The category is 'Embedded - System On Chip (SoC)'
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- Package / Case
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- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mount | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Number of Pins | Supplier Device Package | Material | Dielectric Material | Weight | Number of Terminals | End Contact Material | End Contact Plating | Accessory | Base Product Number | Brand | Clock Frequency-Max | Coil Voltage-Nom | CoilResistance | Data RAM Size | ElectricalLife | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Lead Free Status / RoHS Status | Manufacturer | Manufacturer Part Number | Mated Stacking Heights | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/O Lines | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Spare part | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Type of accessory/spare part | Voltage Rating (DC) | Voltage Rating AC | Voltage Rating DC | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | Temperature Coefficient | Connector Type | Type | Resistance | Number of Positions | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | Applications | Number of Rows | Power (Watts) | Additional Feature | HTS Code | Capacitance | Subcategory | Pitch | Packing Method | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Depth | Reach Compliance Code | Frequency | Base Part Number | Output | Reference Standard | Contact Finish | JESD-30 Code | Number of Outputs | Qualification Status | Case Code (Metric) | Body Length or Diameter | Case Code (Imperial) | Body Breadth | Physical Dimension | Operating Supply Voltage | Dielectric | Failure Rate | Lead Spacing | Power Supplies | Contact Resistance | Temperature Grade | Insulation Resistance | Contact Current(DC)-Max | Interface | Contact Voltage(DC)-Max | Termination Type | Memory Size | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Number of Bits | Core Processor | Peripherals | Program Memory Size | Connectivity | Bit Size | Reset | Has ADC | DMA Channels | Architecture | Voltage - Threshold | Number of Voltages Monitored | PWM Channels | Reset Timeout | Number of Inputs | Organization | DAC Channels | Seated Height-Max | Number of Ways | Programmable Logic Type | Relay Type | Number of Logic Elements/Cells | Product Type | Contact Current(AC)-Max | Operate Time | Release Time | Core Architecture | Coil Power | Contact Voltage(AC)-Max | Contact/Output Supply Type | Relay Action | Coil/Input Supply Type | Speed Grade | PCB Hole Count | Primary Attributes | Number of CLBs | Number of Logic Cells | ROM Programmability | Number of Cores | Dielectric Strength Between Open Contacts | Input Switching Control Type | Dielectric Strength Between Coil and Contacts | Relay Function | Flash Size | Coil Voltage(DC)-Max | Coil Current(DC)-Max | Relay Form | Coil Operate Voltage(DC) | Coil Release Voltage(DC) | Features | Product Category | IP Rating | Height | Height Seated (Max) | Length | Width | Contact Finish Thickness | Thickness | Body Height | Height Above Board | Radiation Hardening | Ratings |
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 | Mfr Part No XCZU9CG-1FFVB1156E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | SC-74A, SOT-753 | SOT-25-5 | XC6124 | Torex Semiconductor Ltd | 328 | Tape & Reel (TR) | Active | -40°C ~ 85°C (TA) | - | Watchdog Circuit | Open Drain or Open Collector | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Active Low | MCU, FPGA | 1.8V | 1 | 400ms Typical | 1 | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA012R24B2I3E | Intel | Datasheet | 569 |
| Min: 1 Mult: 1 | - | - | DIV43E19 | TE Connectivity Deutsch Connectors | 768 | Bag | Active | -40°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU19EG-3FFVB1517E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | SEAM8-30 | 10mm | Samtec Inc. | 644 | Strip | Active | 0°C ~ 100°C (TJ) | SEARAY™ SEAM | High Density Array, Male | 300 | 10 | 0.031 (0.80mm) | Gold | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | Board Guide | 30.0µin (0.76µm) | 0.297 (7.54mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z010-2CLG400E | AMD | Datasheet | 37 | - | Min: 1 Mult: 1 | 400-LFBGA, CSPBGA | 400-CSPBGA (17x17) | XC7Z010 | AMD | 130 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq®-7000 | 766MHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Artix™-7 FPGA, 28K Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB027R24C3E4X | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB014R24C2E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | Non-Compliant | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU48DR-1FSVG1517E | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | AMD Xilinx | 561 | Active | 0°C ~ 100°C (TJ) | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU15EG-L2FFVC900E | AMD | Datasheet | 541 |
| Min: 1 Mult: 1 | Through Hole | Radial | 900-FCBGA (31x31) | Polypropylene (PP), Metallized | XCZU15 | -- | AMD | 204 | Tray | Active | 900V | 2500V (2.5kV) | -55°C ~ 110°C | Tray | MKP385 | 1.024 L x 0.236 W (26.00mm x 6.00mm) | ±5% | Active | -- | PC Pins | DC Link, DC Filtering; High Frequency, Switching; High Pulse, DV/DT | 620pF | 0.886 (22.50mm) | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | -- | 0.472 (12.00mm) | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EV-3FFVC1156E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | XCZU7 | AMD | 360 | Tray | Active | Compliant | 100 V | 100 V | 0°C ~ 100°C (TJ) | Tape & Reel | Zynq® UltraScale+™ MPSoC EV | SMD/SMT | 125 °C | -55 °C | 4.3 pF | 810 µm | 1608 | 0603 | C0G | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | 1.6 mm | 812.8 µm | 889 µm | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No NRF52832-QFWC-R | Nordic | Datasheet | - | - | Min: 1 Mult: 1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5ASTFD5G3F35I3N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | INTEL CORP | Intel Corporation | 5ASTFD5G3F35I3N | MCU - 208, FPGA - 385 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | End Of Life | NOT SPECIFIED | 5.29 | Yes | 1.18 V | 1.12 V | 1.15 V | -40°C ~ 100°C (TJ) | Tray | Arria V ST | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5ASTFD5 | S-PBGA-B1152 | 385 | INDUSTRIAL | 1.05GHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 385 | 17434 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 462K Logic Elements | 17434 | 462000 | -- | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA4U19C7SN | ALTERA | Datasheet | 39 |
| Min: 1 Mult: 1 | 484-FBGA | YES | 484-UBGA (19x19) | 484 | INTEL CORP | Intel Corporation | 5CSEBA4U19C7SN | MCU - 151, FPGA - 66 | 85 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 5.58 | Yes | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | Active | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | S-PBGA-B484 | 66 | Not Qualified | 1.1,1.2/3.3,2.5 V | OTHER | 800MHz | 64KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | 1.9 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 40K Logic Elements | 40000 | -- | 19 mm | 19 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS027H2F35E1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | 3Z4S-LE | Omron Automation and Safety | 384 | Bulk | Active | Non-Compliant | 0°C ~ 100°C (TJ) | Tray | * | Discontinued at Digi-Key | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 270K Logic Elements | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS066H2F34I1HG | ALTERA | Datasheet | 740 |
| Min: 1 Mult: 1 | Axial | Axial | RN55 | Intel / Altera | - | 24 | 2 x 32 kB | 2 x 32 kB | Intel | 1.2 GHz | + 100 C | Vishay Dale | - 40 C | Yes | SMD/SMT | 492 | 82500 LAB | 660000 LE | Bulk | 965020 | Active | Details | This product may require additional documentation to export from the United States. | Arria 10 SoC | -65°C ~ 175°C | Tray | Military, MIL-R-10509/7, RN55 | 0.090 Dia x 0.240 L (2.29mm x 6.10mm) | ±1% | Active | 2 | ±50ppm/°C | 69.8 Ohms | Metal Film | 0.125W, 1/8W | SOC - Systems on a Chip | 950 mV | - | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | FPGA - 660K Logic Elements | 2 Core | -- | Flame Retardant Coating, Military, Moisture Resistant, Safety | SoC FPGA | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU46DR-L1FSVH1760I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | AMD | 574 | Tray | Active | Non-Compliant | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ RFSoC | 500MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVC1802-2LSEVSVD1760 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BFBGA, FCBGA | 1760-FCBGA (40x40) | 100026 | Molex | 692 | Bulk | Last Time Buy | 0°C ~ 100°C (TJ) | * | 450MHz, 1.08GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1.5M Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA2U23C7SN | ALTERA | Datasheet | 28 |
| Min: 1 Mult: 1 | Surface Mount | 672-FBGA | 672 | 672-UBGA (23x23) | MCU - 181, FPGA - 145 | Compliant | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | Active | 85 °C | 0 °C | 800 MHz | 1.1 V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.5 MB | 800MHz | 64KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 25000 | ARM | FPGA - 25K Logic Elements | -- | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No LH79525N0Q100A1557 | NXP | Datasheet | - | - | Min: 1 Mult: 1 | YES | SURFACE MOUNT-STRAIGHT | 1.9 | 10 | Silver Alloy | GOLD ALLOY | 60 MHz | 4.5 | 145 | 100000 | NXP SEMICONDUCTORS | NXP Semiconductors | LH79525N0Q100A1,557 | 73 | 85 | -40 | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | 5.79 | Non-Compliant | 3.6 V | 3 V | 3.3 V | ALSO REQUIRES 3.3 V I/O SUPPLY | TUBE | CMOS | QUAD | GULL WING | 0.4 mm | unknown | CSA; UL | S-PQFP-G176 | 15 | 7.5 | 15mm x 7.5mm x 9mm | 75 | 1000000000 | 2 | 220 | SOLDER | 60 MHz | MICROCONTROLLER, RISC | 32 | 32 | YES | YES | YES | NO | 1.6 mm | POWER/SIGNAL RELAY | 2 | 2 | 1 | 140 | 250 | AC/DC | MOMENTARY | DC | 10 | FLASH | 1000 | Random | 1500 | DPDT | 4.5 | .03 | 2 FORM C | 3.38 | .45 | 20 mm | 20 mm | 9 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA014R24C3I3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Polycarbonate | Intel | 744 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | 2 | FPGA - 1.4M Logic Elements | - | IP66, IP67 | 355mm | 255mm | 122mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGIB022R31B2I3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Yes | Intel | 720 | Tray | Active | Yes | Cover | -40°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - |
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XCZU9CG-1FFVB1156E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFA012R24B2I3E
Intel
Package:Embedded - System On Chip (SoC)
11,260.488463
-
XCZU19EG-3FFVB1517E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z010-2CLG400E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFB027R24C3E4X
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFB014R24C2E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU48DR-1FSVG1517E
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU15EG-L2FFVC900E
AMD
Package:Embedded - System On Chip (SoC)
6,765.188990
-
XCZU7EV-3FFVC1156E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
NRF52832-QFWC-R
Nordic
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5ASTFD5G3F35I3N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSEBA4U19C7SN
ALTERA
Package:Embedded - System On Chip (SoC)
108.223997
-
10AS027H2F35E1SG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS066H2F34I1HG
ALTERA
Package:Embedded - System On Chip (SoC)
5,177.571531
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XCZU46DR-L1FSVH1760I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVC1802-2LSEVSVD1760
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSEBA2U23C7SN
ALTERA
Package:Embedded - System On Chip (SoC)
106.887053
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LH79525N0Q100A1557
NXP
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA014R24C3I3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGIB022R31B2I3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire