The category is 'Embedded - System On Chip (SoC)'
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- Peripherals
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- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Number of Pins | Shell Material | Supplier Device Package | Housing Material | Number of Terminals | Accessory | Base Product Number | Brand | Cable Types | Colour outer sheath | Contact Finish Mating | Contact Materials | Data RAM Size | Degree of protection (IP) | Factory Pack QuantityFactory Pack Quantity | Handle Length | Handle Material | If - Forward Current | Ihs Manufacturer | Integrable in the engineering software o.t autom.system | L1 Cache Data Memory | L1 Cache Instruction Memory | Library with object elements | Loadable for operating system for configuration software, Linux | Loadable for operating system for configuration software, Windows 2000 | Loadable for operating system for configuration software, Windows 2003 Server | Loadable for operating system for configuration software, Windows 9x | Loadable for operating system for configuration software, Windows ME | Loadable for operating system for configuration software, Windows NT | Loadable for operating system for configuration software, Windows Vista | Locking mechanism | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | MSL | Nominal cross section conductor | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Pollution degree | Primary Material | Product Status | Rated surge voltage | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Runtime operating system, Linux | Runtime operating system, Windows 2000 | Runtime operation system, Windows Vista | Shipping Restrictions | Spare part | Suitable for operating system Windows 7 | Suitable for operating system Windows 8 | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tip Material | Tradename | Type of accessory/spare part | Unit Weight | User groups (password protection) possible | Voltage Rated | Wavelength/Color Temperature | With programming interfaces | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Termination | Temperature Coefficient | Connector Type | Type | Max Operating Temperature | Min Operating Temperature | Color | Applications | HTS Code | Capacitance | Fastening Type | Subcategory | Power Rating | Technology | Voltage - Supply | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Terminal Pitch | Depth | Reach Compliance Code | Frequency | Frequency Stability | Output | Shell Finish | JESD-30 Code | Function | Base Resonator | Current - Supply (Max) | Number of Outputs | Qualification Status | Housing Color | Operating Supply Voltage | Failure Rate | Lead Spacing | Power Supplies | Temperature Grade | Current - Supply (Disable) (Max) | Interface | Speed | RAM Size | Lead Style | Core Processor | Viewing Angle | Peripherals | Program Memory Size | Spread Spectrum Bandwidth | Connectivity | Usage | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Product Type | Illumination Color | Core Architecture | Total RAM Bits | Luminous Flux | Number of LEDs | Speed Grade | Number of Transceivers | Absolute Pull Range (APR) | Primary Attributes | Quantity | Number of Logic Cells | Number of Cores | Flash Size | Product | Features | Vf - Forward Voltage | Product Category | Height | Height Seated (Max) | Length | Width | Thickness (Max) | Ratings |
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![]() | Mfr Part No MPFS160T-FCVG784I | Microchip | Datasheet | 1858 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | Aluminum | Bivar | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | BIVAR | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | SMD/SMT | MCU - 136, FPGA - 312 | 161000 LE | Tray | Active | Details | 630 nm | -40°C ~ 100°C | Tube | Coastline C5500 Linear | LED Lighting | 10 W | Black | 1 V | - | 1.4125MB | RISC-V | 35 deg | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | LED Lighting Fixtures | Red | 390 lm | - | FPGA - 161K Logic Modules | 5 Core | 128kB | LED Lighting Fixtures | 24 V | LED Lighting Fixtures | 15.2 mm | 609.6 mm | 21.1 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPFS250T-FCSG536E | Microchip | Datasheet | 2267 |
| Min: 1 Mult: 1 | FCSG-536 | 536-LFBGA | TE Connectivity | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | TE Connectivity | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | SMD/SMT | 372 I/O | 254000 LE | Tray | FCB-405-0628M | Active | This product may require additional documentation to export from the United States. | 0°C ~ 100°C | Tray | PolarFire™ | Relays | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | General Purpose Relays | FPGA - 254K Logic Modules | 5 Core | 128kB | General Purpose Relays | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No MPFS025T-1FCSG325E | Microchip | Datasheet | 16 | - | Min: 1 Mult: 1 | 325-TFBGA | 325-BGA (11x11) | Amphenol Commercial Products | - | 15 | 4 x 32 kB | 16 kB, 4 x 32 kB | Amphenol | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | SMD/SMT | MSL 3 - 168 hours | MCU - 136, FPGA - 108 | 23000 LE | Tray | Active | 0°C ~ 100°C | Tray | - | I/O Connectors | 1 V | - | 230.4KB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | I/O Connectors | 1843.2Kbit | FPGA - 23K Logic Modules | 5 Core | 128KB | I/O Connectors | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC7Z014S-1CLG400C | AMD | Datasheet | 1670 |
| Min: 1 Mult: 1 | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) | XC7Z014 | AMD | 125 | Tray | Active | 0°C ~ 85°C (TJ) | Zynq®-7000 | 667MHz | 256KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 65K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XC7Z045-L2FBG676I | AMD | Datasheet | 717 |
| Min: 1 Mult: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | Yes | XC7Z045 | AMD | 130 | Tray | Active | No | Other | -40°C ~ 100°C (TJ) | Zynq®-7000 | 70 | 800MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 350K Logic Cells | - | 27 | 70 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU15EG-L1FFVC900I | AMD | Datasheet | 543 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU15 | Yes | Integrated | No | No | No | No | No | No | No | AMD | 204 | Tray | Active | No | No | No | Yes | No | Yes | Yes | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFA012R24B3E4X | Intel | Datasheet | 579 | - | Min: 1 Mult: 1 | - | - | Black | IP20 | Separate | Intel | 1.5 | 768 | Tray | 3 | Active | 6 | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 1SX280HN1F43E1VGAS | ALTERA | Datasheet | 491 |
| Min: 1 Mult: 1 | FBGA-1760 | Intel / Altera | - | 1 | 4 x 32 kB | 4 x 32 kB | Intel | 1 GHz | + 100 C | 0 C | SMD/SMT | 688 I/O | 350000 LAB | 2800000 LE | 999G64 | Details | Stratix | Tray | Stratix 10 SX | SOC - Systems on a Chip | 0.85 V | - | SoC FPGA | 48 Transceiver | 4 Core | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No A2F500M3G-FGG256M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256 | 256-FPBGA (17x17) | A2F500 | MICROSEMI CORP | Microsemi Corporation | A2F500M3G-FGG256M | PEI-Genesis | 3 | MCU - 25, FPGA - 66 | Bulk | Active | Active | 5.81 | Compliant | Yes | -55°C ~ 125°C (TJ) | * | 125 °C | -55 °C | compliant | 80 MHz | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU6EG-L2FFVC900E | AMD | Datasheet | 208 | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU6 | Glenair | 204 | Retail Package | Active | 0°C ~ 100°C (TJ) | * | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2L | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS016E3F29E2LG | ALTERA | Datasheet | 515 |
| Min: 1 Mult: 1 | Surface Mount, MLCC | 1111 (2828 Metric) | YES | 780-FBGA (29x29) | 780 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS016E3F29E2LG | 1.2 GHz | American Technical Ceramics | Yes | SMD/SMT | 288 | 20000 LAB | 160000 LE | 100 °C | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | PLASTIC/EPOXY | BGA | BGA, BGA780,28X28,40 | BGA780,28X28,40 | SQUARE | GRID ARRAY | 964718 | Active | Active | NOT SPECIFIED | 5.46 | Non-Compliant | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 500V | -55°C ~ 125°C | Tray | Porcelain Superchip® ATC 100B | 0.110 L x 0.110 W (2.79mm x 2.79mm) | ±5% | Active | P90 | RF, Microwave, High Frequency, Bypass, Decoupling | 8542.39.00.01 | 27 pF | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B780 | 288 | Not Qualified | - | - | 0.9 V | OTHER | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 160K Logic Elements | 160000 | 2 Core | -- | High Q, Low Loss, Low ESL | SoC FPGA | - | 29 mm | 29 mm | 0.102 (2.59mm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS022C3U19E2LG | ALTERA | Datasheet | 540 |
| Min: 1 Mult: 1 | - | Plastic | Transforming Technologies | 192 | Bag | Active | Non-Compliant | Synthetic Fiber | 0°C ~ 100°C (TJ) | Tray | BR4400 | Active | Brush, Single Head | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 220K Logic Elements | 1 | -- | Anti-Static | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS027E3F29I2LG | ALTERA | Datasheet | 686 |
| Min: 1 Mult: 1 | FBGA-780 | YES | 780 | Intel / Altera | Round | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS027E3F29I2LG | 1.2 GHz | Dinkle Corporation, USA | Yes | SMD/SMT | 360 | 33750 LAB | 270000 LE | 100 °C | -40 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA780,28X28,40 | BGA780,28X28,40 | SQUARE | GRID ARRAY | 964967 | Active | Active | NOT SPECIFIED | 5.43 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | 299 | Active | Circular 04 pos Male to RJ45, 8p4c | Blue | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | Shielded | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B780 | 360 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | 360 | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 1.97 (600.0mm) | 29 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS027E3F29E2LG | ALTERA | Datasheet | 752 |
| Min: 1 Mult: 1 | Surface Mount | 8-SMD, No Lead | YES | 780 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS027E3F29E2LG | 1.2 GHz | CTS-Frequency Controls | Yes | SMD/SMT | 360 | 33750 LAB | 270000 LE | 100 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA780,28X28,40 | BGA780,28X28,40 | SQUARE | GRID ARRAY | 964765 | Active | Active | NOT SPECIFIED | 5.43 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 85°C | Tray | 581 | 0.197 L x 0.126 W (5.00mm x 3.20mm) | Active | VCTCXO | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | 2.5V | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 52 MHz | ±200ppb | HCMOS | S-PBGA-B780 | Enable/Disable | Crystal | 9.5mA | 360 | Not Qualified | 0.9 V | OTHER | - | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 360 | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | ±5ppm | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 0.079 (2.00mm) | 29 mm | 29 mm | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS066N4F40I3LG | ALTERA | Datasheet | 609 |
| Min: 1 Mult: 1 | 1517-BBGA, FCBGA | YES | 1517-FCBGA (40x40) | 1517 | INTEL CORP | Intel Corporation | 10AS066N4F40I3LG | Glenair | 588 | 100 °C | -40 °C | Retail Package | PLASTIC/EPOXY | BGA | BGA, BGA1517,39X39,40 | BGA1517,39X39,40 | SQUARE | GRID ARRAY | Active | Active | NOT SPECIFIED | 5.46 | Yes | 0.93 V | 0.87 V | 0.9 V | -40°C ~ 100°C (TJ) | Tray | * | Active | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1517 | 588 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 588 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 660K Logic Elements | 660000 | -- | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS022C3U19I2LG | ALTERA | Datasheet | 640 |
| Min: 1 Mult: 1 | Panel Mount, Through Hole | UBGA-484 | YES | Flange | Aluminum | 484 | Intel / Altera | Gold | Copper Alloy | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS022C3U19I2LG | 1.2 GHz | Glenair | Yes | SMD/SMT | 192 | 27500 LAB | 220000 LE | 100 °C | -40 °C | Retail Package | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | 964732 | Active | Metal | Active | NOT SPECIFIED | 5.46 | Non-Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0.423288 oz | -65°C ~ 175°C | Tray | 806 | Active | Solder | Receptacle, Female Sockets | Olive Drab | 8542.39.00.01 | Threaded | SOC - Systems on a Chip | CMOS | BOTTOM | A | BALL | NOT SPECIFIED | 0.8 mm | compliant | Olive Drab Cadmium | S-PBGA-B484 | 192 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 192 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 220K Logic Elements | 220000 | 2 Core | -- | SoC FPGA | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS027E3F27E2SG | ALTERA | Datasheet | 643 |
| Min: 1 Mult: 1 | Surface Mount | 4-SMD, No Lead | YES | 672 | SG-8101 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS027E3F27E2SG | 1.2 GHz | EPSON | Yes | SMD/SMT | 240 | 33750 LAB | 270000 LE | 100 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA672,26X26,40 | BGA672,26X26,40 | SQUARE | GRID ARRAY | 965046 | Active | Active | NOT SPECIFIED | 5.43 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 85°C | Tray | SG-8101 | 0.126 L x 0.098 W (3.20mm x 2.50mm) | Active | XO (Standard) | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | 1.8V ~ 3.3V | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 12.65 MHz | ±15ppm | CMOS | S-PBGA-B672 | Standby (Power Down) | Crystal | 6.8mA (Typ) | 240 | Not Qualified | 0.9 V | OTHER | 1.1µA | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | - | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 0.047 (1.20mm) | 27 mm | 27 mm | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS032E2F27I2LG | ALTERA | Datasheet | 525 |
| Min: 1 Mult: 1 | FBGA-672 | YES | 672 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS032E2F27I2LG | 1.2 GHz | Glenair | Yes | SMD/SMT | 240 | 40000 LAB | 320000 LE | 100 °C | -40 °C | Retail Package | PLASTIC/EPOXY | BGA | BGA, BGA672,26X26,40 | BGA672,26X26,40 | SQUARE | GRID ARRAY | 965055 | Active | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | * | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B672 | 240 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 240 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 320K Logic Elements | 320000 | 2 Core | -- | SoC FPGA | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS057N1F40E1HG | ALTERA | Datasheet | 683 |
| Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FBGA (40x40) | Intel / Altera | - | 21 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS057N1F40E1HG | 1.2 GHz | + 100 C | PEI-Genesis | 0 C | Yes | SMD/SMT | 588 | 71250 LAB | 570000 LE | Bulk | 965017 | Active | Active | 5.66 | Details | Yes | This product may require additional documentation to export from the United States. | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | * | Active | SOC - Systems on a Chip | unknown | 950 mV | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 48 Transceiver | FPGA - 570K Logic Elements | 2 Core | -- | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS066N4F40I3SG | ALTERA | Datasheet | 441 |
| Min: 1 Mult: 1 | 1517-BBGA, FCBGA | YES | 1517-FCBGA (40x40) | 1517 | Intel / Altera | - | 21 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS066N4F40I3SG | 1.2 GHz | PEI-Genesis | Yes | SMD/SMT | 588 | 82500 LAB | 660000 LE | 100 °C | -40 °C | Bulk | PLASTIC/EPOXY | BGA | BGA, BGA1517,39X39,40 | BGA1517,39X39,40 | SQUARE | GRID ARRAY | 965107 | Active | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -40°C ~ 100°C (TJ) | Tray | * | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1517 | 588 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 588 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 660K Logic Elements | 660000 | 2 Core | -- | SoC FPGA | 40 mm | 40 mm |
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