The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Connectivity | Architecture | Number of Inputs | Programmable Logic Type | Primary Attributes | Number of Logic Cells | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No XA7Z030-1FBV484Q | Xilinx Inc. | Datasheet | 2373 |
| Min: 1 Mult: 1 | 10 Weeks | 484-BBGA, FCBGA | YES | 130 | Automotive grade | -40°C~125°C TJ | Tray | 2010 | Automotive, AEC-Q100, Zynq®-7000 XA | Active | 4 (72 Hours) | 484 | EAR99 | 8542.39.00.01 | BOTTOM | BALL | S-PBGA-B484 | 667MHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 125K Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||
 | Mfr Part No XCZU3CG-L2SFVA625E | Xilinx Inc. | Datasheet | 54 | - | Min: 1 Mult: 1 | 11 Weeks | 625-BFBGA, FCBGA | YES | 180 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | 625 | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | R-PBGA-B625 | 0.742V | 0.698V | 533MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||
 | Mfr Part No XCZU6CG-L1FFVB1156I | Xilinx Inc. | Datasheet | 148 | - | Min: 1 Mult: 1 | 11 Weeks | 1156-BBGA, FCBGA | YES | 328 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | R-PBGA-B1156 | 0.742V | 0.698V | 500MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||
 | Mfr Part No 5CSEMA5F31C8N | Intel | Datasheet | 12 | - | Min: 1 Mult: 1 | 8 Weeks | 896-BGA | YES | MCU - 181, FPGA - 288 | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | e1 | Active | 3 (168 Hours) | 896 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | NOT SPECIFIED | 5CSEMA5 | S-PBGA-B896 | 288 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 600MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | 2mm | 31mm | 31mm | RoHS Compliant | |||||||
 | Mfr Part No 10AS066K2F35I1HG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 1152-BBGA, FCBGA | 396 | -40°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FPGA - 660K Logic Elements | RoHS Compliant | ||||||||||||||||||||||||||||||||
 | Mfr Part No 5ASTFD5G3F35I3N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 1152-BBGA, FCBGA | YES | MCU - 208, FPGA - 385 | -40°C~100°C TJ | Tray | Arria V ST | e1 | Active | 3 (168 Hours) | TIN SILVER COPPER | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.15V | 1mm | NOT SPECIFIED | 5ASTFD5 | S-PBGA-B1152 | 1.18V | 1.12V | 1.05GHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | 670MHz | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 462K Logic Elements | 2.7mm | 35mm | 35mm | RoHS Compliant | |||||||||||||
 | Mfr Part No XCZU2EG-2SBVA484E | Xilinx Inc. | Datasheet | 418 | - | Min: 1 Mult: 1 | 11 Weeks | 484-BFBGA, FCBGA | 82 | 0°C~100°C TJ | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | yes | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||
| Mfr Part No XCZU2EG-L2SFVA625E | Xilinx Inc. | Datasheet | 516 | - | Min: 1 Mult: 1 | 11 Weeks | 625-BFBGA, FCBGA | YES | 180 | 0°C~100°C TJ | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 625 | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | R-PBGA-B625 | 0.742V | 0.698V | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||
| Mfr Part No XCZU2EG-2SFVA625E | Xilinx Inc. | Datasheet | 415 | - | Min: 1 Mult: 1 | 11 Weeks | 625-BFBGA, FCBGA | 180 | 0°C~100°C TJ | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | yes | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||||||||||
 | Mfr Part No XCZU5CG-L1SFVC784I | Xilinx Inc. | Datasheet | 373 | - | Min: 1 Mult: 1 | 11 Weeks | 784-BFBGA, FCBGA | YES | 252 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | 784 | IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM) | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | S-PBGA-B784 | 500MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||
| Mfr Part No XCZU7EG-3FFVF1517E | Xilinx Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 11 Weeks | 1517-BBGA, FCBGA | 464 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 600MHz, 667MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||||
| Mfr Part No XCZU4EV-3FBVB900E | Xilinx Inc. | Datasheet | 1080 | - | Min: 1 Mult: 1 | 11 Weeks | 900-BBGA, FCBGA | 204 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | Active | 4 (72 Hours) | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 600MHz, 1.5GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||||||||||||
 | Mfr Part No 10AS016E4F29E3SG | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 780-BBGA, FCBGA | YES | 288 | 0°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 780 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B780 | 288 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 160K Logic Elements | 160000 | 3.35mm | 29mm | 29mm | RoHS Compliant | |||||||||||
| Mfr Part No 5CSEMA6F31I7N | Intel | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | 896-BGA | YES | MCU - 181, FPGA - 288 | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SE | e1 | Active | 3 (168 Hours) | 896 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | NOT SPECIFIED | 5CSEMA6 | S-PBGA-B896 | 288 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 288 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 110K Logic Elements | 110000 | 2mm | 31mm | 31mm | RoHS Compliant | |||||||
 | Mfr Part No 5CSEBA2U19A7N | Intel | Datasheet | 33 |
| Min: 1 Mult: 1 | 8 Weeks | 484-FBGA | YES | MCU - 151, FPGA - 66 | -40°C~125°C TJ | Tray | 2017 | Automotive, AEC-Q100, Cyclone® V SE | Active | 3 (168 Hours) | 484 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | S-PBGA-B484 | 66 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 700MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Elements | 25000 | 1.9mm | 19mm | 19mm | RoHS Compliant | |||||||||||
 | Mfr Part No XCZU9EG-L2FFVC900E | Xilinx Inc. | Datasheet | 369 | - | Min: 1 Mult: 1 | 11 Weeks | 900-BBGA, FCBGA | YES | 204 | 0°C~100°C TJ | Bulk | 2013 | Zynq® UltraScale+™ MPSoC EG | e1 | Active | 4 (72 Hours) | 900 | Tin/Silver/Copper (Sn/Ag/Cu) | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | R-PBGA-B900 | 0.742V | 0.698V | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||
| Mfr Part No XCZU19EG-L2FFVD1760E | Xilinx Inc. | Datasheet | - | - | Min: 1 Mult: 1 | 11 Weeks | 1760-BBGA, FCBGA | YES | 308 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | R-PBGA-B1760 | 0.742V | 0.698V | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | ROHS3 Compliant | |||||||||||||||||||
 | Mfr Part No 10AS066N3F40I2SG | Intel | Datasheet | 400 | - | Min: 1 Mult: 1 | 8 Weeks | 1517-BBGA, FCBGA | YES | 588 | -40°C~100°C TJ | Tray | Arria 10 SX | Active | 3 (168 Hours) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | NOT SPECIFIED | S-PBGA-B1517 | 588 | Not Qualified | 0.93V | 0.9V | 0.87V | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 588 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 660K Logic Elements | 660000 | 3.5mm | 40mm | 40mm | RoHS Compliant | ||||||||||||
| Mfr Part No XCZU2EG-L2SBVA484E | Xilinx Inc. | Datasheet | 549 | - | Min: 1 Mult: 1 | 11 Weeks | 484-BFBGA, FCBGA | YES | 82 | 0°C~100°C TJ | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 484 | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | R-PBGA-B484 | 0.742V | 0.698V | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ROHS3 Compliant | ||||||||||||||||||
| Mfr Part No XCZU2CG-L2SFVA625E | Xilinx Inc. | Datasheet | 227 | - | Min: 1 Mult: 1 | 11 Weeks | 625-BFBGA, FCBGA | YES | 180 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | 625 | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | R-PBGA-B625 | 0.742V | 0.698V | 533MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ROHS3 Compliant |
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XA7Z030-1FBV484Q
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
407.312883
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XCZU3CG-L2SFVA625E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU6CG-L1FFVB1156I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5CSEMA5F31C8N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS066K2F35I1HG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5ASTFD5G3F35I3N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU2EG-2SBVA484E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU2EG-L2SFVA625E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU2EG-2SFVA625E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU5CG-L1SFVC784I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU7EG-3FFVF1517E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU4EV-3FBVB900E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS016E4F29E3SG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5CSEMA6F31I7N
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5CSEBA2U19A7N
Intel
Package:Embedded - System On Chip (SoC)
98.679853
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XCZU9EG-L2FFVC900E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU19EG-L2FFVD1760E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS066N3F40I2SG
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU2EG-L2SBVA484E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU2CG-L2SFVA625E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire