The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Supplier Device Package | Antenna Connector Type | Base Product Number | Core | Data RAM Size | Data RAM Type | Dimensions | Distributed RAM | Embedded Block RAM - EBR | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Interface Type | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Data Rate | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Package | Package Description | Part Life Cycle Code | Product Status | Risk Rank | RoHS | Shipping Restrictions | Supplier Package | Supply Current Receiving | Supply Current Transmitting | Supply Voltage-Max | Supply Voltage-Min | Tradename | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | Type | Voltage - Supply | Reach Compliance Code | Frequency | Operating Frequency | Operating Supply Voltage | Memory Size | Speed | RAM Size | Core Processor | Peripherals | Program Memory Type | Program Memory Size | Connectivity | Output Power | Data Rate | Architecture | Data Bus Width | Utilized IC / Part | Operating Temperature Range | Protocol | Frequency Range | Screening Level | Telecom IC Type | Power - Output | RF Family/Standard | Number of Transceivers | Antenna Type | Sensitivity | Number of ADC Channels | Primary Attributes | Serial Interfaces | Current - Receiving | Current - Transmitting | Number of Timers | Modulation | Number of Cores | Flash Size | ADC Resolution |
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 | Mfr Part No WBZ451UE-I | Microchip Technology | Datasheet | 116 | - | Min: 1 Mult: 1 | Surface Mount | LGA-39 | ARM Cortex M4 | 128 kB | SRAM | 1 | GPIO, I2C, QSPI, SPI, UART | 64 MHz | 2 Mb/s | + 85 C | Microchip Technology | - 40 C | SMD/SMT | 29 I/O | Tray | Active | Details | 40.6 mA | 96.7 mA | 3.6 V | 1.9 V | -40°C ~ 85°C | Tray | - | Bluetooth, Zigbee | 1.9V ~ 3.6V | 2.4GHz | 2.4 GHz | 1.9 V to 3.6 V | 1MB Flash | Flash | 1 MB | 12 dBm | 2Mbps | 32 bit | - | - 40 C to + 85 C | Bluetooth v5.2, Zigbee® | 12dBm | 802.15.4, Bluetooth | Antenna Not Included, U.FL | -103dBm | 8 Channel | GPIO, HCI, I²C, IrDA, JTAG, PWM, SPI, UART, USART | - | - | 4 Timer | O-QPSK | 12 bit | |||||||||||||||||||||||||||||||||||||
| Mfr Part No WBZ451PE-I | Microchip Technology | Datasheet | 218 | - | Min: 1 Mult: 1 | Surface Mount | LGA-39 | ARM Cortex M4 | 128 kB | SRAM | 1 | GPIO, I2C, QSPI, SPI, UART | 64 MHz | 2 Mb/s | + 85 C | Microchip Technology | - 40 C | SMD/SMT | 29 I/O | Tray | Active | Details | 40.6 mA | 96.7 mA | 3.6 V | 1.9 V | -40°C ~ 85°C | Tray | - | Bluetooth, Zigbee | 1.9V ~ 3.6V | 2.4GHz | 2.4 GHz | 1.9 V to 3.6 V | 1MB Flash | Flash | 1 MB | 12 dBm | 2Mbps | 32 bit | - | - 40 C to + 85 C | Bluetooth v5.2, Zigbee® | 12dBm | 802.15.4, Bluetooth | PCB Trace | -103dBm | 8 Channel | GPIO, HCI, I²C, IrDA, JTAG, PWM, SPI, UART, USART | - | - | 4 Timer | O-QPSK | 12 bit | |||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU27DR-2FSVE1156I5070 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-1156 | ARM Cortex A53, ARM Cortex R5F | 256 kB | 13 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | - 40 C | SMD/SMT | 394 I/O | 53160 LAB | 930300 LE | 850 mV | 16 Transceiver | 6 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4EV-1SFVC784E4524 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-784 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 256 kB | 2.6 Mb | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | + 100 C | 0 C | SMD/SMT | 256 I/O | 10980 LAB | 192150 LE | 850 mV | 16 Transceiver | 7 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU1EG-2SFVA625I | Xilinx | Datasheet | 1851 |
| Min: 1 Mult: 1 | FBGA-625 | 625-FCBGA (21x21) | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 256 kB | 1 Mb | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | + 100 C | AMD Xilinx | - 40 C | SMD/SMT | 72 I/O | 4680 LAB | 81900 LE | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ | 850 mV | 533MHz, 600MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | - | 7 Core | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU1EG-1SFVC784E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-784 | 784-FCBGA (23x23) | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 256 kB | 1 Mb | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | + 100 C | AMD Xilinx | 0 C | SMD/SMT | 180 I/O | 4680 LAB | 81900 LE | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ | 850 mV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | - | 7 Core | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU1EG-2SFVA625E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-625 | 625-FCBGA (21x21) | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | 256 kB | 1 Mb | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | + 100 C | AMD Xilinx | 0 C | SMD/SMT | 72 I/O | 4680 LAB | 81900 LE | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ | 850 mV | 533MHz, 600MHz, 1.333GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | MPU, FPGA | - | 7 Core | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EFR32FG23B020F512IM48-C | Silicon Labs | Datasheet | 2979 |
| Min: 1 Mult: 1 | QFN-48 | ARM Cortex M33 | 64 kB | + 125 C | - 40 C | Yes | SMD/SMT | Details | 3.8 V | 1.71 V | 78 MHz | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU21DR-L2FSVD1156E4947 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | BGA-1156 | ARM Cortex A53, ARM Cortex R5F | 256 kB | 13 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 110 C | 0 C | SMD/SMT | 53160 LAB | 930300 LE | 720 mV | 16 Transceiver | 6 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XQZU48DR-1FFRE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FCBGA-1156 | ARM Cortex A53, ARM Cortex R5F | 256 kB | 13 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | - 40 C | SMD/SMT | 53160 LAB | 930300 LE | 850 mV | 16 Transceiver | 6 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU49DR-1FSVF1760IES9819 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-1760 | ARM Cortex A53, ARM Cortex R5F | 256 kB | 13 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | - 40 C | SMD/SMT | 674 I/O | 53160 LAB | 930300 LE | 850 mV | 16 Transceiver | 6 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU9CG-2FFVC900I4931 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FBGA-900 | ARM Cortex A53, ARM Cortex R5F | 256 kB | 8.8 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | - 40 C | SMD/SMT | 220 I/O | 34260 LAB | 599550 LE | 850 mV | 24 Transceiver | 4 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z014S-1CLG484C4878 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | BGA-484 | ARM Cortex A9 | 256 kB | 1 | 32 kB | 32 kB | 667 MHz | + 85 C | 0 C | SMD/SMT | 130 I/O | 5075 LAB | 65000 LE | 1 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XQZU47DR-2FSQE1156I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | BGA-1156 | ARM Cortex A53, ARM Cortex R5F | 256 kB | 13 Mb | 1 | 2 x 32 kB, 2 x 32 kB | 2 x 32 kB, 2 x 32 kB | + 100 C | - 40 C | SMD/SMT | 53160 LAB | 930300 LE | 850 mV | 16 Transceiver | 6 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4EV-1SFVC784I4879 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FCBGA-784 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | - | 2.6 Mbit | 4.5 Mbit | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 600 MHz, 667 MHz, 1.5 GHz | SMD/SMT | 252 I/O | 10980 LAB | 192150 LE | This product may require additional documentation to export from the United States. | Zynq UltraScale+ | XCZU4EV | - | 4 Transceiver | 7 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU5EV-1SFVC784I4863 | Xilinx | Datasheet | 59 | - | Min: 1 Mult: 1 | FCBGA-784 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | - | 3.5 Mbit | 5.1 Mbit | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 600 MHz, 667 MHz, 1.5 GHz | + 100 C | - 40 C | SMD/SMT | 252 I/O | 14640 LAB | 256200 LE | This product may require additional documentation to export from the United States. | Zynq