The category is 'Embedded - System On Chip (SoC)'
- All Manufacturers
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Image | Part Number | Manufacturer | Datasheet | Availability | Pricing(USD) | Quantity | RoHS | Factory Lead Time | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Core | Data RAM Size | Distributed RAM | Factory Pack QuantityFactory Pack Quantity | L1 Cache Data Memory | L1 Cache Instruction Memory | Maximum Clock Frequency | Maximum Operating Temperature | Memory Types | Minimum Operating Temperature | Moisture Sensitive | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | RoHS | Unit Weight | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Program Memory Size | Propagation Delay | Connectivity | Architecture | Data Bus Width | Number of Inputs | Programmable Logic Type | Number of Logic Elements/Cells | Core Architecture | Boundary Scan | Speed Grade | RAM (words) | Primary Attributes | Number of Registers | Number of Logic Cells | Number of Cores | Bus Compatibility | UV Erasable | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 | Mfr Part No XC7Z035-1FBG676I | Xilinx Inc. | Datasheet | 792 |
| Min: 1 Mult: 1 | 10 Weeks | 676-BBGA, FCBGA | YES | 130 | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | 667MHz | NOT SPECIFIED | S-PBGA-B676 | 1.05V | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | ARM | YES | 256000 | Kintex™-7 FPGA, 275K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 2.54mm | 27mm | 27mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z035-1FBG676C | Xilinx Inc. | Datasheet | 792 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 676-BBGA, FCBGA | 130 | 0°C~85°C TJ | Tray | 2010 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 676 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | NOT SPECIFIED | 1V | 667MHz | NOT SPECIFIED | S-PBGA-B676 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 120 ps | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | ARM | YES | 1 | 256000 | Kintex™-7 FPGA, 275K Logic Cells | 343800 | CAN; ETHERNET; I2C; SPI; UART; USB | 2.54mm | 27mm | 27mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No 5CSEBA2U19I7N | Intel | Datasheet | 688 |
| Min: 1 Mult: 1 | 8 Weeks | 484-FBGA | YES | MCU - 151, FPGA - 66 | -40°C~100°C TJ | Tray | 2018 | Cyclone® V SE | Active | 3 (168 Hours) | 484 | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | NOT SPECIFIED | 5CSEBA2 | S-PBGA-B484 | 66 | Not Qualified | 1.13V | 1.11.2/3.32.5V | 1.07V | 800MHz | 64KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 66 | FIELD PROGRAMMABLE GATE ARRAY | FPGA - 25K Logic Elements | 25000 | 1.9mm | 19mm | 19mm | RoHS Compliant | |||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z030-2FBG676E | Xilinx Inc. | Datasheet | 2072 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 676-BBGA, FCBGA | YES | 676 | 130 | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | XC7Z030 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -2 | 256000 | Kintex™-7 FPGA, 125K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 2.54mm | 27mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC7Z010-3CLG225E | Xilinx Inc. | Datasheet | 1791 |
| Min: 1 Mult: 1 | 10 Weeks | 225-LFBGA, CSPBGA | YES | 225 | 86 | 0°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 225 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 866MHz | 30 | XC7Z010 | 1.05V | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -3 | 256000 | Artix™-7 FPGA, 28K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.5mm | 13mm | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC7Z020-3CLG484E | Xilinx Inc. | Datasheet | 396 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 484-LFBGA, CSPBGA | YES | 484 | 130 | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 484 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 866MHz | 30 | XC7Z020 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -3 | 256000 | Artix™-7 FPGA, 85K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.6mm | 19mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No M2S010-TQG144I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | TQFP-144 | ARM Cortex M3 | 64 kB | 400 kbit | 60 | - | - | 166 MHz | + 100 C | - 40 C | Yes | SMD/SMT | 84 I/O | 1007 LAB | 12084 LE | Details | 0.035380 oz | Tray | SmartFusion2 | 1.2 V | 256 kB | 1 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC7Z035-2FFG900E | Xilinx Inc. | Datasheet | 16 | - | Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 900-BBGA, FCBGA | 130 | 0°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 900 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | BOTTOM | BALL | 245 | 1V | 1mm | 800MHz | 30 | S-PBGA-B900 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 100 ps | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | ARM | YES | 2 | Kintex™-7 FPGA, 275K Logic Cells | 343800 | 3.35mm | 31mm | 31mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC7Z010-3CLG400E | Xilinx Inc. | Datasheet | 396 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 400-LFBGA, CSPBGA | YES | 400 | 130 | 0°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 400 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 260 | 1V | 0.8mm | 866MHz | 30 | XC7Z010 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -3 | 256000 | Artix™-7 FPGA, 28K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 1.6mm | 17mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z035-2FFG676E | Xilinx Inc. | Datasheet | 480 | - | Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 676-BBGA, FCBGA | 130 | 0°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | 800MHz | NOT SPECIFIED | S-PBGA-B676 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 110 ps | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | ARM | YES | 2 | Kintex™-7 FPGA, 275K Logic Cells | 343800 | 3.37mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||
 | Mfr Part No XC7Z030-3FBG484E | Xilinx Inc. | Datasheet | 792 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 484-BBGA, FCBGA | YES | 484 | 130 | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 484 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 250 | 1V | 1mm | 1GHz | 30 | XC7Z030 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -3 | 256000 | Kintex™-7 FPGA, 125K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 2.54mm | 23mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z045-1FFG676I | Xilinx Inc. | Datasheet | 778 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 676-BBGA, FCBGA | YES | ROMless | 130 | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | yes | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 667MHz | 30 | XC7Z045 | 676 | S-PBGA-B676 | 1V | 1.05V | 11.8V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -1 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | N | 3.37mm | 27mm | No | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||
| Mfr Part No M2S010-TQG144 | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | TQFP-144 | ARM Cortex M3 | 64 kB | 400 kbit | 60 | - | - | 166 MHz | + 85 C | 0 C | Yes | SMD/SMT | 84 I/O | 1007 LAB | 12084 LE | Details | 0.035380 oz | Tray | SmartFusion2 | 1.2 V | 256 kB | 1 Core | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z035-L2FBG676I | Xilinx Inc. | Datasheet | 792 |
| Min: 1 Mult: 1 | 10 Weeks | 676-BBGA, FCBGA | YES | 130 | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | 800MHz | NOT SPECIFIED | S-PBGA-B676 | 1.05V | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | ARM | YES | 256000 | Kintex™-7 FPGA, 275K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 2.54mm | 27mm | 27mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No M2S005-VFG256I | Atmel (Microchip Technology) | Datasheet | - | - | Min: 1 Mult: 1 | VFPBGA-256 | ARM Cortex M3 | 64 kB | 191 kbit | 119 | - | - | 166 MHz | + 100 C | - 40 C | Yes | SMD/SMT | 161 I/O | 505 LAB | 6060 LE | Details | Tray | SmartFusion2 | 1.2 V | 128 kB | 1 Core | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z045-1FFG900C | Xilinx Inc. | Datasheet | 792 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 900-BBGA, FCBGA | YES | 900 | ROMless | 130 | 0°C~85°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 900 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 667MHz | 30 | XC7Z045 | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 3.3V | 1.2V | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | 190000 | ARM | YES | -1 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 3.35mm | 31mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z035-3FFG676E | Xilinx Inc. | Datasheet | 505 |
| Min: 1 Mult: 1 | 10 Weeks | 676-BBGA, FCBGA | YES | 130 | 0°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1V | 1mm | 800MHz | NOT SPECIFIED | S-PBGA-B676 | 1.05V | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | ARM | YES | 256000 | Kintex™-7 FPGA, 275K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 3.37mm | 27mm | 27mm | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z030-1FFG676C | Xilinx Inc. | Datasheet | 392 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 676-BBGA, FCBGA | YES | 676 | 130 | 0°C~85°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 667MHz | 30 | XC7Z030 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -1 | 256000 | Kintex™-7 FPGA, 125K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 3.24mm | 27mm | No | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z015-2CLG485E | Xilinx Inc. | Datasheet | 396 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 484-LFBGA, CSPBGA | 485 | 130 | 0°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 485 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | 766MHz | NOT SPECIFIED | Not Qualified | 1.05V | 11.8V | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | 256000 | Artix™-7 FPGA, 74K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | N | 1.6mm | 19mm | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||
| Mfr Part No XC7Z045-1FBG676I | Xilinx Inc. | Datasheet | 594 |
| Min: 1 Mult: 1 | 10 Weeks | Copper, Silver, Tin | 676-BBGA, FCBGA | YES | ROMless | 130 | -40°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 3 (168 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | 667MHz | 30 | XC7Z045 | S-PBGA-B676 | 1V | 1.05V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 256KB | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | YES | -1 | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN; ETHERNET; I2C; SPI; UART; USB | 2.54mm | 27mm | No | ROHS3 Compliant |
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XC7Z035-1FBG676I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
752.230285
-
XC7Z035-1FBG676C
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
755.299693
-
5CSEBA2U19I7N
Intel
Package:Embedded - System On Chip (SoC)
810.769506
-
XC7Z030-2FBG676E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
379.893592
-
XC7Z010-3CLG225E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
110.702669
-
XC7Z020-3CLG484E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
33.525185
-
M2S010-TQG144I
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z035-2FFG900E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z010-3CLG400E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
33.678666
-
XC7Z035-2FFG676E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z030-3FBG484E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
163.650302
-
XC7Z045-1FFG676I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
1,911.433090
-
M2S010-TQG144
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z035-L2FBG676I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
682.144264
-
M2S005-VFG256I
Atmel (Microchip Technology)
Package:Embedded - System On Chip (SoC)
Price: please inquire
-
XC7Z045-1FFG900C
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
239.298806
-
XC7Z035-3FFG676E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
2,167.615585
-
XC7Z030-1FFG676C
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
84.163257
-
XC7Z015-2CLG485E
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
43.262528
-
XC7Z045-1FBG676I
Xilinx Inc.
Package:Embedded - System On Chip (SoC)
850.199450