The category is 'Embedded - System On Chip (SoC)'

  • All Manufacturers
  • Packaging
  • Series
  • Package / Case
  • Number of I/Os
  • Architecture
  • Connectivity
  • Core Processor
  • Operating Temperature
  • Peripherals
  • Primary Attributes
  • RAM Size
  • Moisture Sensitivity Level (MSL)

Image

Part Number

Manufacturer

Datasheet

Availability

Pricing(USD)

Quantity

RoHS

Mount

Package / Case

Surface Mount

Number of Pins

Supplier Device Package

Number of Terminals

Base Product Number

Brand

Data RAM Size

Factory Pack QuantityFactory Pack Quantity

Ihs Manufacturer

L1 Cache Data Memory

L1 Cache Instruction Memory

Manufacturer

Manufacturer Part Number

Maximum Clock Frequency

Maximum Operating Temperature

Mfr

Minimum Operating Temperature

Moisture Sensitive

Moisture Sensitivity Levels

Mounting Styles

Number of I/Os

Number of Logic Array Blocks - LABs

Number of Logic Elements

Operating Temperature-Max

Operating Temperature-Min

Package

Package Body Material

Package Code

Package Description

Package Equivalence Code

Package Shape

Package Style

Part # Aliases

Part Life Cycle Code

Product Status

Reflow Temperature-Max (s)

Risk Rank

RoHS

Rohs Code

Shipping Restrictions

Supply Voltage-Max

Supply Voltage-Min

Supply Voltage-Nom

Tradename

Operating Temperature

Packaging

Series

Size / Dimension

Tolerance

JESD-609 Code

Part Status

Number of Terminations

Temperature Coefficient

Resistance

Terminal Finish

Max Operating Temperature

Min Operating Temperature

Composition

Power (Watts)

HTS Code

Subcategory

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Terminal Pitch

Reach Compliance Code

Frequency

Base Part Number

JESD-30 Code

Number of Outputs

Qualification Status

Operating Supply Voltage

Failure Rate

Power Supplies

Temperature Grade

Interface

Memory Size

Speed

RAM Size

Core Processor

Peripherals

Program Memory Size

Connectivity

Architecture

Number of Inputs

Organization

Seated Height-Max

Programmable Logic Type

Number of Logic Elements/Cells

Product Type

Core Architecture

Primary Attributes

Number of CLBs

Number of Logic Cells

Number of Cores

Flash Size

Features

Product Category

Height Seated (Max)

Length

Width

Ratings

AGFB027R24C3E4X

Mfr Part No

AGFB027R24C3E4X

Intel Datasheet

-

-

Min: 1

Mult: 1

-

-

Intel

744

Tray

Active

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.7M Logic Elements

-

AGFB014R24C2E3E

Mfr Part No

AGFB014R24C2E3E

Intel Datasheet

-

-

Min: 1

Mult: 1

-

-

Intel

744

Tray

Active

Non-Compliant

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.4M Logic Elements

-

AGFA012R24C2I3V

Mfr Part No

AGFA012R24C2I3V

Intel Datasheet

-

-

Min: 1

Mult: 1

-

-

Intel

744

Tray

Active

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.2M Logic Elements

-

1SX065HH1F35E2LG

Mfr Part No

1SX065HH1F35E2LG

Intel Datasheet

-

-

Min: 1

Mult: 1

1152-BBGA, FCBGA

1152-FBGA (35x35)

Intel

392

Tray

Active

0°C ~ 100°C (TJ)

Stratix® 10 SX

1.5GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 650K Logic Elements

-

10AS066H2F34I1HG

Mfr Part No

10AS066H2F34I1HG

ALTERA Datasheet

-

-

Min: 1

Mult: 1

Axial

Axial

RN55

Intel / Altera

-

24

2 x 32 kB

2 x 32 kB

Intel

1.2 GHz

+ 100 C

Vishay Dale

- 40 C

Yes

SMD/SMT

492

82500 LAB

660000 LE

Bulk

965020

Active

Details

This product may require additional documentation to export from the United States.

Arria 10 SoC

-65°C ~ 175°C

Tray

Military, MIL-R-10509/7, RN55

0.090 Dia x 0.240 L (2.29mm x 6.10mm)

±1%

Active

2

±50ppm/°C

69.8 Ohms

Metal Film

0.125W, 1/8W

SOC - Systems on a Chip

950 mV

-

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

SoC FPGA

FPGA - 660K Logic Elements

2 Core

--

Flame Retardant Coating, Military, Moisture Resistant, Safety

SoC FPGA

-

10AS027H2F35E1SG

Mfr Part No

10AS027H2F35E1SG

ALTERA Datasheet

-

-

Min: 1

Mult: 1

1152-BBGA, FCBGA

1152-FBGA (35x35)

3Z4S-LE

Omron Automation and Safety

384

Bulk

Active

Non-Compliant

0°C ~ 100°C (TJ)

Tray

*

Discontinued at Digi-Key

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

FPGA - 270K Logic Elements

--

5CSEBA2U23C7SN

Mfr Part No

5CSEBA2U23C7SN

ALTERA Datasheet

-

-

Min: 1

Mult: 1

Surface Mount

672-FBGA

672

672-UBGA (23x23)

MCU - 181, FPGA - 145

Compliant

0°C ~ 85°C (TJ)

Tray

Cyclone® V SE

Active

85 °C

0 °C

800 MHz

1.1 V

CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB

1.5 MB

800MHz

64KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

25000

ARM

FPGA - 25K Logic Elements

--

AGFB023R25A1I1V

Mfr Part No

AGFB023R25A1I1V

Intel Datasheet

-

-

Min: 1

Mult: 1

-

-

Intel

480

Tray

Active

Non-Compliant

-40°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.3M Logic Elements

-

AGID019R18A2E2V

Mfr Part No

AGID019R18A2E2V

Intel Datasheet

-

-

Min: 1

Mult: 1

-

-

Intel

480

Tray

Active

0°C ~ 100°C (TJ)

Agilex I

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.9M Logic Elements

-

5ASTFD5G3F35I3N

Mfr Part No

5ASTFD5G3F35I3N

ALTERA Datasheet

-

-

Min: 1

Mult: 1

1152-BBGA, FCBGA

YES

1152-FBGA (35x35)

1152

INTEL CORP

Intel Corporation

5ASTFD5G3F35I3N

MCU - 208, FPGA - 385

100 °C

-40 °C

PLASTIC/EPOXY

BGA

FBGA-1152

BGA1152,34X34,40

SQUARE

GRID ARRAY

End Of Life

NOT SPECIFIED

5.29

Yes

1.18 V

1.12 V

1.15 V

-40°C ~ 100°C (TJ)

Tray

Arria V ST

e1

Active

Tin/Silver/Copper (Sn/Ag/Cu)

8542.39.00.01

BOTTOM

BALL

NOT SPECIFIED

1 mm

compliant

5ASTFD5

S-PBGA-B1152

385

INDUSTRIAL

1.05GHz

64KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

385

17434 CLBS

2.7 mm

FIELD PROGRAMMABLE GATE ARRAY

FPGA - 462K Logic Elements

17434

462000

--

35 mm

35 mm

5CSEBA4U19C7SN

Mfr Part No

5CSEBA4U19C7SN

ALTERA Datasheet

-

-

Min: 1

Mult: 1

484-FBGA

YES

484-UBGA (19x19)

484

INTEL CORP

Intel Corporation

5CSEBA4U19C7SN

MCU - 151, FPGA - 66

85 °C

PLASTIC/EPOXY

FBGA

FBGA, BGA484,22X22,32

BGA484,22X22,32

SQUARE

GRID ARRAY, FINE PITCH

Active

NOT SPECIFIED

5.58

Yes

1.13 V

1.07 V

1.1 V

0°C ~ 85°C (TJ)

Tray

Cyclone® V SE

Active

8542.39.00.01

Field Programmable Gate Arrays

CMOS

BOTTOM

BALL

NOT SPECIFIED

0.8 mm

compliant

S-PBGA-B484

66

Not Qualified

1.1,1.2/3.3,2.5 V

OTHER

800MHz

64KB

Single ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

66

1.9 mm

FIELD PROGRAMMABLE GATE ARRAY

FPGA - 40K Logic Elements

40000

--

19 mm

19 mm

10AS022E4F29E3LG

Mfr Part No

10AS022E4F29E3LG

ALTERA Datasheet

-

-

Min: 1

Mult: 1

0805 (2012 Metric)

YES

0805

780

RN732A

Intel / Altera

-

1

INTEL CORP

2 x 32 kB

2 x 32 kB

Intel

10AS022E4F29E3LG

1.2 GHz

KOA Speer Electronics, Inc.

Yes

SMD/SMT

288

27500 LAB

220000 LE

100 °C

Tape & Reel (TR)

PLASTIC/EPOXY

BGA

BGA, BGA780,28X28,40

BGA780,28X28,40

SQUARE

GRID ARRAY

965042

Active

Obsolete

NOT SPECIFIED

5.46

Non-Compliant

Yes

This product may require additional documentation to export from the United States.

0.93 V

0.87 V

0.9 V

Arria 10 SoC

-55°C ~ 155°C

Tray

RN73

0.079 L x 0.049 W (2.00mm x 1.25mm)

±0.05%

Active

2

±10ppm/°C

2.84 kOhms

Thin Film

0.1W, 1/10W

8542.39.00.01

SOC - Systems on a Chip

CMOS

BOTTOM

BALL

NOT SPECIFIED

1 mm

compliant

S-PBGA-B780

288

Not Qualified

0.9 V

OTHER

1.5GHz

256KB

Dual ARM® Cortex®-A9 MPCore™ with CoreSight™

DMA, POR, WDT

-

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

288

3.35 mm

FIELD PROGRAMMABLE GATE ARRAY

SoC FPGA

FPGA - 220K Logic Elements

220000

2 Core

--

Moisture Resistant

SoC FPGA

0.024 (0.60mm)

29 mm

29 mm

PIMX8QX6AVLFZAA

Mfr Part No

PIMX8QX6AVLFZAA

NXP Datasheet

-

-

Min: 1

Mult: 1

1206 (3216 Metric)

1206

Vishay Dale

Tape & Reel (TR)

Active

-55°C ~ 125°C

TNPU e3

0.126 L x 0.063 W (3.20mm x 1.60mm)

±0.05%

2

±5ppm/°C

105 Ohms

Thin Film

0.25W, 1/4W

-

Anti-Sulfur, Automotive AEC-Q200, Moisture Resistant

0.026 (0.65mm)

AEC-Q200

M2S010S-1FGG484I

Mfr Part No

M2S010S-1FGG484I

Microchip Datasheet

-

-

Min: 1

Mult: 1

MICROSEMI CORP

Microsemi Corporation

M2S010S-1FGG484I

3

Active

30

5.77

Non-Compliant

Yes

e1

Tin/Silver/Copper (Sn/Ag/Cu)

250

compliant

FIELD PROGRAMMABLE GATE ARRAY

M2S150S-1FC1152I

Mfr Part No

M2S150S-1FC1152I

Microchip Datasheet

-

-

Min: 1

Mult: 1

AGFA022R25A2E4F

Mfr Part No

AGFA022R25A2E4F

Intel Datasheet

-

-

Min: 1

Mult: 1

-

-

Intel

624

Tray

Active

Non-Compliant

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.2M Logic Elements

-

XCZU19EG-2FFVE1924I

Mfr Part No

XCZU19EG-2FFVE1924I

AMD Datasheet

-

-

Min: 1

Mult: 1

1924-BBGA, FCBGA

1924-FCBGA (45x45)

XCZU19

AMD

668

Tray

Active

-40°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC EG

533MHz, 600MHz, 1.3GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

-

AGFB022R25A3E4X

Mfr Part No

AGFB022R25A3E4X

Intel Datasheet

-

-

Min: 1

Mult: 1

-

-

Intel

624

Tray

Active

Non-Compliant

0°C ~ 100°C (TJ)

Agilex F

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 2.2M Logic Elements

-

XCZU6CG-2FFVC900E

Mfr Part No

XCZU6CG-2FFVC900E

AMD Datasheet

-

-

Min: 1

Mult: 1

900-BBGA, FCBGA

900-FCBGA (31x31)

XCZU6

AMD

204

Tray

Active

0°C ~ 100°C (TJ)

Zynq® UltraScale+™ MPSoC CG

533MHz, 1.3GHz

256KB

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

DMA, WDT

CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MCU, FPGA

Zynq®UltraScale+™ FPGA, 469K+ Logic Cells

-

AGFA012R24B2I3V

Mfr Part No

AGFA012R24B2I3V

Intel Datasheet

-

-

Min: 1

Mult: 1

-

-

PEI-Genesis

768

Bulk

Active

-40°C ~ 100°C (TJ)

*

1.4GHz

256KB

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point

DMA, WDT

EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

MPU, FPGA

FPGA - 1.2M Logic Elements

-