UltraScale+ | XCZU15EG | 0.85 V | - | 4 Transceiver | 7 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No UC200TGLAA-N06-MN0AA | Quectel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | Module | - | UC200 | 32 mm x 29 mm x 2.4 mm | 100 | ADC, I2C, PCM, SDIO, UART, USB 2.0 | + 75 C | Quectel | - 35 C | Surface Mount | Tray | Obsolete | Details | LCC | 4.5 V | 3.4 V | Wireless communication module | 0.370377 oz | Industrial grade | -35 to 75 °C | Cut Tape | UC200T | UMTS/HSPA Module | 3.4V ~ 4.5V | 850MHz, 900MHz, 1.8GHz, 1.9GHz | 3.8 V | - | - | 21Mbps | - | EDGE, GPRS, GSM, HSPA+, LTE, UMTS, WCDMA | 2100/1900/850/900/850/900/1800/1900 MHz | Industrial | - | Cellular | Antenna Not Included | - | ADC, I²C, PCM, SDIO, UART, USB | - | - | - | ||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No EM05EFA-512-SGAS | Quectel | Datasheet | 88 | - | Min: 1 Mult: 1 | Card Edge | Module | EM05 | 100 | USB 2.0 | Quectel | Socket Mount | Tray | Active | Details | Wireless communication module | 0.222931 oz | -40 to 85 °C | Reel | - | IoT/M2M-Optimized LTE Cat 4 M.2 Module | 3.135V ~ 4.4V | - | 3.6, 3 V | - | 150 Mbps | - | BeiDou, Galileo, GLONASS, GPS, GNSS, HSPA+, LTE, WCDMA | 700, 800, 900, 1800, 2100, 2600 MHz | Extended | - | Cellular, Navigation | Antenna Not Included | -109.5 dBm | USB | 20mA | 20mA | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No DA14585-00T00AT2 | Dialog Semiconductor | Datasheet | - | - | Min: 1 Mult: 1 | 5000 | DIALOG SEMICONDUCTOR GMBH | DA14585-00T00AT2 | Yes | , | Active | 5.65 | Details | Reel | unknown | TELECOM CIRCUIT | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU2EG-L1SFVC784I4560 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | FCBGA-784 | ARM Cortex A53, ARM Cortex R5, ARM Mali-400 MP2 | - | 1.2 Mbit | 5.3 Mbit | 1 | 2 x 32 kB, 4 x 32 kB | 2 x 32 kB, 4 x 32 kB | 600 MHz, 667 MHz, 1.5 GHz | + 100 C | - 40 C | SMD/SMT | 252 I/O | 5904 LAB | 103320 LE | This product may require additional documentation to export from the United States. | Zynq UltraScale+ | XCZU2EG | 720 mV/850 mV | - | 7 Core |
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WBZ451UE-I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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WBZ451PE-I
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU27DR-2FSVE1156I5070
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU4EV-1SFVC784E4524
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU1EG-2SFVA625I
Xilinx
Package:Embedded - System On Chip (SoC)
506.593359
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XCZU1EG-1SFVC784E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU1EG-2SFVA625E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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EFR32FG23B020F512IM48-C
Silicon Labs
Package:Embedded - System On Chip (SoC)
8.776925
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XCZU21DR-L2FSVD1156E4947
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XQZU48DR-1FFRE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU49DR-1FSVF1760IES9819
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU9CG-2FFVC900I4931
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z014S-1CLG484C4878
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XQZU47DR-2FSQE1156I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU4EV-1SFVC784I4879
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU5EV-1SFVC784I4863
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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UC200TGLAA-N06-MN0AA
Quectel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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EM05EFA-512-SGAS
Quectel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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DA14585-00T00AT2
Dialog Semiconductor
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU2EG-L1SFVC784I4560
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire