The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
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- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Contact Shape | Shell Material | Supplier Device Package | Housing Material | Weight | Insert Material | Number of Terminals | Material Type | Approvals | Base Product Number | Contact Finish Mating | Contact Sizes | Data RAM Size | Dim | Factory colour | I/O Voltage | Ihs Manufacturer | Instruction Set Architecture | Insulation Class | L1 Cache Data Memory | L1 Cache Instruction Memory | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of CPU Cores | Number of I/Os | Number of Logic Elements | Number of Outlets | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Primary Material | Product Status | Reflow Temperature-Max (s) | Risk Rank | Rohs Code | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Voltage Rated | Voltage, Rating | Wireless charging | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Termination | Temperature Coefficient | Connector Type | Type | Number of Positions | Terminal Finish | Color | Applications | HTS Code | Capacitance | Fastening Type | Subcategory | Contact Type | Current Rating (Amps) | Technology | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Depth | Reach Compliance Code | Shell Finish | Pin Count | Shell Size - Insert | JESD-30 Code | Number of Outputs | Qualification Status | Housing Color | Operating Supply Voltage | Failure Rate | Lead Spacing | Power Supplies | Temperature Grade | Note | Speed | RAM Size | Shell Size, MIL | Lead Style | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Adhesive | Includes | Speed Grade | Legend | Primary Attributes | Quantity | Number of Logic Cells | Number of Cores | Background Color | VA Rating | Flash Size | Text Color | Language | Features | Phase | IP Rating | Height | Height Seated (Max) | Length | Width | Thickness (Max) | Contact Finish Thickness - Mating | Material Flammability Rating | Ratings |
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 | Mfr Part No XCZU19EG-1FFVD1760I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Free Hanging (In-Line) | 1760-BBGA, FCBGA | - | Circular | Aluminum Alloy | 1760-FCBGA (42.5x42.5) | Plastic | KJB6T | 22D | ITT Cannon, LLC | 308 | Bulk | Active | -65°C ~ 175°C | KJB | Plug Housing | For Male Pins | 6 | Threaded | Crimp | C | Shielded | Environment Resistant | Cadmium over Electroless Nickel | 9-35 | Olive Drab | Contacts Not Included | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | Coupling Nut | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU5EV-2FBVB900I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU5 | PEI-Genesis | 204 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU47DR-L2FSVG1517I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Free Hanging (In-Line) | 1517-BBGA, FCBGA | - | Aluminum Alloy | 1517-FCBGA (40x40) | CA310 | Silver | ITT Cannon, LLC | 561 | Bulk | Metal | Active | 50V | -55°C ~ 125°C | MIL-DTL-5015, CA-B | Solder Cup | Plug, Female Sockets | 5 | Olive Drab | Reverse Bayonet Lock | 41A, 245A | N (Normal) | - | IP67 - Dust Tight, Waterproof | Olive Drab Cadmium | 32-1 | 533MHz, 1.333GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | - | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1802-1LSEVIVA1596 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA, FCBGA | 1596-FCBGA (40x40) | AMD | 500 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA012R24C2I1V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB006R24C3E4X | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 576 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS460TS-1FCG1152IPP | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | Microchip Technology | MCU - 136, FPGA - 468 | Tray | Active | -40°C ~ 100°C | * | Active | - | 3.95MB | RISC-V | DMA, PCI, PWM | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 461K Logic Modules | 128kB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z045-3FFG676E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount, MLCC | 0603 (1608 Metric) | 676-FCBGA (27x27) | XC7Z045 | 1.2, 3.3 V | Thumb-2 | Lead free / RoHS Compliant | AMD | Surface Mount | 2 | 130 | Tray | Active | FCBGA | 200V | -55°C ~ 150°C | Tape & Reel (TR) | GA | 0.063 L x 0.032 W (1.60mm x 0.80mm) | ±2% | 1 (Unlimited) | C0G, NP0 | Automotive | 270pF | 676 | 1 V | - | - | 1GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Kintex™-7 FPGA, 350K Logic Cells | - | - | - | 0.038 (0.97mm) | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z045-1FBG676I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Through Hole | Radial, Disc | 676-FCBGA (27x27) | XC7Z045 | 1.2, 3.3 V | Thumb-2 | Lead free / RoHS Compliant | AMD | 2 | 130 | Tray | Active | FCBGA | 400VAC | -30°C ~ 125°C | Bulk | Cera-Mite 125L | 0.563 Dia (14.30mm) | ±20% | 1 (Unlimited) | Y5V (F) | Safety | 10000pF | 676 | 1 V | - | 0.374 (9.50mm) | 667MHz | 256KB | Straight | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32 Bit | Kintex™-7 FPGA, 350K Logic Cells | - | - | 0.689 (17.50mm) | - | X1, Y4 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z020-L1CLG484I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount, MLCC | 1812 (4532 Metric) | 484-CSPBGA (19x19) | XC7Z020 | Lead free / RoHS Compliant | 1.05 V | AMD | 0.95 V | 130 | Tray | Active | 1 V | 50V | -55°C ~ 150°C | Tape & Reel (TR) | GA | 0.177 L x 0.126 W (4.50mm x 3.20mm) | ±20% | 1 (Unlimited) | X7R | Automotive | 0.056µF | - | - | 667MHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1L | Artix™-7 FPGA, 85K Logic Cells | - | - | - | 0.086 (2.18mm) | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-TQ144I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 144-LQFP | YES | 144-TQFP (20x20) | 4400g | 144 | (W x H x D) 348 x 100 x 289 mm | Black | MICROSEMI CORP | Microsemi Corporation | M2S005S-TQ144I | Microchip Technology | 3 | 84 | Tray | PLASTIC/EPOXY | LFQFP | TQFP-144 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | Obsolete | 30 | 5.88 | No | 1.26 V | 1.14 V | 1.2 V | No | -40°C ~ 100°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | QUAD | GULL WING | 240 | 0.5 mm | 289mm | not_compliant | S-PQFP-G144 | 84 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 84 | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | 100m | 20 mm | 348mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3CG-2SFVC784I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU3 | AMD | 252 | Bulk | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050T-FGG896ES | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Phoenix Contact | 1935297 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-1FGG484 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S025 | 64 kB | MICROSEMI CORP | - | - | Cutler Hammer, Div of Eaton Co | 10250T436H621 | 166 MHz | Microchip Technology | 3 | SMD/SMT | 267 | 27696 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.78 | Yes | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B484 | 267 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 25K Logic Modules | 27696 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA006R24C2E4X | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | CSA, UL | Class H | Hammond Power Solutions | C1F007WES | Intel | Wall | 576 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | Distribution | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 573K Logic Elements | 7,500 VA | - | 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1802-2LSEVSVA2197 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 2197-BFBGA, FCBGA | 2197-FCBGA (45x45) | Miscellaneous | AMD | 770 | Tray | Active | 0°C ~ 100°C (TJ) | Versal™ AI Core | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA022R31C2E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Aluminum | Grace Technologies | P-P22#2R2-M3RUV0 | Intel | 720 | (2) Universal International Receptacles | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | IP65 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU5EG-L2FBVB900E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | Plastic | XCZU5 | Brady | 41700 | AMD | 204 | Tray | Not For New Designs | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | Pipe & Valve Marking | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | No | Air | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | 0 | Green | - | White | English | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1502-2MLINSVG1369 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | AMD | 478 | Tray | Active | Versal™ AI Core | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 800k Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z045-3FFV676E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 676-BBGA, FCBGA | 676-FCBGA (27x27) | AMD | 130 | Bulk | Obsolete | 0°C ~ 100°C (TJ) | Zynq®-7000 | 1GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 350K Logic Cells | - |
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XCZU19EG-1FFVD1760I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU5EV-2FBVB900I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU47DR-L2FSVG1517I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1802-1LSEVIVA1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA012R24C2I1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB006R24C3E4X
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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MPFS460TS-1FCG1152IPP
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z045-3FFG676E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z045-1FBG676I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z020-L1CLG484I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S005S-TQ144I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU3CG-2SFVC784I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S050T-FGG896ES
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025-1FGG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA006R24C2E4X
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1802-2LSEVSVA2197
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA022R31C2E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU5EG-L2FBVB900E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCVC1502-2MLINSVG1369
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XC7Z045-3FFV676E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire