The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Package / Case | Surface Mount | Supplier Device Package | Number of Terminals | # I/Os (Max) | Approvals | Base Product Number | Brand | Cable Types | Clock Frequency-Max | Data RAM Size | Device Logic Gates | Device Logic Units | Factory Pack QuantityFactory Pack Quantity | Family Name | Ihs Manufacturer | Jacket Material | L1 Cache Data Memory | L1 Cache Instruction Memory | Logic Cells | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Number of User I/Os | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Blocks/Elements | Number of Logic Elements | Operating Supply Voltage (Max) | Operating Supply Voltage (Min) | Operating Supply Voltage (Typ) | Operating Temp Range | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature Classification | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Package Type | Part Life Cycle Code | Process Technology | Product Status | Programmable | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Connector Type | Terminal Finish | Color | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Product Type | Screening Level | Speed Grade | Primary Attributes | Number of Registers | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Connection Type | Product Category | Strain Relief | Length | Width |
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 | Mfr Part No M2S025T-FGG484 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | M2S025 | Microchip Technology / Atmel | 64 kB | 60 | - | - | Microchip | 166 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | 0 C | Yes | SMD/SMT | 273 I/O | 2308 LAB | 27696 LE | Tray | Active | Details | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | SOC - Systems on a Chip | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | STD | FPGA - 25K Logic Modules | 1 Core | 256KB | SoC FPGA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XAZU4EV-L1SFVC784I | AMD | Datasheet | 655 | - | Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XAZU4 | 0.742 V | AMD | 0.698 V | 252 | Tray | Active | 0.7200 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EV | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1L | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010T-1FG484 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | M2S010 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S010T-1FG484 | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 3 | SMD/SMT | 233 | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | No | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 10K Logic Modules | 9744 | 1 Core | 256KB | 23 mm | 23 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150T-1FCV484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 484-BFBGA | 484-FBGA (19x19) | M2S150 | 64 kB | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | 273 | 146124 LE | Tray | Active | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 150K Logic Modules | 1 Core | 512KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010T-1VF400I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 400-LFBGA | YES | 400-VFBGA (17x17) | 400 | M2S010 | 64 kB | MICROSEMI CORP | - | - | Microsemi Corporation | M2S010T-1VF400I | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | SMD/SMT | 195 | 12084 LE | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.3 | No | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | S-PBGA-B400 | 160 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 160 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 10K Logic Modules | 9744 | 1 Core | 256KB | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7EG-1FFVC1156I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1156-BBGA, FCBGA | 1156-FCBGA (35x35) | XCZU7 | 0.892 V | AMD | 0.808 V | 360 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1 | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090T-1FGG676I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2S090 | MICROSEMI CORP | Microsemi Corporation | M2S090T-1FGG676I | Microchip Technology | 3 | 425 | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 5.78 | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 40 | S-PBGA-B676 | 425 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 90K Logic Modules | 86316 | 512KB | 27 mm | 27 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150-1FCG1152I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | 1152-FCBGA (35x35) | M2S150 | 64 kB | - | - | 166 MHz | Microchip Technology | SMD/SMT | 574 | 146124 LE | Tray | Active | 1.2000 V | -40 to 100 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 150K Logic Modules | 1 Core | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010TS-1VFG400T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 400-LFBGA | 400-VFBGA (17x17) | M2S010 | MICROSEMI CORP | Microsemi Corporation | M2S010TS-1VFG400T2 | Microchip Technology | 195 | Tray | , | Active | Active | 40 | 5.8 | Yes | 1.2000 V | 0 to 85 °C | Automotive, AEC-Q100, SmartFusion®2 | e1 | Yes | Tin/Silver/Copper (Sn/Ag/Cu) | 250 | compliant | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | 1 | FPGA - 10K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU11EG-2FFVB1517E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU11 | AMD | 488 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-CSG288 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 288-TFBGA, CSPBGA | YES | 288-CSP (11x11) | 288 | A2F200 | 80 MHz | 200000 | MICROSEMI CORP | Microsemi Corporation | A2F200M3F-CSG288 | 1.575 V | Microchip Technology | 1.425 V | 3 | MCU - 31, FPGA - 78 | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | 11 X 11 MM, 1.05 MM HEIGHT, 0.50 MM PITCH, GREEN, BGA-288 | BGA288,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 5.23 | Yes | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | 0 to 85 °C | SmartFusion® | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | compliant | S-PBGA-B288 | 78 | Not Qualified | 1.5,1.8,2.5,3.3 V | OTHER | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 78 | 4608 CLBS, 200000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | 200000 | 256KB | 11 mm | 11 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-PQG208I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 208-BFQFP | YES | 208-PQFP (28x28) | 208 | A2F200 | 80 MHz | 200000 | MICROSEMI CORP | Microsemi Corporation | A2F200M3F-PQG208I | 1.575 V | Microchip Technology | 1.425 V | 3 | MCU - 22, FPGA - 66 | Tray | PLASTIC/EPOXY | FQFP | FQFP, QFP208,1.2SQ,20 | QFP208,1.2SQ,20 | SQUARE | FLATPACK, FINE PITCH | Active | Active | 30 | 1.51 | Yes | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | -40 to 100 °C | SmartFusion® | Pure Matte Tin (Sn) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | QUAD | GULL WING | 245 | 0.5 mm | compliant | S-PQFP-G208 | 66 | Not Qualified | 1.5,1.8,2.5,3.3 V | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 66 | 4608 CLBS, 200000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | 200000 | 256KB | 28 mm | 28 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU17EG-2FFVB1517I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU17 | AMD | 644 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU17EG-1FFVB1517I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU17 | AMD | 644 | Tray | Active | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4EV-2FBVB900I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU4 | 192,150 | 204 | 0.892 V | AMD | 0.808 V | 204 | Tray | Active | 0.8500 V | Industrial grade | -40 to 100 °C | Zynq® UltraScale+™ MPSoC EV | 900 | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Industrial | 2 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | 175,680 | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-FGG484I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | FPBGA-484 | 484-FPBGA (23x23) | 267 | M2S050 | Microchip Technology / Atmel | 64 kB | 60 | SMARTFUSION2 | - | - | 56340 | Microchip | 166 MHz | Microchip Technology | Yes | Surface Mount | SMD/SMT | 267 | 4695 LAB | 56340 | 56340 LE | 1.26(V) | 1.14(V) | 1.2(V) | -40C to 100C | 100C | -40C | Industrial | Tray | FPBGA | 65nm | Active | Yes | No | Details | This product may require additional documentation to export from the United States. | 0.489749 oz | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | SOC - Systems on a Chip | 484 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | STD | FPGA - 50K Logic Modules | 1 Core | 256KB | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060-1FCSG325 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 325-TFBGA, FCBGA | 325-FCBGA (11x11) | M2S060 | 64 kB | - | - | Miscellaneous | 166 MHz | Microchip Technology | 200 | 56520 LE | Tray | Active | Compliant | 1.2000 V | 0 to 85 °C | SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 60K Logic Modules | 1 Core | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4EG-3SFVC784E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU4 | Schneider | 139743 | 0.927 V | AMD | 0.873 V | 252 | Tray | Active | 0.9000 V | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 3 | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | Threaded | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU7CG-2FBVB900I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU7 | Turck | 0.892 V | AMD | 0.808 V | 204 | Tray | Active | 0.8500 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2 | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-VFG256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | VFPBGA-256 | YES | 256-FPBGA (14x14) | 256 | UL | M2S010 | Microchip Technology / Atmel | Cat 5e | 64 kB | 119 | MICROSEMI CORP | TPE | - | - | Turck | UX07628 | 166 MHz | 1.26 V | + 100 C | Microchip Technology | 1.14 V | - 40 C | Yes | 3 | SMD/SMT | 138 I/O | 1007 LAB | 12084 LE | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA256,16X16,32 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.76 | Details | Yes | 1.26 V | 1.14 V | 1.2 V | 2.5, 3.3 V | -40 to 100 °C | Tray | SmartFusion2 | e1 | RJ45 | Tin/Silver/Copper (Sn/Ag/Cu) | Teal | LG-MIN, WD-MIN | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | Yes | 250 | 0.8 mm | compliant | S-PBGA-B256 | 138 | Not Qualified | 1.2 V | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | STD | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | SoC FPGA | No | 39 Feet | 14 mm |
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M2S025T-FGG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XAZU4EV-L1SFVC784I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010T-1FG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150T-1FCV484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010T-1VF400I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU7EG-1FFVC1156I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S090T-1FGG676I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150-1FCG1152I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010TS-1VFG400T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU11EG-2FFVB1517E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F200M3F-CSG288
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F200M3F-PQG208I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU17EG-2FFVB1517I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU17EG-1FFVB1517I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU4EV-2FBVB900I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S050-FGG484I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060-1FCSG325
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU4EG-3SFVC784E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU7CG-2FBVB900I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010-VFG256I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire