The category is 'Embedded - System On Chip (SoC)'
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Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Lifecycle Status | Mount | Package / Case | Surface Mount | Supplier Device Package | Material | Housing Material | Weight | Number of Terminals | Base Product Number | Brand | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | If - Forward Current | Ihs Manufacturer | Illuminated | Indicator Color | Indicator Style | Ir - Maximum Reverse Leakage Current | Ir - Reverse Current | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitivity Levels | Mounting Styles | MSL | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part # Aliases | Part Life Cycle Code | Pd - Power Dissipation | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Unit Weight | Voltage-Output 1 | Vz - Zener Voltage | Wavelength/Color Temperature | Zz - Zener Impedance | Operating Temperature | Packaging | Series | JESD-609 Code | Part Status | ECCN Code | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Color | HTS Code | Subcategory | Power Rating | Technology | Terminal Position | Orientation | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Depth | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Termination Style | JESD-30 Code | Number of Outputs | Qualification Status | Actuator Type | Efficiency | Output Voltage | Housing Color | Operating Supply Voltage | Power Supplies | Temperature Grade | Configuration | Speed | RAM Size | Output Current | Core Processor | Number of Poles | Viewing Angle | Peripherals | Program Memory Size | Connectivity | Output Power | Voltage - Output 2 | Architecture | Number of Inputs | Organization | Test Current | Seated Height-Max | Programmable Logic Type | Current - Output 1 | Product Type | Voltage - Output 3 | Illumination Color | Total RAM Bits | Luminous Flux | Design | Number of LEDs | Primary Attributes | Outside Diameter | Current - Output 2 | Zener Current | Number of CLBs | Number of Logic Cells | Number of Cores | Flash Size | Current - Output 3 | Product | Features | Vf - Forward Voltage | Product Category | Shaft Diameter | Height | Length | Width |
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 | Mfr Part No AGIB027R29A1E2VR3 | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Metal | Intel | 1 | Intel | Intel | 720 | Tray | Active | Non-Compliant | 0°C ~ 100°C (TJ) | Tray | Agilex I | Straight | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 2.7M Logic Elements | - | Intel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCZU3EG-1SFVA625I | AMD | Datasheet | 616 | - | Min: 1 Mult: 1 | Panel | 625-BFBGA, FCBGA | 625-FCBGA (21x21) | 230 g | XCZU3 | AMD | 180 | Tray | Active | Compliant | 5 V | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ MPSoC EG | 50 °C | 0 °C | 55 W | 76.2 mm | 3 | 70 % | 12 V | 500MHz, 600MHz, 1.2GHz | 256KB | 6 A | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 55 W | 12 V | MCU, FPGA | 6 A | -12 V | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 500 mA | - | 500 mA | 28.956 mm | 127 mm | 76.2 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S060TS-1VFG784I | Microchip | Datasheet | 2121 |
| Min: 1 Mult: 1 | 784-FBGA | 784-VFBGA (23x23) | Microchip Technology | Tray | Active | -40°C ~ 100°C (TJ) | SmartFusion®2 | 166MHz | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGIB019R18A2E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-1PQ208I | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 208-BFQFP | 208-PQFP (28x28) | A2F200 | TE Connectivity | TE Connectivity | Microchip Technology | MCU - 22, FPGA - 66 | Tray | 3-1191563-0 | Obsolete | Details | -40°C ~ 100°C (TJ) | SmartFusion® | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | Hook-up Wire | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | Hook-up Wire | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S150TS-1FCG1152M | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | 1152-BBGA, FCBGA | YES | 1152-FCBGA (35x35) | 1152 | M2S150 | Glenair | 1 | MICROSEMI CORP | Glenair | M2S150TS-1FCG1152M | Microchip Technology | 4 | 574 | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-1152 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 5.8 | Yes | 1.26 V | 1.14 V | 1.2 V | -55°C ~ 125°C (TJ) | SmartFusion®2 | e1 | 3A001.A.2.C | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | D-Sub Connectors | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | 40 | S-PBGA-B1152 | 574 | Not Qualified | 1.2 V | MILITARY | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | Mixed Contact D-Sub Connectors | FPGA - 150K Logic Modules | 146124 | 512KB | D-Sub Mixed Contact Connectors | 35 mm | 35 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-1TQ144 | Microchip | Datasheet | - | - | Min: 1 Mult: 1 | Obsolete (Last Updated: 2 months ago) | 144-LQFP | YES | 144-TQFP (20x20) | 144 | TE Connectivity | MICROSEMI CORP | TE Connectivity | M2S005-1TQ144 | Microchip Technology | 3 | 84 | 85 °C | Tray | PLASTIC/EPOXY | LFQFP | TQFP-144 | QFP144,.87SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | 7-1617785-8 | Obsolete | Obsolete | 30 | 5.88 | N | No | 1.26 V | 1.14 V | 1.2 V | 0°C ~ 85°C (TJ) | SmartFusion®2 | e0 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | Relays | CMOS | QUAD | GULL WING | 240 | 0.5 mm | not_compliant | S-PQFP-G144 | 84 | Not Qualified | 1.2 V | OTHER | 166MHz | 64KB | ARM® Cortex®-M3 | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 84 | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | Industrial Relays | FPGA - 5K Logic Modules | 6060 | 128KB | Military/Aerospace Relays | Industrial Relays | 20 mm | 20 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS095TL-FCVG484E | Microchip | Datasheet | 1927 |
| Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | Phenolic with Aluminum Insert | TE Connectivity / P&B | - | 25 | White | Line on Top, Side and Skirt | 4 x 32 kB | 16 kB, 4 x 32 kB | TE Connectivity | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | SMD/SMT | MCU - 136, FPGA - 276 | 93000 LE | Tray | 5-1437624-3 | Active | Details | 0.248011 oz | 0°C ~ 100°C | PKES | Cylindrical Knob with Skirt | Black, Silver | Knobs & Dials | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | Knobs & Dials | Fluted | FPGA - 93K Logic Modules | 26 mm | 5 Core | 128kB | Knobs | Top spun aluminum inlay, with skirt | Knobs & Dials | 1/4 in | 15 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS095TL-FCVG484I | Microchip | Datasheet | 2270 |
| Min: 1 Mult: 1 | 484-BFBGA, FCBGA | 484-FCBGA (19x19) | TE Connectivity | - | 4 x 32 kB | 16 kB, 4 x 32 kB | TE Connectivity | 667 MHz, 667 MHz | + 100 C | Microchip Technology | - 40 C | SMD/SMT | MCU - 136, FPGA - 276 | 93000 LE | Tray | Active | -40°C ~ 100°C | PolarFire® | Relays | 1 V | - | 857.6kB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | Industrial Relays | FPGA - 93K Logic Modules | 5 Core | 128kB | Industrial Relays | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS160T-FCVG784I | Microchip | Datasheet | 1858 |
| Min: 1 Mult: 1 | 784-BFBGA, FCBGA | 784-FCBGA (23x23) | Aluminum | Bivar | - | 1 | - | 4 x 32 kB | 16 kB, 4 x 32 kB | BIVAR | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | SMD/SMT | MCU - 136, FPGA - 312 | 161000 LE | Tray | Active | Details | 630 nm | -40°C ~ 100°C | Tube | Coastline C5500 Linear | LED Lighting | 10 W | Black | 1 V | - | 1.4125MB | RISC-V | 35 deg | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | LED Lighting Fixtures | Red | 390 lm | - | FPGA - 161K Logic Modules | 5 Core | 128kB | LED Lighting Fixtures | 24 V | LED Lighting Fixtures | 15.2 mm | 609.6 mm | 21.1 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS250T-FCSG536E | Microchip | Datasheet | 2267 |
| Min: 1 Mult: 1 | FCSG-536 | 536-LFBGA | TE Connectivity | - | 1 | 4 x 32 kB | 16 kB, 4 x 32 kB | TE Connectivity | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | SMD/SMT | 372 I/O | 254000 LE | Tray | FCB-405-0628M | Active | This product may require additional documentation to export from the United States. | 0°C ~ 100°C | Tray | PolarFire™ | Relays | 1 V | - | 2.2MB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | General Purpose Relays | FPGA - 254K Logic Modules | 5 Core | 128kB | General Purpose Relays | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No MPFS025T-1FCSG325E | Microchip | Datasheet | 16 | - | Min: 1 Mult: 1 | 325-TFBGA | 325-BGA (11x11) | Amphenol Commercial Products | - | 15 | 4 x 32 kB | 16 kB, 4 x 32 kB | Amphenol | 667 MHz, 667 MHz | + 100 C | Microchip Technology | 0 C | SMD/SMT | MSL 3 - 168 hours | MCU - 136, FPGA - 108 | 23000 LE | Tray | Active | 0°C ~ 100°C | Tray | - | I/O Connectors | 1 V | - | 230.4KB | RISC-V | DMA, PCI, PWM | - | CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG | MPU, FPGA | I/O Connectors | 1843.2Kbit | FPGA - 23K Logic Modules | 5 Core | 128KB | I/O Connectors | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGFB027R24C3I3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | SOT-23-3 | - | Panjit | 3000 | 50 uA | 50 uA | Panjit | + 150 C | Intel | - 55 C | SMD/SMT | 744 | Tray | 200 mW | Active | Details | 0.000176 oz | 2.4 V | 100 Ohms | -40°C ~ 100°C (TJ) | Reel | ZSM-02TA | Diodes & Rectifiers | Single | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | 5 mA | Zener Diodes | FPGA - 2.7M Logic Elements | 50 uA | - | Zener Diodes | 1 mm | 2.2 mm | 1.35 mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5ASTMD3E3F31I3N | ALTERA | Datasheet | - | - | Min: 1 Mult: 1 | 896-BBGA, FCBGA | YES | 896-FBGA (31x31) | 896 | INTEL CORP | Intel Corporation | 5ASTMD3E3F31I3N | MCU - 208, FPGA - 250 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | End Of Life | NOT SPECIFIED | 5.29 | Non-Compliant | Yes | 1.18 V | 1.12 V | 1.15 V | -40°C ~ 100°C (TJ) | Tray | Arria V ST | e1 | Active | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1 mm | compliant | 5ASTMD3 | S-PBGA-B896 | 540 | INDUSTRIAL | 1.05GHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 540 | 13207 CLBS | 2.7 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 350K Logic Elements | 13207 | 350000 | -- | 31 mm | 31 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No 5CSEBA5U23C6N | ALTERA | Datasheet | 1793 |
| Min: 1 Mult: 1 | 672-FBGA | YES | 672-UBGA (23x23) | 672 | INTEL CORP | Intel Corporation | 5CSEBA5U23C6N | MCU - 181, FPGA - 145 | 85 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA672,28X28,32 | BGA672,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | NOT SPECIFIED | 5.55 | Yes | FPGA - Field Programmable Gate Array Cyclone V SE dual -core ARM Cortex-A9 | 1.13 V | 1.07 V | 1.1 V | 0°C ~ 85°C (TJ) | Tray | Cyclone® V SE | Active | Field Programmable Gate Arrays | CMOS | BOTTOM | BALL | NOT SPECIFIED | 0.8 mm | compliant | 5CSEBA5 | S-PBGA-B672 | 145 | Not Qualified | 1.1,1.2/3.3,2.5 V | OTHER | 925MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 145 | 1.85 mm | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 85K Logic Elements | 85000 | -- | 23 mm | 23 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XQZU1CG-2SFQC784I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Amphenol Aerospace | 1 | Amphenol | Details | This product may require additional documentation to export from the United States. | 38999 | D38999 III | Circular Connectors | Circular MIL Spec Connector | Circular MIL Spec Connector | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XQZU1EG-1SBQA484I | Xilinx | Datasheet | - | - | Min: 1 Mult: 1 | Amphenol Aerospace | 1 | Amphenol | Details | 38999 | D38999 III | Circular Connectors | Circular MIL Spec Connector | Circular MIL Spec Connector | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGID023R18A2E3V | Intel | Datasheet | - | - | Min: 1 Mult: 1 | - | - | Advanced Energy | 1 | Advanced Energy | Intel | 480 | Tray | Active | 0°C ~ 100°C (TJ) | Agilex I | DC-DC Converter | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Non-Isolated DC-DC Converters | FPGA - 2.3M Logic Elements | - | Non-Isolated DC/DC Converters | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XCVM1502-2MLINFVB1369 | AMD | Datasheet | 706 | - | Min: 1 Mult: 1 | AIRPAX | 3 | Not Illuminated | Sensata | AMD | Panel Mount | 478 | Tray | Active | N | Versal™ Prime | Circuit Breakers | Hook Terminal | Toggle | 600MHz, 1.4GHz | 256KB | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | 2 Pole | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | Versal™ Prime FPGA, 1M Logic Cells | - | Circuit Protectors | Circuit Breakers | 32.53 mm | 45.21 mm | 39.67 mm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No AGID019R18A2E3E | Intel | Datasheet | 630 |
| Min: 1 Mult: 1 | - | - | Intel | 480 | Tray | Active | Non-Compliant | 0°C ~ 100°C (TJ) | Agilex I | 1.4GHz | 256KB | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | DMA, WDT | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MPU, FPGA | FPGA - 1.9M Logic Elements | - |
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AGIB027R29A1E2VR3
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCZU3EG-1SFVA625I
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S060TS-1VFG784I
Microchip
Package:Embedded - System On Chip (SoC)
234.113672
-
AGIB019R18A2E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
A2F200M3F-1PQ208I
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S150TS-1FCG1152M
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
M2S005-1TQ144
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
MPFS095TL-FCVG484E
Microchip
Package:Embedded - System On Chip (SoC)
188.201204
-
MPFS095TL-FCVG484I
Microchip
Package:Embedded - System On Chip (SoC)
181.521945
-
MPFS160T-FCVG784I
Microchip
Package:Embedded - System On Chip (SoC)
305.153869
-
MPFS250T-FCSG536E
Microchip
Package:Embedded - System On Chip (SoC)
446.846261
-
MPFS025T-1FCSG325E
Microchip
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
AGFB027R24C3I3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
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5ASTMD3E3F31I3N
ALTERA
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
5CSEBA5U23C6N
ALTERA
Package:Embedded - System On Chip (SoC)
286.126573
-
XQZU1CG-2SFQC784I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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XQZU1EG-1SBQA484I
Xilinx
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGID023R18A2E3V
Intel
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XCVM1502-2MLINFVB1369
AMD
Package:Embedded - System On Chip (SoC)
Price: please inquire
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AGID019R18A2E3E
Intel
Package:Embedded - System On Chip (SoC)
25,712.943881