The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
- Number of I/Os
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- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Contact Plating | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Shell Material | Supplier Device Package | Material | Insert Material | Number of Terminals | Backshell Material, Plating | Package Quantity | Base Product Number | Base/Housing Material | Body Orientation | Brand | Contact Finish Mating | Contact Materials | Country of Origin | Data RAM Size | Device Logic Units | ECCN | Factory Pack QuantityFactory Pack Quantity | I/O Voltage | Ihs Manufacturer | Instruction Set Architecture | Interface Type | JTAG Support | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Number of User I/Os | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitivity Levels | Mounting | Mounting Styles | MSL | Number of CPU Cores | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Primary Material | Product Status | Qualification | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Termination Method | Typical Operating Supply Voltage | Usage Level | Voltage, Rating | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Part Status | Termination | Temperature Coefficient | Connector Type | Resistance | Number of Positions | Terminal Finish | Color | Applications | Additional Feature | HTS Code | Fastening Type | Subcategory | Power Rating | Current Rating (Amps) | Pitch | Technology | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Style | Resistor Type | Reach Compliance Code | Shell Finish | Pin Count | Shell Size - Insert | JESD-30 Code | Number of Outputs | Qualification Status | Contact Gender | Housing Color | Operating Supply Voltage | Power Supplies | Temperature Grade | Interface | Speed | RAM Size | Shell Size, MIL | Accessory Type | Core Processor | Illumination | Peripherals | Program Memory Size | Connectivity | Cable Opening | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Product Type | Total RAM Bits | Screening Level | Speed Grade | Resistance Tolerance | Primary Attributes | Number of Registers | Number of Logic Cells | Finish | Number of Cores | Flash Size | Language | Features | Product Category | Cam Length | Product Length | Product Width | Device Core | Length | Width | Contact Finish Thickness - Mating | Material Flammability Rating |
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 | Mfr Part No BCM33843EUKFSBGB0T | Broadcom | Datasheet | - | - | Min: 1 Mult: 1 | - | - | ABB | ACH580-BCR-017A-2+E213+K451+L501 | Broadcom Limited | - | Tray | Obsolete | - | - | 2.4GHz, 5GHz | - | - | - | - | - | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-1FC1152 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | 1 | M2S150 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 574 | 146124 LE | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion®2 | No Stopper | 166MHz | 64KB | Cam | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 150K Logic Modules | Zinc-Plated | 1 Core | 512KB | 45.0 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-FCS325I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 325-TFBGA, FCBGA | 325-FCBGA (11x11) | Polystyrene | M2S060 | US | 64 kB | EAR99 | - | - | 166 MHz | Microchip Technology | 200 | 56520 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | Facility Identification | 166MHz | 64KB | ARM® Cortex®-M3 | Not Illuminated | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | English | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-1FGG484 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S010 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S010-1FGG484 | 166 MHz | Microchip Technology | 3 | SMD/SMT | 233 | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.77 | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU43DR-1FSVE1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | AMD | 366 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU49DR-1FFVF1760I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | 1.8/2.5/3.3 V | RISC | CAN/Serial I2C/SPI/UART/USB | Yes | AMD | Surface Mount | 622 | Tray | Active | FCBGA | Industrial grade | -40 to 100 °C | Zynq® UltraScale+™ RFSoC | 1760 | 0.85 V | CAN/Serial I2C/SPI/U | 500MHz, 1.2GHz | 256 KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 64 Bit | Industrial | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ARM Cortex-A53/ARM Cortex-A5 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB023R25A2E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU9CG-2FFVB1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | XCZU9 | AMD | 328 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU2CG-2SBVA484I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | XCZU2 | AMD | 82 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-FG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | Panel Mount, Through Hole | 484-BGA | Flange | Aluminum | 484-FPBGA (23x23) | - | - | TVP00DT | Gold | Copper Alloy | Amphenol Aerospace Operations | 267 | Bulk | Metal | Active | Non-Compliant | - | -65°C ~ 175°C | MIL-DTL-38999 Series III, Tri-Start™ HD | Solder | Receptacle, Male Pins | 55 | - | Military | Threaded | - | A | Shielded | Environment Resistant | Durmalon™ | 15-55 | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | MCU, FPGA | FPGA - 25K Logic Modules | 256KB | Alignment Disc | 50.0µin (1.27µm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-1VFG256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | M2S005 | Microchip Technology | MSL 3 - 168 hours | 161 | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 191Kbit | FPGA - 5K Logic Modules | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA6U23I7NTS | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | ABB | Tray | * | Active | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-VF256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 256-LFBGA | YES | 256-FPBGA (14x14) | 256 | M2S005 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S005-VF256I | 166 MHz | Microchip Technology | SMD/SMT | 161 | 6060 LE | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.84 | No | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B256 | 161 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 161 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 1 Core | 128KB | 14 mm | 14 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010TS-1VFG256T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256-FPBGA (17x17) | M2S010 | MICROSEMI CORP | Microsemi Corporation | M2S010TS-1VFG256T2 | Microchip Technology | 138 | Tray | Active | Active | 40 | 5.8 | Yes | 1.2000 V | 0 to 85 °C | Automotive, AEC-Q100, SmartFusion®2 | e1 | Yes | 100 ppm/K | 28 Ohm | Tin/Silver/Copper (Sn/Ag/Cu) | 0.5 W | 250 | General Purpose | compliant | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | 1 | 1 | FPGA - 10K Logic Modules | 256KB | 3.2 | 2.5 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z010-L1CLG225I | AMD | Datasheet | 404 | - | Min: 1 Mult: 1 | 225-LFBGA, CSPBGA | 225-CSPBGA (13x13) | XC7Z010 | 1.2, 3.3 V | RISC | CAN/I2C/SPI/UART/USB | AMD | Surface Mount | 2 | 86 | Tray | Active | CSBGA | -40 to 100 °C | Zynq®-7000 | 100.0000 ppm/°C | 1.21 kOhm | 1.0000 W | High Reliability, MIL-PRF-39017 | 225 | 3.3 V | 667MHz | 256 KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | 1 | Artix™-7 FPGA, 28K Logic Cells | - | 15.87 | ARM Cortex A9 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z015-2CL485I | AMD | Datasheet | 408 | - | Min: 1 Mult: 1 | Gold | 484-LFBGA, CSPBGA | 484-CSPBGA (19x19) | XC7Z015 | Thermoplastic | Straight | Phosphor Bronze | 74,000 | 130 | 1.05 V | AMD | 0.95 V | Surface Mount | 130 | Bulk | Active | CSBGA | Solder | 1.0000 V | Industrial grade | -20 to 85 °C | Zynq®-7000 | 1.0000 mm | 485 | Socket | Black | 766MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 2 | Artix™-7 FPGA, 74K Logic Cells | 92,400 | - | 19.7 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z035-1FFG676I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | XC7Z035 | 275,000 | 130 | 1.05 V | AMD | 0.95 V | Surface Mount | 130 | Tray | Active | AEC-Q200 | FCBGA | 1.0000 V | Industrial grade | -40 to 100 °C | Zynq®-7000 | 100 ppm/K | 64.9 kOhm | 0.5 W | General Purpose | 676 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 1 | 1 | Kintex™-7 FPGA, 275K Logic Cells | 343,800 | - | 3.2 mm | 2.5 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM2502-2HSIVSVC2197 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | - 40 C | 50.0000 ppm/°C | 432 Ohm | SOC - Systems on a Chip | 0.05 W | 880 mV | System-On-Modules - SOM | 1 | SoC FPGA | 6.2 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVE2102-1LSESFVA784 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 100 C | 0 C | SOC - Systems on a Chip | 250 mW | High Reliability, MIL-PRF-39017 | 700 mV | System-On-Modules - SOM | 1 | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU55DR-L1FSVE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | Xilinx | 1 | Xilinx | AMD Xilinx | - | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC DR | 25.0000 ppm/°C | 24.9 kOhm | SOC - Systems on a Chip | 0.125 W | High Reliability, MIL-PRF-55182 | 500MHz, 1.2GHz | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | 0.1 | Zynq® UltraScale+™ RFSoC | - | SoC FPGA | 7.62 |
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BCM33843EUKFSBGB0T
Broadcom
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150T-1FC1152
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060T-FCS325I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010-1FGG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU43DR-1FSVE1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU49DR-1FFVF1760I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB023R25A2E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU9CG-2FFVB1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU2CG-2SBVA484I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025-FG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S005-1VFG256I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5CSEBA6U23I7NTS
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S005-VF256I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010TS-1VFG256T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z010-L1CLG225I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z015-2CL485I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z035-1FFG676I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM2502-2HSIVSVC2197
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVE2102-1LSESFVA784
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU55DR-L1FSVE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire