The category is 'Embedded - System On Chip (SoC)'
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- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | Automotive | Base Product Number | Core | Data Bus Width (bit) | Data Cache Size | Data RAM Size | Distributed RAM | ECCN (US) | Ethernet Speed | EU RoHS | Factory Pack QuantityFactory Pack Quantity | Family Name | HTS | I2C | I2S | Ihs Manufacturer | Instruction Cache Size | Instruction Set Architecture | Interface Type | L1 Cache Data Memory | L1 Cache Instruction Memory | Lead Shape | Manufacturer Part Number | Maximum Clock Frequency | Maximum Clock Rate (MHz) | Maximum Operating Supply Voltage | Maximum Operating Temperature | Maximum Operating Temperature (°C) | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Minimum Operating Temperature (°C) | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Height | Package Length | Package Shape | Package Style | Package Width | Part Life Cycle Code | PCB changed | PCI | PPAP | Processing Unit | Product Status | Programmability | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Standard Package Name | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | SVHC | Tradename | Typical Operating Supply Voltage | UART | Unit Weight | USART | Watchdog | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Part Status | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Pin Count | JESD-30 Code | Function | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Program Memory Type | Program Memory Size | Connectivity | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Core Architecture | Speed Grade | Voltage - I/O | RF Type | Primary Attributes | Ethernet | Number of Cores/Bus Width | Graphics Acceleration | RAM Controllers | USB | Additional Interfaces | Secondary Attributes | Number of Logic Cells | Co-Processors/DSP | Number of Cores | Security Features | Display & Interface Controllers | Flash Size | SATA | SPI | CAN | PWM | Device Core | Length | Width | Lead Free |
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 | Mfr Part No MC9328MX21VM | Freescale Semiconductor, Inc. (NXP Semiconductors) | Datasheet | 215 | - | Min: 1 Mult: 1 | Surface Mount | 289-LFBGA | 289-PBGA (17x17) | No | 32 | 5A002a.1. | Compliant | i.MX21 | 8542.31.00.01 | 1 | 1 | I2C/I2S/UART/USB | Ball | 266 | 70 | Freescale Semiconductor | 0 | Surface Mount | Bulk | 1.18 | 17 | 17 | 289 | 0 | No | Microprocessor | Active | No | BGA | MAP-BGA | Yes | 4 | 0 | 1 | 0°C ~ 70°C (TA) | Tray | i.MX | LTB | Applications Processor | 289 | 266MHz | ARM926EJ-S | ROMLess | ARM | 1.8V, 3V | 0 | 1 Core, 32-Bit | No | SDRAM | 2 | 1-Wire, I²C, I²S, SPI, SSI, MMC/SD, UART | - | - | Keypad, LCD | - | 1 | 0 | 1 | ARM926EJ-S | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No i.MX 6Quad | MCIMX6Q7CVT08AD | Freescale Semiconductor, Inc. (NXP Semiconductors) | Datasheet | - | - | Min: 1 Mult: 1 | No | 32 | 5A992C | 10Mbps/100Mbps/1000Mbps | Compliant | i.MX 6Quad | 8542.31.00.01 | 3 | 3 | CAN/Ethernet/I2C/I2S/SPI/UART/USB | Ball | 800 | 105 | -40 | Surface Mount | 1.6 | 21 | 21 | 624 | No | Microprocessor | Yes | BGA | FCBGA | Yes | 5 | 0 | 2 | Tray | NRND | Applications Processor | 624 | 272KB | ROM | 96KB | ARM | 1 | 4 | 5 | 0 | 4 | ARM Cortex A9 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MCIMX7S3EVK08SC | Freescale Semiconductor, Inc. (NXP Semiconductors) | Datasheet | 324 |
| Min: 1 Mult: 1 | No | 32 | 32KB|16KB | 5A992 | 10Mbps/100Mbps/1000Mbps | Compliant | i.MX 7Solo | 8542.31.00.01 | 4 | 0 | 32KB|16KB | Ethernet/I2C/SPI/UART/USB | 800 | 105 | -20 | Surface Mount | 0.87(Max) | 12 | 12 | 488 | 0 | No | Microprocessor | Yes | MAP-BGA | 7 | 0 | 4 | Tray | Active | Applications Processor | 488 | 256KB | ROM | 96KB | 1 | 2 | 4 | 0 | ARM Cortex A7|ARM Cortex M4 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No i.MX 6Quad | MCIMX6Q5EYM10AD | Freescale Semiconductor, Inc. (NXP Semiconductors) | Datasheet | - | - | Min: 1 Mult: 1 | No | 32 | 5A992C | 10Mbps/100Mbps/1000Mbps | Compliant | i.MX 6Quad | 8542.31.00.01 | 3 | 3 | CAN/I2C/I2S/SPI/UART/USB | Ball | 1000 | 105 | -20 | Surface Mount | 1.05 | 21 | 21 | 624 | No | Microprocessor | Yes | BGA | FCBGA | 5 | 0 | 2 | Tray | Active | Applications Processor | 624 | 256KB | ROM | 96KB | ARM | 1 | 1 | 5 | 1 | 4 | ARM Cortex A9 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MC9328MXLVM20 | Freescale Semiconductor, Inc. (NXP Semiconductors) | Datasheet | 296 | - | Min: 1 Mult: 1 | No | 32 | 3A991A2 | Compliant | i.MX | 8542.31.00.01 | 1 | 1 | I2C/I2S/SPI/UART/USB | Ball | 200 | 70 | 0 | Surface Mount | 1.12 | 14 | 14 | 256 | No | Microprocessor | No | BGA | MAP-BGA | Yes | 2 | 0 | 1 | Tray | Obsolete | Applications Processor | 256 | ROMLess | ARM | 0 | 1 | 2 | 0 | 1 | ARM9TDMI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No i.MX 8MDual | MiMX8MD6DVAJZAA | Freescale Semiconductor, Inc. (NXP Semiconductors) | Datasheet | - | - | Min: 1 Mult: 1 | No | 32 | 32KB | 5A992c. | Compliant | 8542.31.00.01 | 4 | 0 | 32KB | Ethernet/I2C/SPI/UART/USB | 1500 | 95 | 0 | Surface Mount | 1.68(Min) | 17 | 17 | 621 | 2 | No | Microcontroller | Yes | FBGA | 4 | 0 | Preliminary | Applications Processor | 621 | 160KB | ROM | 128KB | ARM | 1 | 2 | 3 | 0 | ARM Cortex A53|ARM Cortex M4 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MCIMX7S3DVK08SB | Freescale Semiconductor, Inc. (NXP Semiconductors) | Datasheet | - | - | Min: 1 Mult: 1 | No | 32 | 5A992 | 10Mbps/100Mbps/1000Mbps | i.MX 7Solo | 8542.31.00.01 | 4 | 0 | Ethernet/I2C/SPI/UART/USB | 800 | 95 | 0 | Surface Mount | 0.87(Max) | 12 | 12 | 488 | 0 | No | Microprocessor | Yes | TFBGA | 7 | 0 | 1 | Obsolete | Applications Processor | 488 | 32KB | ROM | 96KB | ARM | 2 | 1 | 4 | 0 | 4 | ARM Cortex A7|ARM Cortex M4 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No i.MX 6UltraLite | MCIMX6G2AVM07AB | Freescale Semiconductor, Inc. (NXP Semiconductors) | Datasheet | - | - | Min: 1 Mult: 1 | Yes | 32 | 32KB | 5A992 | 10Mbps/100Mbps | Compliant | i.MX | 8542.31.00.01 | 4 | 3 | 32KB | CAN/Ethernet/I2C/I2S/SPI/UART/USB | Ball | 696 | 125 | -40 | Surface Mount | 0.98(Max) | 14 | 14 | 289 | 0 | Unknown | Microprocessor | No | BGA | BGA | Yes | 8 | 0 | Tray | Active | Applications Processor | 289 | ROMLess | ARM | 2 | 2 | 4 | 2 | 8 | ARM Cortex A7 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No i.MX 6UltraLite | MCIMX6G2CVM05AB | Freescale Semiconductor, Inc. (NXP Semiconductors) | Datasheet | - | - | Min: 1 Mult: 1 | No | 5A992C | Compliant | 8542.31.00.01 | Surface Mount | 0.98(Max) | 14 | 14 | 289 | No | MAP-BGA | Yes | Tray | Active | 289 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No i.MX 6UltraLite | MCIMX6G2CVK05AB | Freescale Semiconductor, Inc. (NXP Semiconductors) | Datasheet | - | - | Min: 1 Mult: 1 | No | 5A992c. | Compliant | 8542.31.00.01 | Ball | Surface Mount | 0.98(Max) | 9 | 9 | 272 | No | BGA | LFBGA | Tray | Active | 272 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MCIMX7D3DVK10SB | Freescale Semiconductor, Inc. (NXP Semiconductors) | Datasheet | - | - | Min: 1 Mult: 1 | No | 32 | 5A992 | 10Mbps/100Mbps/1000Mbps | i.MX 7Dual | 8542.31.00.01 | 4 | 0 | Ethernet/I2C/SPI/UART/USB | 1000 | 95 | 0 | Surface Mount | 0.87(Max) | 12 | 12 | 488 | 0 | No | Microprocessor | Yes | MAP-BGA | 7 | 0 | 1 | Obsolete | Applications Processor | 488 | 32KB | ROM | 96KB | ARM | 2 | 1 | 4 | 0 | 4 | ARM Cortex A7|ARM Cortex M4 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No ST4SI2S0009AKI8T | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | - | - | - | ST4SI2 | 15000 | RISC | + 80 C | STMicroelectronics | - 25 C | SMD/SMT | Bulk | Microcontroller | Active | Not Applicable | 1.8 V, 3 V, 5 V | 1.8 V, 3 V, 5 V | Bulk | ST4SIM-200S | LTE-M | - | Bias Network | Flash | 32 bit | 2G, 3G, 4G, CDMA, LTE | SIM and Smart Card Interface | ARM SC300 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-VFG400 | Microchip Technology | Datasheet | 123 | - | Min: 1 Mult: 1 | VFPBGA-400 | 400-VFBGA (17x17) | M2S010 | ARM Cortex M3 | 64 kB | 90 | - | - | 166 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | 0 C | Yes | SMD/SMT | 233 I/O | 1007 LAB | 12084 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 0.034371 oz | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 10K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-1FG484M | Microchip Technology | Datasheet | 1951 |
| Min: 1 Mult: 1 | BGA-484 | YES | 484-FPBGA (23x23) | 484 | M2S060 | ARM Cortex M3 | 64 kB | 1314 kbit | 60 | MICROSEMI CORP | - | - | M2S060T-1FG484M | 166 MHz | + 125 C | Microchip Technology | - 55 C | 3 | SMD/SMT | 267 I/O | 4710 LAB | 56520 LE | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.84 | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | e0 | Yes | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 1 Core | 256KB | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-1FGG676 | Microchip Technology | Datasheet | 1819 | - | Min: 1 Mult: 1 | BGA-676 | 676-FBGA (27x27) | M2S060 | ARM Cortex M3 | 64 kB | 1314 kbit | 40 | - | - | 166 MHz | + 85 C | Microchip Technology | 0 C | SMD/SMT | 387 I/O | 4710 LAB | 56520 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | SmartFusion2 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010S-1TQG144 | Microchip Technology | Datasheet | 39 | - | Min: 1 Mult: 1 | TQFP-144 | 144-TQFP (20x20) | M2S010 | ARM Cortex M3 | 64 kB | 400 kbit | 60 | - | - | 166 MHz | + 85 C | Microchip Technology | 0 C | SMD/SMT | 84 I/O | 1007 LAB | 12084 LE | Tray | Active | This product may require additional documentation to export from the United States. | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 10K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-1FG484I | Microchip Technology | Datasheet | 15 |
| Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | M2S005 | ARM Cortex M3 | 64 kB | 60 | - | - | 166 MHz | Microchip Technology | Yes | SMD/SMT | 209 | 505 LAB | 6060 LE | Tray | Active | N | This product may require additional documentation to export from the United States. | 1.2000 V | -40 to 100 °C | Tray | SmartFusion2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 5K Logic Modules | 1 Core | 128KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-1FCS325 | Microchip Technology | Datasheet | 1865 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S060 | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | M2S060T-1FCS325 | 166 MHz | Microchip Technology | Yes | 200 | 4710 LAB | 56520 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, BGA325,21X21,20 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.86 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | SmartFusion2 | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 1 Core | 256KB | 11 mm | 11 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-FCS325 | Microchip Technology | Datasheet | 2367 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | YES | 325-FCBGA (11x11) | 325 | M2S050 | ARM Cortex M3 | 64 kB | 176 | MICROSEMI CORP | - | - | M2S050-FCS325 | 166 MHz | Microchip Technology | Yes | 200 | 4695 LAB | 56340 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 30 | 5.81 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.5 mm | not_compliant | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 11 mm | 11 mm | Contains Lead | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-VFG400I | Microchip Technology | Datasheet | 1976 |
| Min: 1 Mult: 1 | VFPBGA-400 | YES | 400-VFBGA (17x17) | 400 | M2S050 | ARM Cortex M3 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S050-VFG400I | 166 MHz | Microchip Technology | Yes | 3 | SMD/SMT | 207 | 4695 LAB | 56340 LE | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.76 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B400 | 207 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | 17 mm | 17 mm |
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MC9328MX21VM
Freescale Semiconductor, Inc. (NXP Semiconductors)
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
i.MX 6Quad | MCIMX6Q7CVT08AD
Freescale Semiconductor, Inc. (NXP Semiconductors)
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
MCIMX7S3EVK08SC
Freescale Semiconductor, Inc. (NXP Semiconductors)
Package:Embedded - System On Chip (SoC)
23.194401
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i.MX 6Quad | MCIMX6Q5EYM10AD
Freescale Semiconductor, Inc. (NXP Semiconductors)
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
MC9328MXLVM20
Freescale Semiconductor, Inc. (NXP Semiconductors)
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
i.MX 8MDual | MiMX8MD6DVAJZAA
Freescale Semiconductor, Inc. (NXP Semiconductors)
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
MCIMX7S3DVK08SB
Freescale Semiconductor, Inc. (NXP Semiconductors)
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
i.MX 6UltraLite | MCIMX6G2AVM07AB
Freescale Semiconductor, Inc. (NXP Semiconductors)
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
i.MX 6UltraLite | MCIMX6G2CVM05AB
Freescale Semiconductor, Inc. (NXP Semiconductors)
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
i.MX 6UltraLite | MCIMX6G2CVK05AB
Freescale Semiconductor, Inc. (NXP Semiconductors)
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
MCIMX7D3DVK10SB
Freescale Semiconductor, Inc. (NXP Semiconductors)
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
ST4SI2S0009AKI8T
STMicroelectronics
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010-VFG400
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060T-1FG484M
Microchip Technology
Package:Embedded - System On Chip (SoC)
531.711716
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M2S060T-1FGG676
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010S-1TQG144
Microchip Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005S-1FG484I
Microchip Technology
Package:Embedded - System On Chip (SoC)
37.773368
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M2S060T-1FCS325
Microchip Technology
Package:Embedded - System On Chip (SoC)
199.674672
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M2S050-FCS325
Microchip Technology
Package:Embedded - System On Chip (SoC)
138.830361
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M2S050-VFG400I
Microchip Technology
Package:Embedded - System On Chip (SoC)
216.038405