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Embedded - System On Chip (SoC) (6000)

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Part Number	Manufacturer	Datasheet	Availability	Pricing(USD)	Quantity	Lifecycle Status	Package / Case	Surface Mount	Number of Pins	Supplier Device Package	Number of Terminals	Base Product Number	Clock Frequency-Max	Core	Data RAM Size	Distributed RAM	Embedded Block RAM - EBR	Factory Pack QuantityFactory Pack Quantity	I/O Voltage	Ihs Manufacturer	Instruction Set Architecture	Interface Type	JTAG Support	L1 Cache Data Memory	L1 Cache Instruction Memory	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Supply Voltage	Maximum Operating Temperature	Mfr	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting	Mounting Styles	Number of CPU Cores	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Elements	Operating Temperature-Max	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Samacsys Description	Shipping Restrictions	Supplier Package	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Tradename	Typical Operating Supply Voltage	Unit Weight	Usage Level	Operating Temperature	Packaging	Series	JESD-609 Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Terminal Pitch	Reach Compliance Code	Frequency	Pin Count	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Power Supplies	Temperature Grade	Interface	Speed	RAM Size	Core Processor	Peripherals	Program Memory Size	Connectivity	Architecture	Data Bus Width	Number of Inputs	Organization	Seated Height-Max	Programmable Logic Type	Core Architecture	Screening Level	Speed Grade	Primary Attributes	Number of Registers	Number of CLBs	Number of Logic Cells	Number of Cores	Flash Size	Device Core	Length	Width
Mfr Part No M2S010-1TQG144	Microchip Technology	Datasheet	-	-	Min: 1 Mult: 1		TQFP-144	YES		144-TQFP (20x20)	144	M2S010		ARM Cortex M3	64 kB			60	1.2, 1.5, 1.8, 2.5, 3.3 V	MICROSEMI CORP	RISC	CAN/Ethernet/Serial I2C/SPI/UART/USB	Yes	-	-	M2S010-1TQG144	166 MHz			Microchip Technology			Yes	3	Surface Mount	SMD/SMT	1	84	1007 LAB	12084 LE	85 °C	Tray	PLASTIC/EPOXY	LFQFP	TQFP-144	QFP144,.87SQ,20	SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	Active	Active	40	5.81	Details	Yes		This product may require additional documentation to export from the United States.	TQFP	1.26 V	1.14 V	1.2 V			0.046530 oz	Commercial grade	0 to 85 °C	Tray	SmartFusion2		Pure Matte Tin (Sn)				8542.39.00.01	CMOS	QUAD	GULL WING	250	0.5 mm	compliant		144	S-PQFP-G144	84	Not Qualified	0.95, 1.05 V	1.2 V	OTHER	CAN/Ethernet/Serial	166MHz	64 KB	ARM® Cortex®-M3	-	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	32 Bit	84		1.6 mm	FIELD PROGRAMMABLE GATE ARRAY		Commercial		FPGA - 10K Logic Modules			12084	1 Core	256KB	ARM Cortex-M3	20 mm	20 mm
Mfr Part No M2S010TS-1VFG400I	Microchip Technology	Datasheet	-	-	Min: 1 Mult: 1		VFPBGA-400	YES		400-VFBGA (17x17)	400	M2S010		ARM Cortex M3	64 kB			90		MICROSEMI CORP				-	-	M2S010TS-1VFG400I	166 MHz			Microchip Technology			Yes	3		SMD/SMT		195	1007 LAB	12084 LE		Tray	PLASTIC/EPOXY	LFBGA	LFBGA, BGA400,20X20,32	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	40	5.81	Details	Yes		This product may require additional documentation to export from the United States.		1.26 V	1.14 V	1.2 V		1.2000 V			-40 to 100 °C	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant			S-PBGA-B400	195	Not Qualified		1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		195		1.51 mm	FIELD PROGRAMMABLE GATE ARRAY			1	FPGA - 10K Logic Modules			12084	1 Core	256KB		17 mm	17 mm
Mfr Part No M2S060TS-FCS325	Microchip Technology	Datasheet	-	-	Min: 1 Mult: 1		325-TFBGA, FCBGA	YES		325-FCBGA (11x11)	325	M2S060		ARM Cortex M3	64 kB			176		MICROSEMI CORP				-	-	M2S060TS-FCS325	166 MHz			Microchip Technology			Yes					200	4710 LAB	56520 LE	85 °C	Tray	PLASTIC/EPOXY	TFBGA	TFBGA, BGA325,21X21,20	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	30	5.87	N	No		This product may require additional documentation to export from the United States.		1.26 V	1.14 V	1.2 V	SmartFusion2				0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant			S-PBGA-B325	200	Not Qualified		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		200		1.01 mm	FIELD PROGRAMMABLE GATE ARRAY				FPGA - 60K Logic Modules			56520	1 Core	256KB		11 mm	11 mm
Mfr Part No M2S060T-FG676	Microchip Technology	Datasheet	-	-	Min: 1 Mult: 1		676-BGA			676-FBGA (27x27)		M2S060		ARM Cortex M3	64 kB			40						-	-		166 MHz			Microchip Technology			Yes					387	4710 LAB	56520 LE		Tray								Active			N			This product may require additional documentation to export from the United States.					SmartFusion2				0°C ~ 85°C (TJ)	Tray	SmartFusion2																						166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA									FPGA - 60K Logic Modules				1 Core	256KB
Mfr Part No M2S050-1FGG484I	Microchip Technology	Datasheet	-	-	Min: 1 Mult: 1		FPBGA-484			484-FPBGA (23x23)		M2S050		ARM Cortex M3	64 kB			60						-	-		166 MHz			Microchip Technology			Yes			SMD/SMT		267	4695 LAB	56340 LE		Tray								Active			Details			This product may require additional documentation to export from the United States.						1.2000 V			-40 to 100 °C	Tray	SmartFusion2																						166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA								1	FPGA - 50K Logic Modules				1 Core	256KB
Mfr Part No M2S060-1VF400I	Microchip Technology	Datasheet	-	-	Min: 1 Mult: 1	Production (Last Updated: 2 months ago)	400-LFBGA			400-VFBGA (17x17)		M2S060		ARM Cortex M3	64 kB			90						-	-		166 MHz			Microchip Technology			Yes					207	4710 LAB	56520 LE		Tray								Active			N			This product may require additional documentation to export from the United States.					SmartFusion2				-40°C ~ 100°C (TJ)	Tray	SmartFusion2																						166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA									FPGA - 60K Logic Modules				1 Core	256KB
Mfr Part No M2S025TS-1VF400I	Microchip Technology	Datasheet	-	-	Min: 1 Mult: 1		VFPBGA-400	YES		400-VFBGA (17x17)	400	M2S025		ARM Cortex M3	64 kB			90		MICROSEMI CORP				-	-	M2S025TS-1VF400I	166 MHz	1.26 V		Microchip Technology	1.14 V		Yes			SMD/SMT		207	2308 LAB	27696 LE		Tray	PLASTIC/EPOXY	LFBGA	VFBGA-400		SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	30	5.87	N	No		This product may require additional documentation to export from the United States.		1.26 V	1.14 V	1.2 V		1.2000 V			-40 to 100 °C	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)				8542.39.00.01		BOTTOM	BALL	240	0.8 mm	not_compliant			S-PBGA-B400							166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA				1.51 mm	FIELD PROGRAMMABLE GATE ARRAY			1	FPGA - 25K Logic Modules				1 Core	256KB		17 mm	17 mm
Mfr Part No M2S010-FG484	Microchip Technology	Datasheet	-	-	Min: 1 Mult: 1		BGA-484	YES		484-FPBGA (23x23)	484	M2S010		ARM Cortex M3	64 kB	400 kbit	64 kB	60		MICROSEMI CORP				-	-	M2S010-FG484	166 MHz	1.26 V	+ 85 C	Microchip Technology	1.14 V	0 C	Yes	3		SMD/SMT		233 I/O	1007 LAB	12084 LE	85 °C	Tray	PLASTIC/EPOXY	BGA	FBGA-484	BGA484,22X22,40	SQUARE	GRID ARRAY	Active	Active	30	5.28	N	No		This product may require additional documentation to export from the United States.		1.26 V	1.14 V	1.2 V		1.2000 V			0 to 85 °C	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant			S-PBGA-B484	233	Not Qualified	1.2 V	1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		233		2.44 mm	FIELD PROGRAMMABLE GATE ARRAY			STD	FPGA - 10K Logic Modules			9744	1 Core	256KB		23 mm	23 mm
Mfr Part No A2F500M3G-1FG484M	Microchip Technology	Datasheet	-	-	Min: 1 Mult: 1		484-BGA		484	484-FPBGA (23x23)		A2F500		ARM Cortex M3	64 kB			60		MICROSEMI CORP				-	-	A2F500M3G-1FG484M	100 MHz			Microchip Technology			Yes					MCU - 41, FPGA - 128	-	6000 LE		Tray							Active	Active		5.86	N	No	ARMu00ae Cortexu00ae-M3 System On Chip (SOC) IC SmartFusionu00ae ProASICu00ae3 FPGA, 500K Gates, 11520 D-Flip-Flops 512KB 64KB 100MHz 484-FPBGA (23x23)	This product may require additional documentation to export from the United States.					SmartFusion				-55°C ~ 125°C (TJ)	Tray	A2F500			125 °C	-55 °C		8542.39.00.01						unknown	100 MHz					1.5 V			EBI/EMI, Ethernet, I2C, SPI, UART, USART	100MHz	13.5 kB	ARM® Cortex®-M3	DMA, POR, WDT	512 kB	EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA						ARM		1	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	11520			1 Core	512KB
Mfr Part No M2S010T-VF400	Microchip Technology	Datasheet	-	-	Min: 1 Mult: 1		VFPBGA-400	YES		400-VFBGA (17x17)	400	M2S010		ARM Cortex M3	64 kB			90		MICROSEMI CORP				-	-	M2S010T-VF400	166 MHz	1.26 V		Microchip Technology	1.14 V		Yes			SMD/SMT		195	1007 LAB	12084 LE	85 °C	Tray	PLASTIC/EPOXY	LFBGA	VFBGA-400	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	30	5.3	N	No		This product may require additional documentation to export from the United States.		1.26 V	1.14 V	1.2 V		1.2000 V			0 to 85 °C	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant			S-PBGA-B400	160	Not Qualified		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		160		1.51 mm	FIELD PROGRAMMABLE GATE ARRAY			STD	FPGA - 10K Logic Modules			9744	1 Core	256KB		17 mm	17 mm
Mfr Part No M2S010TS-1FGG484	Microchip Technology	Datasheet	-	-	Min: 1 Mult: 1	Production (Last Updated: 1 month ago)	FPBGA-484	YES		484-FPBGA (23x23)	484	M2S010		ARM Cortex M3	64 kB			60		MICROSEMI CORP				-	-	M2S010TS-1FGG484	166 MHz			Microchip Technology			Yes	3		SMD/SMT		233	1007 LAB	12084 LE	85 °C	Tray	PLASTIC/EPOXY	BGA	FBGA-484	BGA484,22X22,40	SQUARE	GRID ARRAY	Active	Active	40	5.81	Details	Yes		This product may require additional documentation to export from the United States.		1.26 V	1.14 V	1.2 V					0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant			S-PBGA-B484	233	Not Qualified		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		233		2.44 mm	FIELD PROGRAMMABLE GATE ARRAY			1	FPGA - 10K Logic Modules			12084	1 Core	256KB		23 mm	23 mm
Mfr Part No M2S025T-VFG400I	Microchip Technology	Datasheet	-	-	Min: 1 Mult: 1		VFPBGA-400			400-VFBGA (17x17)		M2S025		ARM Cortex M3	64 kB			90						-	-		166 MHz			Microchip Technology			Yes			SMD/SMT		207	2308 LAB	27696 LE		Tray								Active			Details			This product may require additional documentation to export from the United States.									-40°C ~ 100°C (TJ)	Tray	SmartFusion2																						166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA									FPGA - 25K Logic Modules				1 Core	256KB
Mfr Part No M2S050-1FCS325I	Microchip Technology	Datasheet	-	-	Min: 1 Mult: 1		FCBGA-325	YES		325-FCBGA (11x11)	325	M2S050		ARM Cortex M3	64 kB			176		MICROSEMI CORP				-	-	M2S050-1FCS325I	166 MHz			Microchip Technology			Yes			SMD/SMT		200	4695 LAB	56340 LE		Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	30	5.81	N	No		This product may require additional documentation to export from the United States.		1.26 V	1.14 V	1.2 V					-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant			S-PBGA-B325	200	Not Qualified		1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		200		1.01 mm	FIELD PROGRAMMABLE GATE ARRAY				FPGA - 50K Logic Modules			56340	1 Core	256KB		11 mm	11 mm
Mfr Part No M2S050T-1FG896I	Microchip Technology	Datasheet	-	-	Min: 1 Mult: 1		FPBGA-896	YES		896-FBGA (31x31)	896	M2S050	50 MHz	ARM Cortex M3	64 kB			27		MICROSEMI CORP				-	-	M2S050T-1FG896I	166 MHz			Microchip Technology			Yes	3		SMD/SMT		377	4695 LAB	56340 LE		Tray	PLASTIC/EPOXY	BGA	FBGA-896	BGA896,30X30,40	SQUARE	GRID ARRAY	Active	Active	30	1.74	N	No		This product may require additional documentation to export from the United States.		1.26 V	1.14 V	1.2 V		1.2000 V			-40 to 100 °C	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant		896	S-PBGA-B896	377	Not Qualified		1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		377	48672 CLBS	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY			1	FPGA - 50K Logic Modules		48672	48672	1 Core	256KB		31 mm	31 mm
Mfr Part No M2S005S-1TQG144	Microchip Technology	Datasheet	-	-	Min: 1 Mult: 1		TQFP-144			144-TQFP (20x20)		M2S005		ARM Cortex M3	64 kB			60						-	-		166 MHz			Microchip Technology			Yes			SMD/SMT		84	505 LAB	6060 LE		Tray								Active			Details			This product may require additional documentation to export from the United States.							0.046530 oz		0°C ~ 85°C (TJ)	Tray	SmartFusion2																						166MHz	64KB	ARM® Cortex®-M3	-	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA									FPGA - 5K Logic Modules				1 Core	128KB
Mfr Part No M2S060-1VFG400I	Microchip Technology	Datasheet	-	-	Min: 1 Mult: 1	Production (Last Updated: 2 months ago)	400-LFBGA	YES		400-VFBGA (17x17)	400	M2S060		ARM Cortex M3	64 kB			90		MICROSEMI CORP				-	-	M2S060-1VFG400I	166 MHz			Microchip Technology			Yes	3				207	4710 LAB	56520 LE		Tray	PLASTIC/EPOXY	LFBGA	VFBGA-400	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	40	5.82	Details	Yes		This product may require additional documentation to export from the United States.		1.26 V	1.14 V	1.2 V	SmartFusion2				-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)				8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant			S-PBGA-B400	207	Not Qualified		1.2 V			166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		207		1.51 mm	FIELD PROGRAMMABLE GATE ARRAY				FPGA - 60K Logic Modules			56520	1 Core	256KB		17 mm	17 mm
Mfr Part No M2S005-FG484	Microchip Technology	Datasheet	-	-	Min: 1 Mult: 1		BGA-484			484-FPBGA (23x23)		M2S005		ARM Cortex M3	64 kB	191 kbit	64 kB	60						-	-		166 MHz	1.26 V	+ 85 C	Microchip Technology	1.14 V	0 C	Yes			SMD/SMT		209 I/O	505 LAB	6060 LE		Tray								Active			N			This product may require additional documentation to export from the United States.						1.2000 V			0 to 85 °C	Tray	SmartFusion2																		1.2 V				166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA								STD	FPGA - 5K Logic Modules				1 Core	128KB
Mfr Part No M2S060T-1FGG484I	Microchip Technology	Datasheet	-	-	Min: 1 Mult: 1	Production (Last Updated: 2 months ago)	484-BGA	YES	484	484-FPBGA (23x23)	484	M2S060		ARM Cortex M3	64 kB			60		MICROSEMI CORP				-	-	M2S060T-1FGG484I	166 MHz			Microchip Technology			Yes	3				267	4710 LAB	56520 LE		Tray	PLASTIC/EPOXY	BGA	FBGA-484	BGA484,22X22,40	SQUARE	GRID ARRAY	Active	Active	40	5.81	Details	Yes		This product may require additional documentation to export from the United States.		1.26 V	1.14 V	1.2 V	SmartFusion2	1.2000 V			-40 to 100 °C	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)	100 °C	-40 °C		8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant			S-PBGA-B484	267	Not Qualified	1.2 V	1.2 V			166MHz	164.3 kB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		267		2.44 mm	FIELD PROGRAMMABLE GATE ARRAY			1	FPGA - 60K Logic Modules			56520	1 Core	256KB		23 mm	23 mm
Mfr Part No M2S025T-VF256	Microchip Technology	Datasheet	-	-	Min: 1 Mult: 1	Production (Last Updated: 2 months ago)	256-LFBGA	YES		256-FPBGA (14x14)	256	M2S025		ARM Cortex M3	64 kB			119		MICROSEMI CORP				-	-	M2S025T-VF256	166 MHz			Microchip Technology			Yes					138	2308 LAB	27696 LE	85 °C	Tray	PLASTIC/EPOXY	LFBGA	VFBGA-256	BGA256,16X16,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	30	5.84	N	No		This product may require additional documentation to export from the United States.		1.26 V	1.14 V	1.2 V					0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)			LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant			S-PBGA-B256	138	Not Qualified		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		138		1.56 mm	FIELD PROGRAMMABLE GATE ARRAY				FPGA - 25K Logic Modules			27696	1 Core	256KB		14 mm	14 mm
Mfr Part No M2S010TS-VF400	Microchip Technology	Datasheet	-	-	Min: 1 Mult: 1	Production (Last Updated: 1 month ago)	400-LFBGA	YES		400-VFBGA (17x17)	400	M2S010		ARM Cortex M3	64 kB			90		MICROSEMI CORP				-	-	M2S010TS-VF400	166 MHz			Microchip Technology			Yes					195	1007 LAB	12084 LE	85 °C	Tray	PLASTIC/EPOXY	LFBGA	VFBGA-400	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	30	5.88	N	No		This product may require additional documentation to export from the United States.		1.26 V	1.14 V	1.2 V					0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)				8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant			S-PBGA-B400	195	Not Qualified		1.2 V	OTHER		166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA		195		1.51 mm	FIELD PROGRAMMABLE GATE ARRAY				FPGA - 10K Logic Modules			12084	1 Core	256KB		17 mm	17 mm

M2S010-1TQG144

Microchip Technology

Package:Embedded - System On Chip (SoC)

Price: please inquire
M2S010TS-1VFG400I

Microchip Technology

Package:Embedded - System On Chip (SoC)

Price: please inquire
M2S060TS-FCS325

Microchip Technology

Package:Embedded - System On Chip (SoC)

Price: please inquire
M2S060T-FG676

Microchip Technology

Package:Embedded - System On Chip (SoC)

Price: please inquire
M2S050-1FGG484I

Microchip Technology

Package:Embedded - System On Chip (SoC)

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M2S060-1VF400I

Microchip Technology

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Microchip Technology

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Microchip Technology

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A2F500M3G-1FG484M

Microchip Technology

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Microchip Technology

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M2S010TS-1FGG484

Microchip Technology

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M2S025T-VFG400I

Microchip Technology

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Microchip Technology

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Microchip Technology

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Microchip Technology

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Microchip Technology

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Microchip Technology

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Microchip Technology

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Microchip Technology

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Microchip Technology

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Embedded - System On Chip (SoC) (6000)