The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Number of Pins | Shell Material | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Contact Finish Mating | Contact Materials | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Primary Material | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Number of Terminations | Termination | Temperature Coefficient | Connector Type | Type | Resistance | Max Operating Temperature | Min Operating Temperature | Composition | Color | Power (Watts) | HTS Code | Fastening Type | Subcategory | Technology | Voltage - Supply | Terminal Position | Orientation | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Frequency Stability | Output | Shell Finish | Shell Size - Insert | JESD-30 Code | Function | Base Resonator | Current - Supply (Max) | Number of Outputs | Qualification Status | Operating Supply Voltage | Failure Rate | Power Supplies | Temperature Grade | Current - Supply (Disable) (Max) | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Spread Spectrum Bandwidth | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Product Type | Speed Grade | Number of Transceivers | Absolute Pull Range (APR) | Primary Attributes | Number of Registers | Number of Logic Cells | Number of Cores | Flash Size | Features | Product Category | Height Seated (Max) | Length | Width | Ratings |
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 | Mfr Part No 10AS057K3F35I2LG | ALTERA | Datasheet | 744 |
| Min: 1 Mult: 1 | 1206 (3216 Metric) | YES | 1206 | 1152 | RN73R2B | Intel / Altera | - | 24 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS057K3F35I2LG | 1.2 GHz | KOA Speer Electronics, Inc. | Yes | SMD/SMT | 396 | 71250 LAB | 570000 LE | 100 °C | -40 °C | Tape & Reel (TR);Cut Tape (CT);Digi-Reel®; | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965545 | Active | Active | NOT SPECIFIED | 5.45 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -55°C ~ 155°C | Tray | RN73R | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±0.5% | Active | 2 | ±50ppm/°C | 97.6 Ohms | Thin Film | 0.25W, 1/4W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 396 | Not Qualified | - | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 396 | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 570K Logic Elements | 570000 | 2 Core | -- | Automotive AEC-Q200, Moisture Resistant | SoC FPGA | 0.028 (0.70mm) | 35 mm | 35 mm | AEC-Q200 | |||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027H2F35I1HG | ALTERA | Datasheet | 572 |
| Min: 1 Mult: 1 | Surface Mount | 8-SMD, No Lead | 1152-FBGA (35x35) | 580 | Intel / Altera | - | 24 | 2 x 32 kB | 2 x 32 kB | Intel | 1.2 GHz | + 100 C | CTS-Frequency Controls | - 40 C | Yes | SMD/SMT | 384 | 33750 LAB | 270000 LE | Tape & Reel (TR) | 964811 | Active | Details | Arria 10 SoC | -30°C ~ 85°C | Tray | 580 | 0.197 L x 0.126 W (5.00mm x 3.20mm) | Active | TCXO | SOC - Systems on a Chip | 2.5V | 20.48 MHz | ±200ppb | Clipped Sine Wave | - | Crystal | 6mA | 950 mV | - | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | 24 Transceiver | - | FPGA - 270K Logic Elements | 2 Core | -- | SoC FPGA | 0.079 (2.00mm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 1SX280LN2F43E2VG | ALTERA | Datasheet | 575 |
| Min: 1 Mult: 1 | Glenair | 688 | Retail Package | Active | 0°C ~ 100°C (TJ) | Tray | * | Active | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 2800K Logic Elements | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS066N2F40I1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | YES | 1517-FCBGA (40x40) | 1517 | INTEL CORP | Intel Corporation | 10AS066N2F40I1SG | UltraTech | 588 | 100 °C | -40 °C | Box | PLASTIC/EPOXY | BGA | 40 X 40 MM, ROHS COMPLIANT, FBGA-1517 | SQUARE | GRID ARRAY | Obsolete | Active | 5.46 | Yes | 0.93 V | 0.87 V | 0.9 V | -40°C ~ 100°C (TJ) | Tray | * | Discontinued at Digi-Key | 8542.39.00.01 | BOTTOM | BALL | 1 mm | compliant | S-PBGA-B1517 | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3.5 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 660K Logic Elements | -- | 40 mm | 40 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS066H2F34I2LG | ALTERA | Datasheet | 595 |
| Min: 1 Mult: 1 | Panel Mount, Through Hole | 1152-BBGA, FCBGA | YES | Flange | Stainless Steel | 1152-FCBGA (35x35) | 1152 | Intel / Altera | Gold | Copper Alloy | - | 24 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS066H2F34I2LG | 1.2 GHz | Glenair | Yes | SMD/SMT | 492 | 82500 LAB | 660000 LE | 100 °C | -40 °C | Retail Package | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | 965021 | Active | Metal | Active | NOT SPECIFIED | 5.46 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -65°C ~ 175°C | Tray | 806 | Active | Solder | Plug, Male Pins | Silver | 8542.39.00.01 | Threaded | SOC - Systems on a Chip | CMOS | BOTTOM | E | BALL | NOT SPECIFIED | 1 mm | compliant | Passivated | 18-1 | S-PBGA-B1152 | 492 | Not Qualified | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 492 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 660K Logic Elements | 660000 | 2 Core | -- | SoC FPGA | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS048K1F35I1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | PEI-Genesis | 396 | Bulk | Active | -40°C ~ 100°C (TJ) | Tray | * | Discontinued at Digi-Key | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 480K Logic Elements | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027H2F34E1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | INTEL CORP | Intel Corporation | 10AS027H2F34E1SG | KYOCERA AVX | 384 | 100 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Obsolete | Active | NOT SPECIFIED | 5.64 | Non-Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | 0°C ~ 100°C (TJ) | Tray | * | Discontinued at Digi-Key | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B1152 | 384 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 384 | 3.65 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 270K Logic Elements | 270000 | -- | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU6EG-3FFVC900E | AMD | Datasheet | 665 | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU6 | AMD | 204 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3 | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS016C4U19I3SG | ALTERA | Datasheet | 715 |
| Min: 1 Mult: 1 | Axial | YES | 484 | Axial | 484 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS016C4U19I3SG | 1.2 GHz | + 100 C | - 40 C | Yes | SMD/SMT | 192 | 20000 LAB | 160000 LE | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | 964681 | Active | NOT SPECIFIED | 1.96 | Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0.423288 oz | -65°C ~ 175°C | Bulk | Military, MIL-PRF-55182/01, RNC55 | 0.094 Dia x 0.250 L (2.39mm x 6.35mm) | ±0.1% | Active | 2 | ±50ppm/°C | 22.6 kOhms | 100 °C | -40 °C | Metal Film | 0.125W, 1/8W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | S-PBGA-B484 | 192 | Not Qualified | 1.8 V | P (0.1%) | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 192 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | 3 | 6 Transceiver | FPGA - 160K Logic Elements | 246040 | 160000 | 2 Core | -- | Military, Moisture Resistant, Weldable | SoC FPGA | -- | 19 mm | 19 mm | |||||||||||||||||||||||||||||||
| Mfr Part No XCVM1802-1MLIVSVD1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD Xilinx | 726 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ Prime | 600MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS250TS-1FCSG536I | Microchip | Datasheet | 459 |
| Min: 1 Mult: 1 | 536-LFBGA, CSPBGA | 536-LFBGA | Microchip Technology | MCU - 136, FPGA - 372 | Tray | Active | -40°C ~ 100°C | PolarFire™ | - | 2.2MB | RISC-V | DMA, PCI, PWM | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 254K Logic Modules | 128kB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM53575B0KFSBG | Broadcom | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Broadcom / Avago | 189 | Broadcom Limited | Broadcom Limited | - | Tray | Active | Details | - | - | Wireless & RF Integrated Circuits | Si | 1.25GHz | - | ARM® Cortex®-A9, ARM® Cortex®-R5 | SERDES | ACL, MAC, QSGMII | MPU | RF System on a Chip - SoC | - | - | RF System on a Chip - SoC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGIB022R31B3I3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA027R25A2E4F | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 624 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-1LSIVSVD1760 | AMD | Datasheet | 711 | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 692 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU5EV-L1SFVC784I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU5 | AMD | 252 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU49DR-2FFVF1760I | Xilinx | Datasheet | 84 | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD Xilinx | 622 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 533MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1902-2LLEVIVA1596 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD Xilinx | 500 | Active | 0°C ~ 100°C (TJ) | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.9M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA008R24C2I1V | Intel | Datasheet | 707 |
| Min: 1 Mult: 1 | - | - | Intel | 576 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 764K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1802-1LSEVSVD1760 | AMD | Datasheet | 717 | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | AMD | 692 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - |
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10AS057K3F35I2LG
ALTERA
Package:Embedded - System On Chip (SoC)
6,376.227109
-
10AS027H2F35I1HG
ALTERA
Package:Embedded - System On Chip (SoC)
2,594.526320
-
1SX280LN2F43E2VG
ALTERA
Package:Embedded - System On Chip (SoC)
17,048.139189
-
10AS066N2F40I1SG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS066H2F34I2LG
ALTERA
Package:Embedded - System On Chip (SoC)
6,333.076801
-
10AS048K1F35I1SG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS027H2F34E1SG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU6EG-3FFVC900E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS016C4U19I3SG
ALTERA
Package:Embedded - System On Chip (SoC)
700.790488
-
XCVM1802-1MLIVSVD1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
MPFS250TS-1FCSG536I
Microchip
Package:Embedded - System On Chip (SoC)
625.636739
-
BCM53575B0KFSBG
Broadcom
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGIB022R31B3I3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA027R25A2E4F
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1902-1LSIVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU5EV-L1SFVC784I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU49DR-2FFVF1760I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1902-2LLEVIVA1596
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA008R24C2I1V
Intel
Package:Embedded - System On Chip (SoC)
15,046.108604
-
XCVC1802-1LSEVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire