The category is 'Embedded - System On Chip (SoC)'
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- Peripherals
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- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Housing Material | Number of Terminals | Contact Material - Mating | Contact Material - Post | Board Material | Approvals | Base Product Number | Brand | Contact Finish Mating | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Range | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Operating Temperature | Packaging | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Termination | Terminal Finish | Composition | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Current Rating | Pitch - Mating | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Number of Contacts | Contact Finish - Post | Output Type | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Size | Product Type | Speed Grade | Termination Post Length | Pitch - Post | Convert From (Adapter End) | Convert To (Adapter End) | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Connection Type | Features | Product Category | Temperature | Power Type | Diameter | Length | Width | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Material Flammability Rating |
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 | Mfr Part No XCZU2EG-L1SBVA484I | AMD | Datasheet | 2179 |
| Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | XCZU2 | ABB | ACH580-BCR-088A-2+B058+J429+K454 | AMD | 82 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7CG-2FFVC1156I | AMD | Datasheet | 515 |
| Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | CE, CSA, UL | XCZU7 | Cutler Hammer, Div of Eaton Corp | PDG52P1200D3WN | AMD | Panel | 360 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 1,200 A | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3CG-L1SBVA484I | AMD | Datasheet | 599 | - | Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | XCZU3 | Miscellaneous | AMD | 82 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-1VFG400I | Microchip | Datasheet | 1761 |
| Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S050 | 64 kB | - | - | Greenlee | 02466 | 166 MHz | Microchip Technology | SMD/SMT | 207 | 56340 LE | Tray | Active | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 50K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU2CG-L1SFVC784I | AMD | Datasheet | 2324 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU2 | Cutler Hammer, Div of Eaton Corp | DH227NRKV | AMD | 252 | Tray | Active | 0.8500 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1L | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU11EG-1FFVF1517I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU11 | Schneider | 139394 | AMD | 464 | Tray | Active | 0.8500 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | Inverted Flare | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XAZU2EG-1SFVA625I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | XAZU2 | Greenlee | 31004 | AMD | 128 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 1.2GHz | 1.2MB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I²C, SPI, UART/USART, USB | MPU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XAZU3EG-1SFVA625I | AMD | Datasheet | 788 |
| Min: 1 Mult: 1 | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | XAZU3 | Cutler Hammer, Div of Eaton Co | E57LBL30A2SP | 0.892 V | AMD | 0.808 V | 128 | Tray | Active | 10 mm | 0.8500 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EG | Shielded | 625 | NC | 500MHz, 1.2GHz | 1.8MB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I²C, SPI, UART/USART, USB | MPU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | 3 Pin Micro Pigtail | AC | 30 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU11EG-3FFVB1517E | AMD | Datasheet | 628 |
| Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | CE, cURus | XCZU11 | ILME | TCHI-24 | AMD | 488 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | Non-Metallic | None (Housing Only) | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 104mm x 27mm | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | -40-90 °C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4EV-1SFVC784I | AMD | Datasheet | 668 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU4 | Pfannenberg | 31008805000 | 0.892 V | AMD | 0.808 V | 252 | Tray | Active | 0.8500 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU17EG-2FFVE1924I | AMD | Datasheet | 643 |
| Min: 1 Mult: 1 | 1924-BBGA, FCBGA | 1924-FCBGA (45x45) | XCZU17 | PILZ | 313902 | 0.892 V | AMD | 0.808 V | 668 | Tray | Active | 0.85 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EG | 1924 | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU5CG-2FBVB900E | AMD | Datasheet | 745 |
| Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | CE, CSA, UL | XCZU5 | Cutler Hammer, Div of Eaton Corp | PDG53K0800E2NM | AMD | Panel | 204 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 800 A | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-VF400 | Microchip | Datasheet | 1682 | - | Min: 1 Mult: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S025 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S025-VF400 | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 207 | 27696 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.87 | No | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 160 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 160 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 25K Logic Modules | 23988 | 1 Core | 256KB | 17 mm | 17 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-1FCSG325 | Microchip | Datasheet | 1793 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | 325-FCBGA (11x11) | M2S060 | 64 kB | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 200 | 56520 LE | Tray | Active | Compliant | 1.2 V | 0 to 85 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 60K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVE1752-1LLIVSVA1596 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 500 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB019R25A2E2V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027E4F29E3LG | ALTERA | Datasheet | 484 |
| Min: 1 Mult: 1 | FBGA-780 | YES | 780 | CE, CSA, UL | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Cutler Hammer, Div of Eaton Corp | PDG21M0150TFFJ | 1.2 GHz | Yes | Panel | SMD/SMT | 360 | 33750 LAB | 270000 LE | 100 °C | PLASTIC/EPOXY | BGA | BGA, BGA780,28X28,40 | BGA780,28X28,40 | SQUARE | GRID ARRAY | 964940 | Active | NOT SPECIFIED | 5.43 | Details | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0°C ~ 100°C (TJ) | Tray | Arria 10 SX | Active | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 150 A | S-PBGA-B780 | 360 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 360 | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 270K Logic Elements | 270000 | 2 Core | -- | SoC FPGA | 29 mm | 29 mm | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010TS-FG484 | Microchip | Datasheet | 4 |
| Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S010 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S010TS-FG484 | 166 MHz | Microchip Technology | 3 | 233 | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.86 | Non-Compliant | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | * | e0 | Active | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090-FCSG325I | Microchip | Datasheet | 2232 |
| Min: 1 Mult: 1 | Through Hole | 325-TFBGA, FCBGA | YES | 20 | 325-FCBGA (11x13.5) | -- | 325 | -- | Brass | FR4 Epoxy Glass | M2S090 | -- | 64 kB | MICROSEMI CORP | - | - | -- | Microsemi Corporation | M2S090-FCSG325I | 166 MHz | Microchip Technology | 3 | SMD/SMT | 180 | 86316 LE | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | 40 | 5.74 | Yes | 1.26 V | 1.14 V | 1.2 V | -- | Correct-A-Chip® 352000 | e1 | Active | -- | Solder | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | 1A | 0.050 (1.27mm) | R-PBGA-B325 | 180 | Not Qualified | Tin-Lead | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 180 | 1.16 mm | FIELD PROGRAMMABLE GATE ARRAY | 0.125 (3.18mm) | 0.100 (2.54mm) | PLCC | DIP, 0.3 (7.62mm) Row Spacing | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | -- | 13.5 mm | 11 mm | -- | -- | -- | ||||||||||||||||||||||||||||||||
| Mfr Part No XCZU2CG-2SFVA625E | AMD | Datasheet | 416 | - | Min: 1 Mult: 1 | Panel Mount, Bulkhead | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | XCZU2 | AMD | 180 | Tray | Active | 0°C ~ 100°C (TJ) | USBF TV | Active | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | USB - A, Receptacle | USB - A, Receptacle | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - |
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XCZU2EG-L1SBVA484I
AMD
Package:Embedded - System On Chip (SoC)
468.910824
-
XCZU7CG-2FFVC1156I
AMD
Package:Embedded - System On Chip (SoC)
4,569.749859
-
XCZU3CG-L1SBVA484I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050T-1VFG400I
Microchip
Package:Embedded - System On Chip (SoC)
250.472089
-
XCZU2CG-L1SFVC784I
AMD
Package:Embedded - System On Chip (SoC)
360.713541
-
XCZU11EG-1FFVF1517I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XAZU2EG-1SFVA625I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XAZU3EG-1SFVA625I
AMD
Package:Embedded - System On Chip (SoC)
618.413792
-
XCZU11EG-3FFVB1517E
AMD
Package:Embedded - System On Chip (SoC)
7,762.165265
-
XCZU4EV-1SFVC784I
AMD
Package:Embedded - System On Chip (SoC)
1,412.369921
-
XCZU17EG-2FFVE1924I
AMD
Package:Embedded - System On Chip (SoC)
8,260.814881
-
XCZU5CG-2FBVB900E
AMD
Package:Embedded - System On Chip (SoC)
2,585.917479
-
M2S025-VF400
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-1FCSG325
Microchip
Package:Embedded - System On Chip (SoC)
202.979432
-
XCVE1752-1LLIVSVA1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFB019R25A2E2V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS027E4F29E3LG
ALTERA
Package:Embedded - System On Chip (SoC)
1,247.707348
-
M2S010TS-FG484
Microchip
Package:Embedded - System On Chip (SoC)
102.993781
-
M2S090-FCSG325I
Microchip
Package:Embedded - System On Chip (SoC)
367.565984
-
XCZU2CG-2SFVA625E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire