG
ALTERA
Package:Embedded - System On Chip (SoC)
2,542.612203
-
AGFB027R24C3I3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGID023R18A2E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XQZU1CG-2SFQC784I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XQZU1EG-1SBQA484I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F200M3F-1PQ208I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150TS-1FCG1152M
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005-1TQ144
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
MPFS095TL-FCVG484E
Microchip
Package:Embedded - System On Chip (SoC)
188.201204
-
MPFS095TL-FCVG484I
Microchip
Package:Embedded - System On Chip (SoC)
181.521945