The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Brand | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | JESD-609 Code | Part Status | Number of Terminations | Temperature Coefficient | Resistance | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Composition | Power (Watts) | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Failure Rate | Power Supplies | Temperature Grade | Interface | Memory Size | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Core Architecture | Primary Attributes | Number of CLBs | Number of Logic Cells | Number of Cores | Flash Size | Features | Product Category | Height Seated (Max) | Length | Width | Ratings |
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![]() | Mfr Part No AGFB027R24C3E4X | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFB014R24C2E3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | Non-Compliant | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFA012R24C2I3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 1SX065HH1F35E2LG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | Intel | 392 | Tray | Active | 0°C ~ 100°C (TJ) | Stratix® 10 SX | 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 650K Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS066H2F34I1HG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Axial | Axial | RN55 | Intel / Altera | - | 24 | 2 x 32 kB | 2 x 32 kB | Intel | 1.2 GHz | + 100 C | Vishay Dale | - 40 C | Yes | SMD/SMT | 492 | 82500 LAB | 660000 LE | Bulk | 965020 | Active | Details | This product may require additional documentation to export from the United States. | Arria 10 SoC | -65°C ~ 175°C | Tray | Military, MIL-R-10509/7, RN55 | 0.090 Dia x 0.240 L (2.29mm x 6.10mm) | ±1% | Active | 2 | ±50ppm/°C | 69.8 Ohms | Metal Film | 0.125W, 1/8W | SOC - Systems on a Chip | 950 mV | - | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | SoC FPGA | FPGA - 660K Logic Elements | 2 Core | -- | Flame Retardant Coating, Military, Moisture Resistant, Safety | SoC FPGA | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS027H2F35E1SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FBGA (35x35) | 3Z4S-LE | Omron Automation and Safety | 384 | Bulk | Active | Non-Compliant | 0°C ~ 100°C (TJ) | Tray | * | Discontinued at Digi-Key | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 270K Logic Elements | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 5CSEBA2U23C7SN | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount | 672-FBGA | 672 | 672-UBGA (23x23) | MCU - 181, FPGA - 145 | Compliant | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | Active | 85 °C | 0 °C | 800 MHz | 1.1 V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.5 MB | 800MHz | 64KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 25000 | ARM | FPGA - 25K Logic Elements | -- | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFB023R25A1I1V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | Non-Compliant | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGID019R18A2E2V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 5ASTFD5G3F35I3N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FBGA (35x35) | 1152 | INTEL CORP | Intel Corporation | 5ASTFD5G3F35I3N | MCU - 208, FPGA - 385 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | End Of Life | NOT SPECIFIED | 5.29 | Yes | 1.18 V | 1.12 V | 1.15 V | -40°C ~ 100°C (TJ) | Tray | Arria V ST | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5ASTFD5 | S-PBGA-B1152 | 385 | INDUSTRIAL | 1.05GHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 385 | 17434 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 462K Logic Elements | 17434 | 462000 | -- | 35 mm | 35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 5CSEBA4U19C7SN | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 484-FBGA | YES | 484-UBGA (19x19) | 484 | INTEL CORP | Intel Corporation | 5CSEBA4U19C7SN | MCU - 151, FPGA - 66 | 85 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 5.58 | Yes | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | Active | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | S-PBGA-B484 | 66 | Not Qualified | 1.1,1.2/3.3,2.5 V | OTHER | 800MHz | 64KB | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | 1.9 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 40K Logic Elements | 40000 | -- | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No 10AS022E4F29E3LG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 0805 (2012 Metric) | YES | 0805 | 780 | RN732A | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS022E4F29E3LG | 1.2 GHz | KOA Speer Electronics, Inc. | Yes | SMD/SMT | 288 | 27500 LAB | 220000 LE | 100 °C | Tape & Reel (TR) | PLASTIC/EPOXY | BGA | BGA, BGA780,28X28,40 | BGA780,28X28,40 | SQUARE | GRID ARRAY | 965042 | Active | Obsolete | NOT SPECIFIED | 5.46 | Non-Compliant | Yes | This product may require additional documentation to export from the United States. | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | -55°C ~ 155°C | Tray | RN73 | 0.079 L x 0.049 W (2.00mm x 1.25mm) | ±0.05% | Active | 2 | ±10ppm/°C | 2.84 kOhms | Thin Film | 0.1W, 1/10W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | S-PBGA-B780 | 288 | Not Qualified | 0.9 V | OTHER | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | 3.35 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | FPGA - 220K Logic Elements | 220000 | 2 Core | -- | Moisture Resistant | SoC FPGA | 0.024 (0.60mm) | 29 mm | 29 mm | ||||||||||||||||||||||
![]() | Mfr Part No PIMX8QX6AVLFZAA | NXP | Datasheet | - | - | Min: 1 Mult: 1 | 1206 (3216 Metric) | 1206 | Vishay Dale | Tape & Reel (TR) | Active | -55°C ~ 125°C | TNPU e3 | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±0.05% | 2 | ±5ppm/°C | 105 Ohms | Thin Film | 0.25W, 1/4W | - | Anti-Sulfur, Automotive AEC-Q200, Moisture Resistant | 0.026 (0.65mm) | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S010S-1FGG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | MICROSEMI CORP | Microsemi Corporation | M2S010S-1FGG484I | 3 | Active | 30 | 5.77 | Non-Compliant | Yes | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 250 | compliant | FIELD PROGRAMMABLE GATE ARRAY | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No M2S150S-1FC1152I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFA022R25A2E4F | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 624 | Tray | Active | Non-Compliant | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU19EG-2FFVE1924I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1924-BBGA, FCBGA | 1924-FCBGA (45x45) | XCZU19 | AMD | 668 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFB022R25A3E4X | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 624 | Tray | Active | Non-Compliant | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No XCZU6CG-2FFVC900E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU6 | AMD | 204 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr Part No AGFA012R24B2I3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | PEI-Genesis | 768 | Bulk | Active | -40°C ~ 100°C (TJ) | * | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - |
AGFB027R24C3E4X
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
AGFB014R24C2E3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
AGFA012R24C2I3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
1SX065HH1F35E2LG
Intel
Package:Embedded - System On Chip (SoC)
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10AS066H2F34I1HG
ALTERA
Package:Embedded - System On Chip (SoC)
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10AS027H2F35E1SG
ALTERA
Package:Embedded - System On Chip (SoC)
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5CSEBA2U23C7SN
ALTERA
Package:Embedded - System On Chip (SoC)
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AGFB023R25A1I1V
Intel
Package:Embedded - System On Chip (SoC)
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AGID019R18A2E2V
Intel
Package:Embedded - System On Chip (SoC)
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5ASTFD5G3F35I3N
ALTERA
Package:Embedded - System On Chip (SoC)
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5CSEBA4U19C7SN
ALTERA
Package:Embedded - System On Chip (SoC)
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10AS022E4F29E3LG
ALTERA
Package:Embedded - System On Chip (SoC)
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PIMX8QX6AVLFZAA
NXP
Package:Embedded - System On Chip (SoC)
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M2S010S-1FGG484I
Microchip
Package:Embedded - System On Chip (SoC)
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M2S150S-1FC1152I
Microchip
Package:Embedded - System On Chip (SoC)
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AGFA022R25A2E4F
Intel
Package:Embedded - System On Chip (SoC)
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XCZU19EG-2FFVE1924I
AMD
Package:Embedded - System On Chip (SoC)
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AGFB022R25A3E4X
Intel
Package:Embedded - System On Chip (SoC)
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XCZU6CG-2FFVC900E
AMD
Package:Embedded - System On Chip (SoC)
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AGFA012R24B2I3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
