The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Package / Case | Surface Mount | Supplier Device Package | Material | Number of Terminals | Material Type | Approvals | Base Product Number | Brand | Clock Frequency-Max | Data RAM Size | Device Logic Gates | Device Logic Units | Distributed RAM | Embedded Block RAM - EBR | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Number of User I/Os | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Range | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Shipping Restrictions | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | Type | Terminal Finish | Color | Applications | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Current Rating | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Output Type | Operating Supply Voltage | Power Supplies | Temperature Grade | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Protections | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Adhesive | Terminal Type | Product Type | Screening Level | Speed Grade | Legend | Primary Attributes | Number of Registers | Number of CLBs | Number of Logic Cells | Number of Cores | Background Color | Number of Equivalent Gates | Flash Size | Text Color | Language | Connection Type | Product Category | Power Type | Diameter | Length | Width |
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 | Mfr Part No XCZU11EG-L2FFVF1517E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | UR | XCZU11 | 653,100 | Murrelektronik | 4000-70403-0100220 | 464 | 0.892 V | AMD | 0.808 V | Surface Mount | 464 | Tray | Active | No | FCBGA | 0.8500 V | 0 to 110 °C | Zynq® UltraScale+™ MPSoC EG | Black | 1517 | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Extended Industrial | 2L | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | 597,120 | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3CG-L1SFVC784I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | XCZU3 | Cutler Hammer, Div of Eaton Corp | DH365NDKV | 0.892 V | AMD | 0.808 V | 252 | Tray | Active | 0.8500 V | -40 to 100 °C | Zynq® UltraScale+™ MPSoC CG | 500MHz, 1.2GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 1L | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S050-FGG484 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | BGA-484 | 484-FPBGA (23x23) | Polyester | M2S050 | Microchip Technology / Atmel | 64 kB | 1.314 Mbit | 64 kB | 60 | - | - | Brady | 125819 | 166 MHz | 1.26 V | + 85 C | Microchip Technology | 1.14 V | 0 C | Yes | SMD/SMT | 267 I/O | 4695 LAB | 56340 LE | Tray | Active | Details | This product may require additional documentation to export from the United States. | 1.2000 V | 0 to 85 °C | Tray | SmartFusion2 | Warning Signs | SOC - Systems on a Chip | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | STD | Vinyl Chloride May Cause Cancer Authorized Personnel Only | FPGA - 50K Logic Modules | 1 Core | White | 256KB | English | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU19EG-1FFVD1760E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | CE, CSA, UL | XCZU19 | Altech | 3EU30 | AMD | DIN Rail | 308 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 30 A | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | Motor | MCU, FPGA | Screw | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-FGG484 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 484-BGA | YES | 484-FPBGA (23x23) | 484 | A2F200 | 80 MHz | 200000 | MICROSEMI CORP | Cutler Hammer, Div of Eaton Co | E57LBL30T110 | 1.575 V | Microchip Technology | 1.425 V | 3 | MCU - 41, FPGA - 94 | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,26X26,40 | BGA484,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 10 mm | 40 | 1.36 | Yes | 1.575 V | 1.425 V | 1.5 V | 1.5000 V | 0 to 85 °C | SmartFusion® | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | Shielded | 250 | 1 mm | compliant | S-PBGA-B484 | 94 | Not Qualified | NC NPN | 1.5,1.8,2.5,3.3 V | OTHER | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 94 | 4608 CLBS, 200000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 4608 | 200000 | 256KB | Cable Connection | DC | 30 mm | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010T-VFG256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 1 month ago) | 256-LBGA | YES | 256-FPBGA (17x17) | 256 | M2S010 | 64 kB | MICROSEMI CORP | - | - | GE - General Electric | M2S010T-VFG256I | 166 MHz | Microchip Technology | 3 | SMD/SMT | 138 | 12084 LE | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.77 | Non-Compliant | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | -40 to 100 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | LG-MIN, WD-MIN | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 0.8 mm | compliant | S-PBGA-B256 | 138 | Not Qualified | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 138 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | 14 mm | 14 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU5CG-L2FBVB900E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU5 | Johnson Controls | VH7441CS+3801D | AMD | 204 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC CG | 533MHz, 1.3GHz | 256KB | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090TS-FGG676I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 676-BGA | 676-FBGA (27x27) | Plastic | M2S090 | 64 kB | - | - | Brady | 109252 | 166 MHz | Microchip Technology | SMD/SMT | 425 | 86316 LE | Tray | Active | 1.2000 V | -40 to 100 °C | SmartFusion®2 | Pipe & Valve Marking | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | Yes | STD | Hot Water Return | FPGA - 90K Logic Modules | 1 Core | Green | 512KB | White | English | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090-FGG676 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 676-BGA | YES | 676-FBGA (27x27) | 676 | M2S090 | 64 kB | MICROSEMI CORP | - | - | Johnson Controls | VH7441GT+3008E | 166 MHz | Microchip Technology | 3 | 425 | 86316 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.78 | Yes | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | 0 to 85 °C | SmartFusion®2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | S-PBGA-B676 | 425 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | STD | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | 27 mm | 27 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU17EG-2FFVB1517E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) | XCZU17 | AMD | 644 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVE1752-1LLIVSVA1596 | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1596-BFBGA | 1596-BGA (37.5x37.5) | AMD | 500 | Tray | Active | -40°C ~ 100°C (TJ) | Versal™ AI Core | 400MHz, 1GHz | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ AI Core FPGA, 1M Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-FG256 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | MICROSEMI CORP | Microsemi Corporation | A2F060M3E-FG256 | 3 | 85 °C | PLASTIC/EPOXY | LBGA | LBGA, | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | 20 | 5.88 | No | 1.575 V | 1.425 V | 1.5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | CMOS | BOTTOM | BALL | 225 | 1 mm | compliant | S-PBGA-B256 | OTHER | 1536 CLBS, 60000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | 60000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-FG256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 256 | 80 MHz | MICROSEMI CORP | Microsemi Corporation | A2F060M3E-FG256I | 3 | PLASTIC/EPOXY | LBGA | 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY, LOW PROFILE | Obsolete | 20 | 8.76 | No | 1.575 V | 1.425 V | 1.5 V | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | 225 | 1 mm | unknown | S-PBGA-B256 | 66 | Not Qualified | 1.5,1.8,2.5,3.3 V | 66 | 1536 CLBS, 60000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | 1536 | 60000 | 17 mm | 17 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-VFG256I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Production (Last Updated: 2 months ago) | 256-LBGA | 256-FPBGA (17x17) | M2S025 | Microchip Technology / Atmel | 64 kB | 119 | - | - | Microchip | 166 MHz | 1.26 V | + 100 C | Microchip Technology | 1.14 V | - 40 C | Yes | SMD/SMT | 138 I/O | 2308 LAB | 27696 LE | Tray | Active | Non-Compliant | 8542390000 | 1.2000 V | 0.241494 oz | -40 to 100 °C | Tray | SmartFusion2 | SOC - Systems on a Chip | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | SoC FPGA | STD | FPGA - 25K Logic Modules | 1 Core | 256KB | SoC FPGA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-1CSG288I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 288-TFBGA, CSPBGA | 288-CSP (11x11) | A2F200 | 200000 | 1.575 V | Microchip Technology | 1.425 V | MCU - 31, FPGA - 78 | Tray | Active | 1.5000 V | -40 to 100 °C | SmartFusion® | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | 1 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025-FCSG325I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 325-TFBGA, FCBGA | 325-FCBGA (11x11) | M2S025 | 64 kB | - | - | 166 MHz | + 100 C | Microchip Technology | - 40 C | SMD/SMT | 180 | 27696 LE | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 1.2 V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 25K Logic Modules | 1 Core | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-1FGG484T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S060 | Microchip Technology | 267 | Tray | Active | -40°C ~ 125°C (TJ) | Automotive, AEC-Q100, SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 60K Logic Modules | 256KB | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S025TS-1FGG484T2 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | M2S025 | Microchip Technology | 267 | Tray | Active | 1.2000 V | 0 to 85 °C | Automotive, AEC-Q100, SmartFusion®2 | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 1 | FPGA - 25K Logic Modules | 256KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-1TQG144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 144 | MICROSEMI CORP | Microsemi Corporation | A2F060M3E-1TQG144 | 85 °C | PLASTIC/EPOXY | LFQFP | LFQFP, | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | 5.81 | Yes | 1.575 V | 1.425 V | 1.5 V | 8542.39.00.01 | CMOS | QUAD | GULL WING | 0.5 mm | compliant | S-PQFP-G144 | OTHER | 1536 CLBS, 60000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | 60000 | 20 mm | 20 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-TQG144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | YES | 144 | 80 MHz | MICROSEMI CORP | Microsemi Corporation | A2F060M3E-TQG144 | 3 | 85 °C | PLASTIC/EPOXY | LFQFP | LFQFP, QFP144,.87SQ,20 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | 30 | 8.63 | Yes | 1.575 V | 1.425 V | 1.5 V | e3 | PURE MATTE TIN (394) | 8542.39.00.01 | Field Programmable Gate Arrays | CMOS | QUAD | GULL WING | 250 | 0.5 mm | compliant | S-PQFP-G144 | 33 | Not Qualified | 1.5,1.8,2.5,3.3 V | OTHER | 33 | 1536 CLBS, 60000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 1536 | 1536 | 60000 | 20 mm | 20 mm |
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XCZU11EG-L2FFVF1517E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU3CG-L1SFVC784I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S050-FGG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU19EG-1FFVD1760E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F200M3F-FGG484
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S010T-VFG256I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU5CG-L2FBVB900E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090TS-FGG676I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S090-FGG676
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU17EG-2FFVB1517E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVE1752-1LLIVSVA1596
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F060M3E-FG256
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F060M3E-FG256I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025-VFG256I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F200M3F-1CSG288I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025-FCSG325I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060TS-1FGG484T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S025TS-1FGG484T2
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F060M3E-1TQG144
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F060M3E-TQG144
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire