The category is 'Embedded - System On Chip (SoC)'
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- Series
- Package / Case
- Number of I/Os
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- Core Processor
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- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Architecture | Number of Inputs | Organization | Programmable Logic Type | Core Architecture | Max Frequency | Number of Logic Blocks (LABs) | Primary Attributes | Number of Registers | Number of Logic Cells | Number of Equivalent Gates | Flash Size | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status |
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 | Mfr Part No A2F200M3F-1PQ208I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 208-BFQFP | 208 | 208-PQFP (28x28) | MCU - 22, FPGA - 66 | -40°C~100°C TJ | Tray | 2015 | SmartFusion® | Obsolete | 3 (168 Hours) | 100°C | -40°C | 100MHz | A2F200 | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | ARM | 100MHz | 8 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-PQ208 | Microsemi Corporation | Datasheet | 804 | - | Min: 1 Mult: 1 | 2 Weeks | 208-BFQFP | 208 | 208-PQFP (28x28) | MCU - 22, FPGA - 66 | 0°C~85°C TJ | Tray | 2015 | SmartFusion® | Obsolete | 3 (168 Hours) | 85°C | 0°C | 80MHz | A2F200 | 1.5V | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 1.575V | 1.425V | 80MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | ARM | 100MHz | 8 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 4608 | 256KB | No | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||
| Mfr Part No A2F500M3G-PQ208 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 208-BFQFP | YES | 208 | MCU - 22, FPGA - 66 | 0°C~85°C TJ | Tray | 2015 | SmartFusion® | e0 | Obsolete | 3 (168 Hours) | 208 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | QUAD | GULL WING | 225 | 1.5V | 0.5mm | 80MHz | 20 | A2F500M3G | 1.575V | 1.425V | Ethernet, I2C, SPI, UART, USART | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | Ethernet, I2C, SPI, UART/USART | MCU, FPGA | 11520 CLBS, 500000 GATES | FIELD PROGRAMMABLE GATE ARRAY | ARM | 24 | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 500000 | 512KB | 4.1mm | 28mm | 28mm | Non-RoHS Compliant | |||||||||||||||||||||||
 | Mfr Part No A2F060M3E-FG256M | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256 | 256-FPBGA (17x17) | MCU - 26, FPGA - 66 | -55°C~125°C TJ | Tray | SmartFusion® | Obsolete | 3 (168 Hours) | 125°C | -55°C | 80MHz | A2F060M3E | EBI/EMI, I2C, SPI, UART, USART | 80MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | Non-RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-1FGG256M | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256 | 256-FPBGA (17x17) | MCU - 26, FPGA - 66 | -55°C~125°C TJ | Tray | SmartFusion® | Obsolete | 3 (168 Hours) | 125°C | -55°C | 100MHz | A2F060M3E | EBI/EMI, I2C, SPI, UART, USART | 100MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F060M3E-1FGG256 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 256-LBGA | 256 | 256-FPBGA (17x17) | MCU - 26, FPGA - 66 | 0°C~85°C TJ | Tray | SmartFusion® | Obsolete | 3 (168 Hours) | 85°C | 0°C | 100MHz | A2F060M3E | 1.5V | EBI/EMI, I2C, SPI, UART, USART | 1.575V | 1.425V | 100MHz | 16KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, I2C, SPI, UART/USART | MCU, FPGA | ARM | 100MHz | 8 | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | RoHS Compliant | ||||||||||||||||||||||||||||||||||||
 | Mfr Part No M2S060T-FG484 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BGA | YES | 267 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | NOT SPECIFIED | S-PBGA-B484 | 267 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||||||||||||||
| Mfr Part No M2S060T-1FG484 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BGA | YES | 267 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | NOT SPECIFIED | S-PBGA-B484 | 267 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||||||||||||||
| Mfr Part No M2S090-1FGG484 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Surface Mount | 484-BGA | 484 | 267 | 0°C~85°C TJ | Tray | 2009 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 484 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | 166MHz | NOT SPECIFIED | M2S090 | 267 | Not Qualified | 1.2V | CAN, Ethernet, I2C, SPI, UART, USART, USB | 1.26V | 1.14V | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | ARM | FPGA - 90K Logic Modules | 86316 | 512KB | 2.44mm | 23mm | 23mm | RoHS Compliant | |||||||||||||||||||||
 | Mfr Part No M2S060TS-VFG400I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 400-LFBGA | YES | 207 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 400 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | S-PBGA-B400 | 207 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 207 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | 1.51mm | 17mm | 17mm | RoHS Compliant | |||||||||||||||||||||||
| Mfr Part No M2S050TS-1FG484M | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 484-BGA | YES | 267 | -55°C~125°C TJ | Tray | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 484 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | NOT SPECIFIED | S-PBGA-B484 | 267 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 256KB | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||||||||||||||
| Mfr Part No M2S090T-FGG484I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BGA | YES | 267 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 484 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | NOT SPECIFIED | S-PBGA-B484 | 267 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | 2.44mm | 23mm | 23mm | RoHS Compliant | |||||||||||||||||||||||
| Mfr Part No M2S150TS-FCV484I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BFBGA | YES | 273 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | no | Active | 3 (168 Hours) | 484 | LG-MIN,WD-MIN | 8542.39.00.01 | BOTTOM | BALL | 1.2V | 0.8mm | S-PBGA-B484 | 1.26V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 512KB | 3.15mm | 19mm | 19mm | Non-RoHS Compliant | ||||||||||||||||||||||||||||||
| Mfr Part No M2S090TS-1FGG484M | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 484-BGA | YES | 267 | -55°C~125°C TJ | Tray | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 484 | 3A001.A.2.C | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | NOT SPECIFIED | S-PBGA-B484 | 267 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 267 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | 2.44mm | 23mm | 23mm | RoHS Compliant | |||||||||||||||||||||||
| Mfr Part No A2F500M3G-FGG256M | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 256-LBGA | 256 | MCU - 25, FPGA - 66 | -55°C~125°C TJ | Tray | SmartFusion® | Active | 3 (168 Hours) | 80MHz | A2F500M3G | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 114991684 | Seeed Technology Co., Ltd | Datasheet | - | - | Min: 1 Mult: 1 | 9 Weeks | Module | 48 | -30°C~85°C | Bulk | Sipeed MAIX-I | Active | 1 (Unlimited) | 600MHz | 8MB | RISC-V Dual Core 64bit | DMA, I2S, PWM, WDT | I2C, SPI, UART/USART | MPU | Audio Processor (APU), Neural Network Processor (KPU) | 8MB/16MB/128MB | |||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005S-FG484I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BGA | YES | 209 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | NOT SPECIFIED | S-PBGA-B484 | 209 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 209 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 5K Logic Modules | 6060 | 128KB | 2.44mm | 23mm | 23mm | Non-RoHS Compliant | ||||||||||||||||||||||
 | Mfr Part No M2S050-FCSG325I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 2 weeks ago) | 325-TFBGA, CSPBGA | YES | 200 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | 325 | MATTE TIN | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | NOT SPECIFIED | S-PBGA-B325 | 200 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 200 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 50K Logic Modules | 56340 | 256KB | 1.01mm | 11mm | 11mm | RoHS Compliant | ||||||||||||||||||||||
| Mfr Part No M2S010TS-1VFG400 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | 400-LFBGA | 400-VFBGA (17x17) | 195 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | Active | 3 (168 Hours) | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 10K Logic Modules | 256KB | RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No A2F200M3F-1PQG208I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 208-BFQFP | 208 | 208-PQFP (28x28) | MCU - 22, FPGA - 66 | -40°C~100°C TJ | Tray | 2015 | SmartFusion® | Active | 3 (168 Hours) | 100°C | -40°C | 100MHz | A2F200 | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 100MHz | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | ARM | 100MHz | 8 | ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops | 256KB | RoHS Compliant |
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A2F200M3F-1PQ208I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F200M3F-PQ208
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F500M3G-PQ208
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F060M3E-FG256M
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F060M3E-1FGG256M
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F060M3E-1FGG256
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060T-FG484
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060T-1FG484
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S090-1FGG484
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060TS-VFG400I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S050TS-1FG484M
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S090T-FGG484I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150TS-FCV484I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S090TS-1FGG484M
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F500M3G-FGG256M
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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114991684
Seeed Technology Co., Ltd
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S005S-FG484I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S050-FCSG325I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S010TS-1VFG400
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F200M3F-1PQG208I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire