The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Lifecycle Status | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Speed | RAM Size | Core Processor | Peripherals | Connectivity | Architecture | Number of Inputs | Programmable Logic Type | Core Architecture | Primary Attributes | Number of Logic Cells | Flash Size | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No M2S090S-1FGG484I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 484-BGA | 484-FPBGA (23x23) | 267 | -40°C~100°C TJ | Tray | SmartFusion®2 | Obsolete | 3 (168 Hours) | 100°C | -40°C | 166MHz | M2S090S | CAN, Ethernet, I2C, SPI, UART, USART, USB | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | ARM | FPGA - 90K Logic Modules | 512KB | RoHS Compliant | |||||||||||||||||||||||||||||||
 | Mfr Part No M2S060T-FG676 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 676-BGA | YES | 387 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 676 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | NOT SPECIFIED | S-PBGA-B676 | 387 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 387 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 60K Logic Modules | 56520 | 256KB | 2.44mm | 27mm | 27mm | Non-RoHS Compliant | |||||||||||
 | Mfr Part No M2S090T-FCS325 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 325-TFBGA, CSPBGA | YES | 180 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 325 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | not_compliant | NOT SPECIFIED | R-PBGA-B325 | 180 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 180 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | 1.16mm | 13.5mm | 11mm | Non-RoHS Compliant | ||||||||||
 | Mfr Part No M2S060TS-1FGG676T2 | Microsemi Corporation | Datasheet | 5 | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 676-BGA | 676-FBGA (27x27) | 387 | -40°C~125°C TJ | Tray | Automotive, AEC-Q100, SmartFusion®2 | Active | 3 (168 Hours) | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FPGA - 60K Logic Modules | 256KB | RoHS Compliant | |||||||||||||||||||||||||||||||||||
| Mfr Part No M2S090-1FCS325 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 325-TFBGA, CSPBGA | YES | 180 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 325 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.5mm | not_compliant | NOT SPECIFIED | R-PBGA-B325 | 180 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 180 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | 1.16mm | 13.5mm | 11mm | Non-RoHS Compliant | ||||||||||
 | Mfr Part No M2S150TS-FCG1152 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 1152-BBGA, FCBGA | YES | 574 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e3 | Active | 3 (168 Hours) | MATTE TIN | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | NOT SPECIFIED | S-PBGA-B1152 | 574 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 574 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | 2.9mm | 35mm | 35mm | RoHS Compliant | ||||||||||||||
| Mfr Part No M2S150TS-1FC1152 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 1152-BBGA, FCBGA | YES | 574 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | Tin/Lead (Sn/Pb) | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | NOT SPECIFIED | S-PBGA-B1152 | 574 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 574 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 146124 | 512KB | 2.9mm | 35mm | 35mm | Non-RoHS Compliant | |||||||||||||
| Mfr Part No M2S150TS-1FCVG484I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BFBGA | YES | 273 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | yes | Active | 3 (168 Hours) | 484 | MATTE TIN | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | NOT SPECIFIED | S-PBGA-B484 | 1.26V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 512KB | 3.15mm | 19mm | 19mm | RoHS Compliant | |||||||||||||||
| Mfr Part No M2S150TS-1FCV484 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 484-BFBGA | YES | 273 | 0°C~85°C TJ | Tray | SmartFusion®2 | e0 | no | Active | 3 (168 Hours) | 484 | Tin/Lead (Sn/Pb) | LG-MIN, WD-MIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 0.8mm | not_compliant | NOT SPECIFIED | S-PBGA-B484 | 1.26V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 512KB | 3.15mm | 19mm | 19mm | Non-RoHS Compliant | |||||||||||||||
| Mfr Part No M2S090TS-FG676 | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | 676-BGA | YES | 425 | 0°C~85°C TJ | Tray | 2015 | SmartFusion®2 | e0 | Active | 3 (168 Hours) | 676 | Tin/Lead (Sn/Pb) | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | 1mm | not_compliant | NOT SPECIFIED | S-PBGA-B676 | 425 | Not Qualified | 1.26V | 1.2V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | 425 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 90K Logic Modules | 86316 | 512KB | 2.44mm | 27mm | 27mm | Non-RoHS Compliant | |||||||||||
 | Mfr Part No M2S150TS-1FCSG536I | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | 536-LFBGA, CSPBGA | YES | 293 | -40°C~100°C TJ | Tray | 2015 | SmartFusion®2 | e3 | yes | Active | 3 (168 Hours) | 536 | MATTE TIN | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.2V | NOT SPECIFIED | S-PBGA-B536 | 1.26V | 1.14V | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | CANbus, Ethernet, I2C, SPI, UART/USART, USB | MCU, FPGA | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 150K Logic Modules | 512KB | RoHS Compliant | ||||||||||||||||||||
 | Mfr Part No A2F500M3G-1FGG256M | Microsemi Corporation | Datasheet | - | - | Min: 1 Mult: 1 | 12 Weeks | 256-LBGA | 256 | MCU - 25, FPGA - 66 | -55°C~125°C TJ | Tray | SmartFusion® | Active | 3 (168 Hours) | 8542.39.00.01 | 100MHz | A2F500M3G | EBI/EMI, Ethernet, I2C, SPI, UART, USART | 64KB | ARM® Cortex®-M3 | DMA, POR, WDT | EBI/EMI, Ethernet, I2C, SPI, UART/USART | MCU, FPGA | ARM | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | 512KB | RoHS Compliant | ||||||||||||||||||||||||||||||||
| Mfr Part No BCM3380MIFSBG | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | 2016 | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM43465SAM01 | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | Active | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IB908F-2980 (MOQ) | iBASE Technology | Datasheet | - | - | Min: 1 Mult: 1 | Active | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IB897-I27/I27P (V2.0 ; D-1 STEPPING) | iBASE Technology | Datasheet | - | - | Min: 1 Mult: 1 | Active | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No BCM3384ZCSD01 | Broadcom Limited | Datasheet | - | - | Min: 1 Mult: 1 | Active | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IB905F | iBASE Technology | Datasheet | - | - | Min: 1 Mult: 1 | Active | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IB916AF-7600 | iBASE Technology | Datasheet | - | - | Min: 1 Mult: 1 | Active | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No IB917F-7100 | iBASE Technology | Datasheet | - | - | Min: 1 Mult: 1 | Active | 1 (Unlimited) | ROHS3 Compliant |
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M2S090S-1FGG484I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060T-FG676
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S090T-FCS325
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S060TS-1FGG676T2
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S090-1FCS325
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150TS-FCG1152
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150TS-1FC1152
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150TS-1FCVG484I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150TS-1FCV484
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S090TS-FG676
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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M2S150TS-1FCSG536I
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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A2F500M3G-1FGG256M
Microsemi Corporation
Package:Embedded - System On Chip (SoC)
Price: please inquire
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BCM3380MIFSBG
Broadcom Limited
Package:Embedded - System On Chip (SoC)
Price: please inquire
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BCM43465SAM01
Broadcom Limited
Package:Embedded - System On Chip (SoC)
Price: please inquire
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IB908F-2980 (MOQ)
iBASE Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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IB897-I27/I27P (V2.0 ; D-1 STEPPING)
iBASE Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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BCM3384ZCSD01
Broadcom Limited
Package:Embedded - System On Chip (SoC)
Price: please inquire
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IB905F
iBASE Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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IB916AF-7600
iBASE Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire
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IB917F-7100
iBASE Technology
Package:Embedded - System On Chip (SoC)
Price: please inquire