The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Contact Shape | Shell Material | Supplier Device Package | Weight | Insert Material | Number of Terminals | Base Product Number | Brand | Contact Sizes | Data RAM Size | Device Logic Units | Dim | Factory colour | Factory Pack QuantityFactory Pack Quantity | I/O Voltage | Ihs Manufacturer | Instruction Set Architecture | Interface Type | L1 Cache Data Memory | L1 Cache Instruction Memory | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Number of User I/Os | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of CPU Cores | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Usage Level | Voltage Rated | Wireless charging | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Temperature Coefficient | Connector Type | Type | Number of Positions | Terminal Finish | Applications | HTS Code | Capacitance | Fastening Type | Subcategory | Contact Type | Technology | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Depth | Reach Compliance Code | Shell Finish | Pin Count | Shell Size - Insert | JESD-30 Code | Number of Outputs | Qualification Status | Housing Color | Operating Supply Voltage | Failure Rate | Lead Spacing | Power Supplies | Temperature Grade | Note | Interface | Speed | RAM Size | Shell Size, MIL | Lead Style | Core Processor | Peripherals | Program Memory Size | Connectivity | Family | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Product Type | Includes | Screening Level | Speed Grade | Primary Attributes | Number of Registers | Number of Logic Cells | Number of Cores | Flash Size | Features | Product Category | Height | Height Seated (Max) | Length | Width | Thickness (Max) | Material Flammability Rating | Ratings |
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 | Mfr Part No XCVM1302-3HSEVFVB1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | Xilinx | + 100 C | 0 C | SOC - Systems on a Chip | 880 mV | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1502-2LSEVFVC1760 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | 1 | Xilinx | + 110 C | 0 C | SOC - Systems on a Chip | 700 mV | System-On-Modules - SOM | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1302-1MSEVFVB1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | Xilinx | + 100 C | 0 C | SOC - Systems on a Chip | 800 mV | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1502-1LSIVFVB1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | Xilinx | + 110 C | - 40 C | SOC - Systems on a Chip | 700 mV | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1502-1MLIVFVB1369 | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Xilinx | Xilinx | + 110 C | - 40 C | SOC - Systems on a Chip | 800 mV | System-On-Modules - SOM | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-FGG896ES | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Phoenix Contact | 1935297 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-1FGG484 | Microchip | Datasheet | 1925 | - | Min: 1 Mult: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S025 | 64 kB | MICROSEMI CORP | - | - | Cutler Hammer, Div of Eaton Co | 10250T436H621 | 166 MHz | Microchip Technology | 3 | SMD/SMT | 267 | 27696 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.78 | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSXFC6C6U23I7NTS | ALTERA | Datasheet | 2178 | - | Min: 1 Mult: 1 | Free Hanging (In-Line) | - | Circular | Aluminum | - | D38999/26FD | 20 | Amphenol Aerospace Operations | Bulk | Active | -65°C ~ 200°C | Tray | Military, MIL-DTL-38999 Series III, Tri-Start™ TV | Active | Plug Housing | For Male Pins | 18 | Threaded | Crimp | N (Normal) | Unshielded | Environment Resistant | Electroless Nickel | 15-18 | Silver | Contacts Not Included | D | - | Backshell, Coupling Nut, Self Locking | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z045-3FFG676E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount, MLCC | 0603 (1608 Metric) | 676-FCBGA (27x27) | XC7Z045 | 1.2, 3.3 V | Thumb-2 | Lead free / RoHS Compliant | AMD | Surface Mount | 2 | 130 | Tray | Active | FCBGA | 200V | -55°C ~ 150°C | Tape & Reel (TR) | GA | 0.063 L x 0.032 W (1.60mm x 0.80mm) | ±2% | 1 (Unlimited) | C0G, NP0 | Automotive | 270pF | 676 | 1 V | - | - | 1GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Kintex™-7 FPGA, 350K Logic Cells | - | - | - | 0.038 (0.97mm) | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z045-1FBG676I | AMD | Datasheet | 496 |
| Min: 1 Mult: 1 | Through Hole | Radial, Disc | 676-FCBGA (27x27) | XC7Z045 | 1.2, 3.3 V | Thumb-2 | Lead free / RoHS Compliant | AMD | 2 | 130 | Tray | Active | FCBGA | 400VAC | -30°C ~ 125°C | Bulk | Cera-Mite 125L | 0.563 Dia (14.30mm) | ±20% | 1 (Unlimited) | Y5V (F) | Safety | 10000pF | 676 | 1 V | - | 0.374 (9.50mm) | 667MHz | 256KB | Straight | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Kintex™-7 FPGA, 350K Logic Cells | - | - | 0.689 (17.50mm) | - | X1, Y4 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z020-L1CLG484I | AMD | Datasheet | 1937 |
| Min: 1 Mult: 1 | Surface Mount, MLCC | 1812 (4532 Metric) | 484-CSPBGA (19x19) | XC7Z020 | Lead free / RoHS Compliant | 1.05 V | AMD | 0.95 V | 130 | Tray | Active | 1 V | 50V | -55°C ~ 150°C | Tape & Reel (TR) | GA | 0.177 L x 0.126 W (4.50mm x 3.20mm) | ±20% | 1 (Unlimited) | X7R | Automotive | 0.056µF | - | - | 667MHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1L | Artix™-7 FPGA, 85K Logic Cells | - | - | - | 0.086 (2.18mm) | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z100-1FFG1156I | AMD | Datasheet | 583 |
| Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | XC7Z100 | 1.5, 2, 2.5 V | RISC | CAN/I2C/SPI/UART | AMD | Surface Mount | 2 | 250 | Tray | Active | FBGA | -40 to 100 °C | Zynq®-7000 | 1156 | 1, 1.8 V | CAN/I2C/SPI/UART | 667MHz | 256 KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Kintex™-7 FPGA, 444K Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z030-1FFG676C | AMD | Datasheet | 2094 |
| Min: 1 Mult: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | XC7Z030 | 1.2, 3.3 V | Thumb-2 | AMD | Surface Mount | 130 | Tray | Active | FCBGA | 0 to 85 °C | Zynq®-7000 | 676 | 1 V | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Kintex™-7 FPGA, 125K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z035-1FFG676C | AMD | Datasheet | 574 |
| Min: 1 Mult: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | XC7Z035 | 275,000 | 130 | 1.05 V | AMD | 0.95 V | 130 | Tray | Active | 1.0000 V | Commercial grade | 0 to 85 °C | Zynq®-7000 | 667MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | XC7Z035 | MCU, FPGA | Commercial | 1 | Kintex™-7 FPGA, 275K Logic Cells | 343,800 | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-TQ144I | Microchip | Datasheet | 2142 | - | Min: 1 Mult: 1 | 144-LQFP | YES | 144-TQFP (20x20) | 4400g | 144 | (W x H x D) 348 x 100 x 289 mm | Black | MICROSEMI CORP | Microsemi Corporation | M2S005S-TQ144I | Microchip Technology | 3 | 84 | Tray | PLASTIC/EPOXY | LFQFP | TQFP-144 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | Obsolete | 30 | 5.88 | No | 1.26 V | 1.14 V | 1.2 V | No | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | QUAD | GULL WING | 240 | 0.5 mm | 289mm | not_compliant | S-PQFP-G144 | 84 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 84 | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | 100m | 20 mm | 348mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3CG-2SBVA484I | AMD | Datasheet | 565 | - | Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | XCZU3 | 154,350 | 82 | 0.892 V | AMD | 0.808 V | 82 | Tray | Active | FCBGA | 0.8500 V | Industrial grade | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 484 | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 2 | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-FGG676 | Microchip | Datasheet | 2044 |
| Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 676-BGA | 676-FBGA (27x27) | M2S060 | 64 kB | - | - | 166 MHz | Microchip Technology | 387 | 56520 LE | Tray | Active | Non-Compliant | 1.2000 V | 0 to 85 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | STD | FPGA - 60K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU11EG-2FFVF1517E | AMD | Datasheet | 710 |
| Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU11 | AMD | 464 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010TS-1FGG484T2 | Microchip | Datasheet | 1986 |
| Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S010 | MICROSEMI CORP | Microsemi Corporation | M2S010TS-1FGG484T2 | Microchip Technology | 233 | Tray | Active | Active | 40 | 5.81 | Yes | 1.2000 V | 0 to 85 °C | Automotive, AEC-Q100, SmartFusion®2 | e1 | Yes | Tin/Silver/Copper (Sn/Ag/Cu) | 250 | compliant | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 10K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090TS-1FGG676T2 | Microchip | Datasheet | 1673 | - | Min: 1 Mult: 1 | 676-BGA | 676-FBGA (27x27) | M2S090 | Microchip Technology | 425 | Tray | Active | 1.2000 V | 0 to 85 °C | Automotive, AEC-Q100, SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 90K Logic Modules | 512KB |
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XCVM1302-3HSEVFVB1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1502-2LSEVFVC1760
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1302-1MSEVFVB1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1502-1LSIVFVB1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVM1502-1MLIVFVB1369
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S050T-FGG896ES
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S025-1FGG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5CSXFC6C6U23I7NTS
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z045-3FFG676E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z045-1FBG676I
AMD
Package:Embedded - System On Chip (SoC)
1,526.015842
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XC7Z020-L1CLG484I
AMD
Package:Embedded - System On Chip (SoC)
175.363397
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XC7Z100-1FFG1156I
AMD
Package:Embedded - System On Chip (SoC)
3,237.032592
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XC7Z030-1FFG676C
AMD
Package:Embedded - System On Chip (SoC)
372.452455
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XC7Z035-1FFG676C
AMD
Package:Embedded - System On Chip (SoC)
1,308.915833
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M2S005S-TQ144I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU3CG-2SBVA484I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060-FGG676
Microchip
Package:Embedded - System On Chip (SoC)
200.009701
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XCZU11EG-2FFVF1517E
AMD
Package:Embedded - System On Chip (SoC)
5,593.021376
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M2S010TS-1FGG484T2
Microchip
Package:Embedded - System On Chip (SoC)
148.672748
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M2S090TS-1FGG676T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire