The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Mounting Type | Package / Case | Surface Mount | Mounting Feature | Number of Pins | Shell Material | Supplier Device Package | Housing Material | Insert Material | Number of Terminals | Backshell Material, Plating | Airflow | Base Product Number | Body Orientation | Brand | Contact Classification | Contact Finish Mating | Contact Materials | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temp Range | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Primary Material | Product Depth (mm) | Product Diameter (mm) | Product Status | Rad Hardened | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shell Size / Insert Arrangement | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Termination Method | Tradename | Unit Weight | Voltage Rated | Voltage, Rating | Operating Temperature | Packaging | Series | Size / Dimension | Tolerance | Part Status | Number of Terminations | Termination | Temperature Coefficient | Connector Type | Type | Resistance | Number of Positions | Max Operating Temperature | Min Operating Temperature | Composition | Color | Applications | Gender | Power (Watts) | HTS Code | Capacitance | Fastening Type | Subcategory | Power Rating | Current Rating (Amps) | Technology | Terminal Position | Orientation | Terminal Form | Shielding | Peak Reflow Temperature (Cel) | Ingress Protection | Terminal Pitch | Reach Compliance Code | Current Rating | Frequency | Shell Finish | Shell Size - Insert | JESD-30 Code | Number of Outputs | Qualification Status | Number of Contacts | Contact Gender | Operating Supply Voltage | Failure Rate | Switch Function | Lead Spacing | Power Supplies | Temperature Grade | Interface | Number of Circuits | Number of Ports | Speed | RAM Size | Shell Size, MIL | Lead Style | Core Processor | Throw Configuration | Peripherals | Program Memory Size | Connectivity | Cable Opening | Family | Architecture | Number of Inputs | Seated Height-Max | Programmable Logic Type | Product Type | Bearing Type | Core Architecture | Speed Grade | Number of Transceivers | Primary Attributes | Number of Registers | Shell Plating | Number of Logic Cells | Number of Cores | Flash Size | Features | Product Category | Strain Relief | Product Length (mm) | Height | Height Seated (Max) | Length | Width | Thickness (Max) | Contact Finish Thickness - Mating | Product Height (mm) | Material Flammability Rating | Lead Free | Ratings |
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 | Mfr Part No XCZU6EG-L2FFVC900E | AMD | Datasheet | 645 | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | XCZU6 | Glenair | 204 | Retail Package | Active | 0°C ~ 100°C (TJ) | * | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 2L | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS016C4U19I3SG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Axial | YES | 484 | Axial | 484 | Intel / Altera | - | 1 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS016C4U19I3SG | 1.2 GHz | + 100 C | - 40 C | Yes | SMD/SMT | 192 | 20000 LAB | 160000 LE | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | 964681 | Active | NOT SPECIFIED | 1.96 | Compliant | Yes | 0.93 V | 0.87 V | 0.9 V | Arria 10 SoC | 0.423288 oz | -65°C ~ 175°C | Bulk | Military, MIL-PRF-55182/01, RNC55 | 0.094 Dia x 0.250 L (2.39mm x 6.35mm) | ±0.1% | Active | 2 | ±50ppm/°C | 22.6 kOhms | 100 °C | -40 °C | Metal Film | 0.125W, 1/8W | 8542.39.00.01 | SOC - Systems on a Chip | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | S-PBGA-B484 | 192 | Not Qualified | 1.8 V | P (0.1%) | 0.9 V | INDUSTRIAL | 1.5GHz | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 192 | 3.25 mm | FIELD PROGRAMMABLE GATE ARRAY | SoC FPGA | 3 | 6 Transceiver | FPGA - 160K Logic Elements | 246040 | 160000 | 2 Core | -- | Military, Moisture Resistant, Weldable | SoC FPGA | -- | 19 mm | 19 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB014R24C2E1V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGIB027R29A2E2VR0 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | Non-Compliant | 0°C ~ 100°C (TJ) | Agilex I | 50 mA | Off-Mom | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | SPST | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU4EG-1FBVB900I | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 900-BBGA, FCBGA | 900-FCBGA (31x31) | Plastic | 55.62 CFM | XCZU4 | AMD | 204 | Tray | Active | Compliant | 12 V | -40°C ~ 100°C (TJ) | Box | Zynq® UltraScale+™ MPSoC EG | Wire Leads | 10.2 W | 500MHz, 600MHz, 1.2GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Ball | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | 60 mm | 60 mm | 38 mm | Lead Free | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB012R24C2I1V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-FGG256M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256 | 256-FPBGA (17x17) | A2F500 | MICROSEMI CORP | Microsemi Corporation | A2F500M3G-FGG256M | PEI-Genesis | 3 | MCU - 25, FPGA - 66 | Bulk | Active | Active | 5.81 | Compliant | Yes | -55°C ~ 125°C (TJ) | * | 125 °C | -55 °C | compliant | 80 MHz | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA023R25A2I3E | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No STID337CYCB | STMicroelectronics | Datasheet | - | - | Min: 1 Mult: 1 | 24 | Straight | 24Signal | Beryllium Copper | Cable | -55C to 200C | Not Required(mm) | 49.86(mm) | No | 24-28 | Crimp | 250VDC/200VAC | Circular | PL | 24(POS) | PIN | 1(Port) | MS | Electroless Nickel | No | 53.98(mm) | Not Required(mm) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB023R25A1I1V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | Non-Compliant | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.3M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGID019R18A2E2V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB022R25A2E4F | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount, MLCC | 1206 (3216 Metric) | - | CDR32 | Vishay Vitramon | 624 | Tape & Reel (TR) | Active | 50V | -55°C ~ 125°C | Military, MIL-PRF-55681, CDR32 | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±10% | BX | High Reliability | 0.022 µF | R (0.01%) | - | 1.4GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | - | - | 0.051 (1.30mm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA027R31C2E2VAA | Intel | Datasheet | - | - | Min: 1 Mult: 1 | Surface Mount, MLCC | 0402 (1005 Metric) | - | VJ0402 | Vishay Vitramon | 720 | Tape & Reel (TR) | Active | 50V | -55°C ~ 125°C | VJ HIFREQ | 0.040 L x 0.020 W (1.02mm x 0.51mm) | ±0.25pF | C0G, NP0 | RF, Microwave, High Frequency | 8.2 pF | - | 1.4GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | High Q, Low Loss | - | 0.024 (0.61mm) | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 10AS048H2F34I1HG | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | Free Hanging (In-Line) | 1152-BBGA, FCBGA | - | Aluminum | 1152-FBGA (35x35) | Thermoplastic | - | D38999/26FC | Intel / Altera | Gold | Copper Alloy | - | 24 | INTEL CORP | 2 x 32 kB | 2 x 32 kB | Intel | 10AS048H2F34I1HG | 1.2 GHz | + 100 C | TE Connectivity Deutsch Connectors | - 40 C | Yes | SMD/SMT | 492 | 60000 LAB | 480000 LE | Bulk | 964982 | Active | Metal | Discontinued at Digi-Key | 5.68 | Details | Yes | This product may require additional documentation to export from the United States. | Arria 10 SoC | - | -65°C ~ 200°C | Tray | Military, MIL-DTL-38999 Series III, DTS | Active | Crimp | Plug, Female Sockets | 22 | Silver | Military | Threaded | SOC - Systems on a Chip | 5A | D | Shielded | Environment Resistant | unknown | Nickel | 13-35 | 950 mV | 1.5GHz | 256KB | C | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | SoC FPGA | 24 Transceiver | FPGA - 480K Logic Elements | 2 Core | -- | Self Locking | SoC FPGA | 50.0µin (1.27µm) | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU19EG-2FFVD1760E | AMD | Datasheet | - | - | Min: 1 Mult: 1 | 1760-BBGA, FCBGA | 1760-FCBGA (42.5x42.5) | XCZU19 | AMD | 308 | Tray | Active | 0°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 533MHz, 600MHz, 1.3GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB022R31C2E3VAA | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 720 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.2M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA014R24B2I2V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 768 | Tray | Active | Non-Compliant | -40°C ~ 100°C (TJ) | Agilex F | Right Angle | 12 | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.4M Logic Elements | - | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060T-VFG784 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 784-FBGA | 784-VFBGA (23x23) | + 85 C | Microchip Technology | 0 C | 56500 LE | Tray | Active | 0°C ~ 85°C (TJ) | SmartFusion®2 | 166MHz | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No PIMX8QX6AVLFZAA | NXP | Datasheet | - | - | Min: 1 Mult: 1 | 1206 (3216 Metric) | 1206 | Vishay Dale | Tape & Reel (TR) | Active | -55°C ~ 125°C | TNPU e3 | 0.126 L x 0.063 W (3.20mm x 1.60mm) | ±0.05% | 2 | ±5ppm/°C | 105 Ohms | Thin Film | 0.25W, 1/4W | - | Anti-Sulfur, Automotive AEC-Q200, Moisture Resistant | 0.026 (0.65mm) | AEC-Q200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFA012R24C2I3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 744 | Tray | Active | -40°C ~ 100°C (TJ) | Agilex F | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.2M Logic Elements | - |
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XCZU6EG-L2FFVC900E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
10AS016C4U19I3SG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFB014R24C2E1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGIB027R29A2E2VR0
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU4EG-1FBVB900I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB012R24C2I1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F500M3G-FGG256M
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA023R25A2I3E
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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STID337CYCB
STMicroelectronics
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB023R25A1I1V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGID019R18A2E2V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB022R25A2E4F
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA027R31C2E2VAA
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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10AS048H2F34I1HG
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XCZU19EG-2FFVD1760E
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFB022R31C2E3VAA
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA014R24B2I2V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060T-VFG784
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
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PIMX8QX6AVLFZAA
NXP
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGFA012R24C2I3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire